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1. 发明公开

US20230187775A1 CONDUCTIVE FILM, FABRICATION METHOD OF CONDUCTIVE FILM, AND LITHIUM-ION BATTERY (LIB) 审中-公开
公开(公告)号：US20230187775A1
公开(公告)日：2023-06-15
申请号：US17765844
申请日：2021-06-10
申请人： CHONGQING JIMAT NEW MATERIAL TECHNOLOGY CO., LTD.
发明人： Shiwei ZANG , Wenqing LIU
IPC分类号： H01M50/383 , H01M10/0525 , H01M4/66 , H01M4/1395 , H01M4/04 , C23C14/35 , C23C14/20 , C23C14/24
CPC分类号： H01M50/383 , H01M10/0525 , H01M4/667 , H01M4/1395 , H01M4/0426 , H01M4/668 , H01M4/661 , C23C14/35 , C23C14/205 , C23C14/24 , H01M2004/027
摘要： A conductive film, a fabrication method of the conductive film, and a lithium-ion battery (LIB) are provided. The fabrication method includes: S10: selecting a support layer, and plating a first metal layer on upper and lower surfaces of the support layer, respectively; S20: compounding a first film on a surface of one of the first metal layers, and compounding a second film on a surface of the other one of the first metal layers; S30: compounding a third film on surfaces of the first film and the second film, and etching a plurality of circular holes penetrating through the third film and the second film; S40: plating a second metal layer on an outer surface of the third film and an inner wall of the circular hole; S50: fabricating a composite film; and S60: plating a third metal layer on upper and lower surfaces of the composite film.

2. 发明公开

US20240052479A1 METHOD, DEVICE, AND SYSTEM FOR MANUFACTURING COMPOSITE METAL FOIL 审中-公开
公开(公告)号：US20240052479A1
公开(公告)日：2024-02-15
申请号：US18381192
申请日：2023-10-18
申请人： CHONGQING JIMAT NEW MATERIAL TECHNOLOGY CO., LTD
发明人： Shiwei ZANG
IPC分类号： C23C14/56 , C23C14/24 , C23C14/54 , C23C14/52
CPC分类号： C23C14/562 , C23C14/24 , C23C14/541 , C23C14/52
摘要： A method, device, and system for manufacturing a composite metal foil are provided. The device includes: a first-time double-sided coating module and a second-time double-sided coating module arranged at an interval, where the first-time double-sided coating module includes: a first vapor deposition column and a second vapor deposition column arranged oppositely, and an unwinding roller, a first evaporation source, a first set of over rollers, a second evaporation source, and a second set of over rollers arranged sequentially from bottom to top on opposite surfaces of the first vapor deposition column and the second vapor deposition column; and the second-time double-sided coating module includes: a third vapor deposition column, and a first set of cooling rollers, a third evaporation source, a second set of cooling rollers, a fourth evaporation source, and a winding roller arranged sequentially from top to bottom on the third vapor deposition column.

3. 发明申请

US20220282393A1 DEVICE AND METHOD FOR PREVENTING BATH CRYSTALLIZATION OF SQUEEZING COMPONENT OF ELECTROPLATING EQUIPMENT 有权
公开(公告)号：US20220282393A1
公开(公告)日：2022-09-08
申请号：US17752153
申请日：2022-05-24
申请人： Chongqing JIMAT New Material Technology Co., Ltd.
发明人： Shiwei ZANG , Wenqing LIU
IPC分类号： C25D17/02 , C25D21/12
摘要： The present invention discloses a device and method for preventing bath crystallization of a squeezing component of electroplating equipment in the technical field of manufacturing of copper electroplating films. The device comprises a plating tank and a squeezing component located on the discharge end of the plating tank. A non-metallic film is squeezed by the squeezing component after being discharged from the plating tank. A wind cutting device is arranged between the plating tank and the squeezing component for wind cutting of the discharged non-metallic film; and a spraying component is arranged behind the squeezing component for spraying the squeezing component. The method comprises a step of adding a wind cutting device for wind cutting of a non-metallic film to remove bath and a step of adding a spraying component for spraying the squeezing component. In the present invention, the wind cutting device and the spraying component are added specifically to eliminate bath crystallization so as to avoid piercing or concave and convex points of non-metallic films caused by crystallization and fully improve the quality of the plating product.

4. 发明公开

US20230198093A1 SAFE LITHIUM-ION BATTERY (LIB) SEPARATOR, FABRICATION METHOD THEREOF, AND LIB 审中-公开
公开(公告)号：US20230198093A1
公开(公告)日：2023-06-22
申请号：US17766223
申请日：2021-06-10
申请人： CHONGQING JIMAT NEW MATERIAL TECHNOLOGY CO., LTD.
发明人： Shiwei ZANG , Wenqing LIU
IPC分类号： H01M50/403 , H01M10/0525 , H01M50/446 , H01M50/449
CPC分类号： H01M50/403 , H01M10/0525 , H01M50/446 , H01M50/449
摘要： A safe lithium-ion battery (LIB) separator, a fabrication method thereof, and an LIB are provided. The fabrication method includes: S1: preparation of a water-based slurry: mixing a ceramic material, magnesium oxide, conductive carbon black (CB), and a water-based adhesive, and thoroughly stirring to obtain the water-based slurry; S2: fabrication of a first film: adding trans-1,4-polyisoprene, cis-polybutadiene rubber (cis-BR), conductive CB, and a water-soluble salt to a compounding granulator for compounding to prepare a memory material; adding the memory material to a mixed solution of aluminum nitride and ethanol, and conducting stirring, suction filtration, drying and calcination to obtain a solid material; and mixing a high-polymer particle with the solid material, adding a resulting mixed material to a film-blowing machine, blowing into a film, and watering and drying the film to obtain the first film; S3: fabrication of a second film; and S4: fabrication of the LIB separator.

5. 发明申请

US20220282390A1 DEVICE AND METHOD FOR PREVENTING COPPER PLATING OF CONDUCTOR ROLL 有权
公开(公告)号：US20220282390A1
公开(公告)日：2022-09-08
申请号：US17752105
申请日：2022-05-24
申请人： Chongqing JIMAT New Material Technology Co., Ltd.
发明人： Shiwei ZANG , Wenqing LIU
IPC分类号： C25D3/38 , C25D17/10 , C25D21/00
摘要： The present invention discloses a device and method for preventing copper plating of a conductor roll in the technical field of manufacturing of copper electroplating films. A conductor roll and an electroplating anode are respectively connected to the negative output end and the positive output end of a first power source, the conductor roll and the electroplating anode electroplate a plating product flowing through plating pool bath after being electrified, and the conductor roll is connected to the positive output end of a second power source and mated with an auxiliary electrode connected to the negative output end of the second power source to realize the electrolysis of the conductor roll so that the conductor roll avoids copper deposition when electroplating the plating product. The present invention can realize the electrolysis of bath near the conductor roll on the premise of completing electroplating by the conductor roll so that the copper electroplating process and the copper electrolyzing process are balanced on the conductor roll to avoid residual copper on the conductor roll so as to improve the copper plating quality of the plating product, and the present invention does not increase the procedure of the electroplating process or affect the implementation of the electroplating process.

6. 发明公开

US20240229222A9 EVAPORATION MATERIAL DISTRIBUTOR AND VACUUM EVAPORATION DEVICE 审中-公开
公开(公告)号：US20240229222A9
公开(公告)日：2024-07-11
申请号：US18401723
申请日：2024-01-02
申请人： CHONGQING JIMAT NEW MATERIAL TECHNOLOGY CO., LTD.
发明人： Shiwei ZANG
IPC分类号： C23C14/24
CPC分类号： C23C14/24
摘要： An evaporation material distributor and a vacuum evaporation device are provided. The evaporation material distributor includes a material distribution mechanism and a housing, where the material distribution mechanism is provided at a bottom of the housing, and the material distribution mechanism includes a plurality of through holes formed in a middle of a bottom of the material distribution mechanism at intervals along a length direction of the material distribution mechanism; and a plurality of feeding channels respectively provided between the holes and corresponding edges of the material distribution mechanism.

7. 发明公开

US20240199832A1 METHOD AND DEVICE FOR TREATING SURFACE OF POLYMER BASE FILM, AND COATED FILM PRODUCT 审中-公开
公开(公告)号：US20240199832A1
公开(公告)日：2024-06-20
申请号：US18413044
申请日：2024-01-16
申请人： CHONGQING JIMAT NEW MATERIAL TECHNOLOGY CO., LTD.
发明人： Shiwei ZANG
IPC分类号： C08J7/12 , C08J7/043
CPC分类号： C08J7/123 , C08J7/043
摘要： A method and device for treating a surface of a polymer base film and a coated film product are provided. The method includes: arranging a surface modification apparatus at a discharge end of the polymer base film to be coated, such that an active interface is formed on the surface of the polymer base film to produce a chemical bonding reaction with a coating material. The device includes an unwinding roller, a winding roller, and a coating layer deposition zone, where an ultraviolet (UV) radiation apparatus is provided at one or two sides of a polymer base film between the coating layer deposition zone and the unwinding roller. The coated film product includes a polymer base film, a reinforcement layer, and a functional coating layer, where the reinforcement layer is provided to enhance an adhesion force, and is formed through active interfacial chemical bonding.

8. 发明公开

US20240133020A1 EVAPORATION MATERIAL DISTRIBUTOR AND VACUUM EVAPORATION DEVICE 审中-公开
公开(公告)号：US20240133020A1
公开(公告)日：2024-04-25
申请号：US18401723
申请日：2024-01-02
申请人： CHONGQING JIMAT NEW MATERIAL TECHNOLOGY CO., LTD.
发明人： Shiwei ZANG
IPC分类号： C23C14/24
CPC分类号： C23C14/24
摘要： An evaporation material distributor and a vacuum evaporation device are provided. The evaporation material distributor includes a material distribution mechanism and a housing, where the material distribution mechanism is provided at a bottom of the housing, and the material distribution mechanism includes a plurality of through holes formed in a middle of a bottom of the material distribution mechanism at intervals along a length direction of the material distribution mechanism; and a plurality of feeding channels respectively provided between the holes and corresponding edges of the material distribution mechanism.

9. 发明公开

US20240150921A1 CATHODE CONDUCTION MECHANISM AND ELECTROPLATING SYSTEM 审中-公开
公开(公告)号：US20240150921A1
公开(公告)日：2024-05-09
申请号：US18415678
申请日：2024-01-18
申请人： CHONGQING JIMAT NEW MATERIAL TECHNOLOGY CO., LTD
发明人： Shiwei ZANG
IPC分类号： C25D7/06 , C25D17/00
CPC分类号： C25D7/0657 , C25D17/005
摘要： A cathode conduction mechanism and an electroplating system are provided. The cathode conduction mechanism includes a first conductive belt and a first conductive belt assembly, the first conductive belt assembly includes a first belt roll and a second belt roll, and the first conductive belt covering the first belt roll and the second belt roll; and a second conductive belt and a second conductive belt assembly, the second conductive belt assembly includes a third belt roll and a fourth belt roll, and the second conductive belt covering the third belt roll and the fourth belt roll. According to the present disclosure, the lower conductive belt does not pass through the bottom of the electroplating bath to prevent leakage. The upper conductive belt and the lower conductive belt each are only driven by two belt rolls to greatly save a cost.

10. 发明公开

US20240125001A1 ELECTROPLATING BATH WITH SIDE WALLS ENABLING DRAINAGE OF PLATING SOLUTION, AND ELECTROPLATING PRODUCTION LINE 审中-公开
公开(公告)号：US20240125001A1
公开(公告)日：2024-04-18
申请号：US18505148
申请日：2023-11-09
申请人： CHONGQING JIMAT NEW MATERIAL TECHNOLOGY CO., LTD
发明人： Shiwei ZANG
IPC分类号： C25D17/02 , C25D21/00
CPC分类号： C25D17/02 , C25D21/00
摘要： An electroplating bath includes a bottom plate, and a first side wall and a second side wall arranged oppositely on the bottom plate. The first side wall is provided with a first drainage zone, and the first drainage zone includes a first side plate with a first overflow hole. The second side wall is provided with a second drainage zone, and the second drainage zone includes a second side plate with a second overflow hole. The second side wall is further provided with a plurality of liquid outlet holes communicating with the second drainage zone, and a height of each liquid outlet hole is lower than a height of the first overflow hole and a height of the second overflow hole. The bottom plate is provided with a third drainage zone, and the third drainage zone communicates with the first drainage zone and the second drainage zone.

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