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31. 发明授权

US3632499A Apparatus for varying electroplating current 失效
标题翻译：改变电镀电流的装置
公开(公告)号：US3632499A
公开(公告)日：1972-01-04
申请号：US3632499D
申请日：1969-01-02
申请人： M & T CHEMICALS INC
发明人： CHESSIN HYMAN
IPC分类号： C25D21/00 , C25D17/00 , C25D21/12 , C25F7/00 , C23B5/70
CPC分类号： C25D17/08 , C25D21/12
摘要： In accordance with certain of its aspects, the apparatus of this invention provides for the electrodeposition of metals onto basis materials, with the basis materials, because of diversity in size and shape, exhibiting differing electrical current characteristics requiring various optimum currents, and having a supporting frame and extending laterally therefrom and a work-supporting rack mounted on the arm and extending downwardly therefrom into a treating vessel. A workpiece of particular size and shape is mounted on the work-supporting rack; a calibrated mechanical variator may be mounted on either the lateral arm or the work-supporting rack and is pre-set in accordance with the desired treating current for the particular workpiece being processed. An electrical signaler is established bias to said variator and includes a variable resistance the value of which is determined by the setting of the variator noted above. A variable current source is provided the output of which is determined by the value of the resistance of the electrical signaler. In addition, flow communication means conveys the desired treating current from the current source to the workpiece being processed so that the current passing through the work-supporting rack and the workpiece yields plating current density over the surface of the said workpiece.

32. 发明授权

US3623962A Reducing electrolytic sludge formation 失效
标题翻译：减少电解液形成
公开(公告)号：US3623962A
公开(公告)日：1971-11-30
申请号：US3623962D
申请日：1968-07-31
申请人： NAT STEEL CORP
发明人： BEALE LOUIS C
IPC分类号： C25D3/30 , C25D21/00 , C23B5/58 , C23B5/68
CPC分类号： C25D3/30 , C25D5/003 , C25D21/04
摘要： Method and apparatus for decreasing sludging in a stannous-tin electrolyte used in continuous-strip electroplating by continuous deaeration of the electrolyte which removes gases absorbed when the electrolyte is exposed to ambient atmosphere and by decreasing the opportunity for the electrolyte to absorb oxygen. A barometric leg, or other suitable pressure isolation means, is arranged to separate the path for continuous replenishment of electrolyte into an atmospheric pressure loop and a subatmospheric pressure loop. Desorption performance and efficiency is increased by operation at or below the vapor pressure of the electrolyte at the operating temperature for the system and by use of a vapor condenser on the vacuum side of the deaeration means used. Improved results are obtained by providing an inert gas shield during collection of electrolyte splash-over and carryout from the plating cells and also by injection of an inert gas into the electrolyte after deaeration and prior to exposure of the electrolyte to ambient atmosphere. The inert gas steps operate to reduce the opportunity for oxygen absorption.

33. 发明授权

US11976378B2 Device and method for preventing copper plating of conductor roll 有权
公开(公告)号：US11976378B2
公开(公告)日：2024-05-07
申请号：US17752105
申请日：2022-05-24
申请人： Chongqing JIMAT New Material Technology Co., Ltd.
发明人： Shiwei Zang , Wenqing Liu
IPC分类号： C25D3/38 , C25C1/12 , C25D7/06 , C25D17/10 , C25D21/00
CPC分类号： C25D3/38 , C25C1/12 , C25D7/0657 , C25D17/10 , C25D21/00
摘要： The present invention discloses a device and method for preventing copper plating of a conductor roll in the technical field of manufacturing of copper electroplating films. A conductor roll and an electroplating anode are respectively connected to the negative output end and the positive output end of a first power source, the conductor roll and the electroplating anode electroplate a plating product flowing through plating pool bath after being electrified, and the conductor roll is connected to the positive output end of a second power source and mated with an auxiliary electrode connected to the negative output end of the second power source to realize the electrolysis of the conductor roll so that the conductor roll avoids copper deposition when electroplating the plating product. The present invention can realize the electrolysis of bath near the conductor roll on the premise of completing electroplating by the conductor roll so that the copper electroplating process and the copper electrolyzing process are balanced on the conductor roll to avoid residual copper on the conductor roll so as to improve the copper plating quality of the plating product, and the present invention does not increase the procedure of the electroplating process or affect the implementation of the electroplating process.

34. 发明公开

US20240125001A1 ELECTROPLATING BATH WITH SIDE WALLS ENABLING DRAINAGE OF PLATING SOLUTION, AND ELECTROPLATING PRODUCTION LINE 审中-公开
公开(公告)号：US20240125001A1
公开(公告)日：2024-04-18
申请号：US18505148
申请日：2023-11-09
申请人： CHONGQING JIMAT NEW MATERIAL TECHNOLOGY CO., LTD
发明人： Shiwei ZANG
IPC分类号： C25D17/02 , C25D21/00
CPC分类号： C25D17/02 , C25D21/00
摘要： An electroplating bath includes a bottom plate, and a first side wall and a second side wall arranged oppositely on the bottom plate. The first side wall is provided with a first drainage zone, and the first drainage zone includes a first side plate with a first overflow hole. The second side wall is provided with a second drainage zone, and the second drainage zone includes a second side plate with a second overflow hole. The second side wall is further provided with a plurality of liquid outlet holes communicating with the second drainage zone, and a height of each liquid outlet hole is lower than a height of the first overflow hole and a height of the second overflow hole. The bottom plate is provided with a third drainage zone, and the third drainage zone communicates with the first drainage zone and the second drainage zone.

35. 发明申请

US20220186395A1 HOLDER FOR HOLDING SUBSTRATE AND SYSTEM FOR PLATING 有权
公开(公告)号：US20220186395A1
公开(公告)日：2022-06-16
申请号：US17689312
申请日：2022-03-08
申请人： EBARA CORPORATION
发明人： Shota Moriyama , Matsutaro Miyamoto
IPC分类号： C25D17/08 , C25D21/00
摘要： There is provided a substrate holder for holding a substrate including a first holding member having a first opening portion for exposing a first surface of the substrate, and a second holding member configured to hold the substrate together with the first holding member and having a second opening portion for exposing a second surface of the substrate, wherein the first holding member has at least one first external connection contact, and the second holding member has at least one second external connection contact that is independent of the first external connection contact.

36. 发明授权

US11299817B2 Holder for holding substrate and system for plating 有权
公开(公告)号：US11299817B2
公开(公告)日：2022-04-12
申请号：US16609884
申请日：2018-06-12
申请人： EBARA CORPORATION
发明人： Shota Moriyama , Matsutaro Miyamoto
IPC分类号： C25D17/08 , C25D21/00
摘要： There is provided a substrate holder for holding a substrate including a first holding member having a first opening portion for exposing a first surface of the substrate, and a second holding member configured to hold the substrate together with the first holding member and having a second opening portion for exposing a second surface of the substrate, wherein the first holding member has at least one first external connection contact, and the second holding member has at least one second external connection contact that is independent of the first external connection contact.

37. 发明授权

US10392719B2 Electrolytic treatment apparatus and electrolytic treatment method 有权
公开(公告)号：US10392719B2
公开(公告)日：2019-08-27
申请号：US15362159
申请日：2016-11-28
申请人： TOKYO ELECTRON LIMITED
发明人： Tomohisa Hoshino , Masato Hamada
IPC分类号： C25D21/00 , C25D17/00 , H02J7/00 , C25D5/18 , C25D17/10 , C25D21/12 , C25D3/38 , H02J7/34
摘要： An electrolytic treatment apparatus of the present disclosure includes a common electrode and a counter electrode that are disposed such that the treatment liquid is interposed therebetween. A first wiring and a second wiring are connected to the common electrode, a capacitor is provided in the first wiring. Copper ions are moved to the counter electrode side by forming an electric field in the treatment liquid when the capacitor is charged without connecting the first wiring and the second wiring to each other, and the copper ions moved to the counter electrode side are reduced by applying a voltage between the common electrode and the counter electrode when the capacitor is discharged by connecting the first wiring and the second wiring to each other.

38. 发明授权

US10092933B2 Methods and apparatuses for cleaning electroplating substrate holders 有权
公开(公告)号：US10092933B2
公开(公告)日：2018-10-09
申请号：US13852767
申请日：2013-03-28
申请人： Novellus Systems, Inc.
发明人： Santosh Kumar , Bryan L. Buckalew , Steven T. Mayer , Thomas Ponnuswamy , Chad Michael Hosack , Robert Rash , Lee Peng Chua , David Porter
IPC分类号： B08B3/02 , C25D7/12 , B08B3/04 , H01L21/67 , C25D17/00 , C25D21/00 , C25D21/12
摘要： Disclosed herein are methods of cleaning a lipseal and/or cup bottom of an electroplating device by removing metal deposits accumulated in prior electroplating operations. The methods may include orienting a nozzle such that it is pointed substantially at the inner circular edge of the lipseal and/or cup bottom, and dispensing a stream of cleaning solution from the nozzle such that the stream contacts the inner circular edge of the lipseal and/or cup bottom while they are being rotated, removing metal deposits. In some embodiments, the stream has a velocity component against the rotational direction of the lipseal and/or cup bottom. In some embodiments, the deposits may include a tin/silver alloy. Also disclosed herein are cleaning apparatuses for mounting in electroplating devices and for removing electroplated metal deposits from their lipseals and/or cup bottoms. In some embodiments, the cleaning apparatuses may include a jet nozzle.

39. 发明申请

US20180237936A1 OXIDE COATINGS FOR PROVIDING CORROSION RESISTANCE ON PARTS WITH EDGES AND CONVEX FEATURES 审中-公开
公开(公告)号：US20180237936A1
公开(公告)日：2018-08-23
申请号：US15881305
申请日：2018-01-26
申请人： Apple Inc.
发明人： James A. CURRAN , Aaron D. PATERSON , Brian M. GABLE
IPC分类号： C25D21/00 , C25D11/30 , C25D11/34
CPC分类号： C25D21/00 , C25D11/04 , C25D11/08 , C25D11/12 , C25D11/16 , C25D11/243 , C25D11/246 , C25D11/30 , C25D11/34
摘要： Anodic oxide coatings that provide corrosion resistance to parts having protruding features, such as edges, corners and convex-shaped features, are described. According to some embodiments, the anodic oxide coatings include an inner porous layer and an outer porous layer. The inner layer is adjacent to an underlying metal substrate and is formed under compressive stress anodizing conditions that allow the inner porous layer to be formed generally crack-free. In this way, the inner porous layer acts as a barrier that prevents water or other corrosion-inducing agents from reaching the underlying metal substrate. The outer porous layer can be thicker and harder than the inner porous layer, thereby increasing the overall hardness of the anodic oxide coating.

40. 发明申请

US20180112320A1 ELECTROLYTIC COPPER PLATING BATH COMPOSITIONS AND A METHOD FOR THEIR USE 审中-公开
公开(公告)号：US20180112320A1
公开(公告)日：2018-04-26
申请号：US15567637
申请日：2016-04-20
申请人： Atotech Deutschland GmbH
发明人： Heiko BRUNNER , Dirk ROHDE , Manuel PÖLLETH , Sven RÜCKBROD , Desthree DARWIN , Sandra NIEMANN , Gerhard STEINBERGER
IPC分类号： C25D3/38 , C25D7/00 , C25D21/00
摘要： The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and at least one guanidine compound. The plating bath is particularly useful for plating recessed structures with copper and build-up of copper pillar bump structures.

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