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31. 发明授权

US09249940B2 Lighting device and method for producing a lighting device 有权
标题翻译：照明装置及照明装置的制造方法
公开(公告)号：US09249940B2
公开(公告)日：2016-02-02
申请号：US14112942
申请日：2012-04-23
申请人： Martin Reiss , Gerhard Holzapfel , Steffen Strauss
发明人： Martin Reiss , Gerhard Holzapfel , Steffen Strauss
IPC分类号： F21S4/00 , F21V21/00 , F21V31/04 , H05K3/28 , H05K3/34 , F21V23/00 , F21Y101/02 , F21Y103/00 , H05K1/18
CPC分类号： F21S4/20 , F21S4/24 , F21V23/00 , F21V31/04 , F21Y2103/10 , F21Y2115/10 , H05K1/189 , H05K3/284 , H05K3/3405 , H05K2201/10106 , H05K2201/10189 , H05K2203/1476 , Y10T29/49117
摘要： A lighting device may include at least one semiconductor light source cast with at least one first casting compound, wherein at least one region of the lighting device has: at least one connection area, which is electrically connected to the at least one semiconductor light source, and at least one electrical connecting element, which has at least one electrical line, wherein at least one electrical line is connected to an associated connection area and protrudes at one end out of the lighting device, and the at least one connection area and the at least one electrical connecting element are arranged in a cutout in the first casting compound and are cast by means of a second casting compound.
摘要翻译：照明装置可以包括至少一个铸造有至少一个第一铸造化合物的半导体光源，其中所述照明装置的至少一个区域具有：至少一个连接区域，其电连接到所述至少一个半导体光源，以及至少一个电连接元件，其具有至少一个电线，其中至少一个电线连接到相关联的连接区域并且在一端处突出到所述照明装置外部，并且所述至少一个连接区域和所述至少一个连接区域至少一个电连接元件布置在第一铸造化合物的切口中并且通过第二铸造化合物铸造。

32. 发明申请

US20150382477A1 BURNING METHOD 审中-公开
标题翻译：烧伤方法
公开(公告)号：US20150382477A1
公开(公告)日：2015-12-31
申请号：US14742030
申请日：2015-06-17
申请人： Konica Minolta, Inc.
发明人： Sayaka MORITA , Keita SAITO , Dai SUWAMA , Midori SHIMOMURA
IPC分类号： H05K3/12
CPC分类号： H05K3/1283 , H05K3/125 , H05K2203/0143 , H05K2203/0278 , H05K2203/1131 , H05K2203/1476
摘要： There is provided a burning method of burning, on a base member, a precursor in which conductive particles are dispersed in a dispersion medium, and the burning method includes: a first pressurization step of pressurizing the precursor heated to a burning temperature or above; and a second pressurization step of pressurizing, after the first pressurization step, the precursor with a pressurization force higher than a pressurization force in the first pressurization step.
摘要翻译：提供了一种燃烧方法，在基材上燃烧将导电粒子分散在分散介质中的前体，该燃烧方法包括：加热到燃烧温度以上的前体加压的第一加压步骤; 以及第二加压步骤，在第一加压步骤之后，以比第一加压步骤中的加压力更高的加压力对前体进行加压。

33. 发明授权

US09210815B2 Method of manufacturing embedded wiring board 有权
标题翻译：嵌入式布线板的制造方法
公开(公告)号：US09210815B2
公开(公告)日：2015-12-08
申请号：US13474735
申请日：2012-05-18
申请人： Cheng-Po Yu
发明人： Cheng-Po Yu
IPC分类号： H05K3/36 , H05K3/00 , H05K3/46 , H05K3/10
CPC分类号： H05K3/0035 , H05K3/107 , H05K3/465 , H05K2201/0236 , H05K2201/0959 , H05K2201/09845 , H05K2203/1476 , Y10T29/49155
摘要： A manufacturing method of an embedded wiring board is provided. The method includes the following steps. First, an insulation layer and a lower wiring layer are provided, wherein the insulation layer includes a polymeric material. Then, the plural catalyst grains are distributed in the polymeric material. A groove and an engraved pattern are formed on the upper surface. A blind via is formed on a bottom surface of the groove to expose the lower pad. An upper wiring layer is formed in the engraved pattern. Some catalyst grains are exposed and activated in the groove, the engraved pattern and the blind via. A first conductive pillar is formed in the groove. Finally, a second conductive pillar is formed in the blind via.
摘要翻译：提供了一种嵌入式布线板的制造方法。该方法包括以下步骤。首先，提供绝缘层和下布线层，其中绝缘层包括聚合材料。然后，多个催化剂颗粒分布在聚合物材料中。在上表面上形成有凹槽和雕刻图案。在槽的底表面上形成盲孔以露出下垫。上部布线层形成在雕刻图案中。一些催化剂颗粒在凹槽，雕刻图案和盲孔中暴露和活化。第一导电柱形成在凹槽中。最后，在盲通孔中形成第二导电柱。

34. 发明授权

US09192045B2 Printed wiring board and method for manufacturing printed wiring board 有权
标题翻译：印刷电路板及制造印刷线路板的方法
公开(公告)号：US09192045B2
公开(公告)日：2015-11-17
申请号：US14291048
申请日：2014-05-30
申请人： IBIDEN CO., LTD.
发明人： Atsushi Osaki
IPC分类号： H05K1/02 , H05K1/11 , H05K3/00 , H05K3/42 , H05K3/46
CPC分类号： H05K1/115 , H05K1/0251 , H05K3/0038 , H05K3/427 , H05K3/4661 , H05K2201/09854 , H05K2203/1476 , H05K2203/1572 , Y10T29/49165
摘要： A printed wiring board includes an insulative substrate having a penetrating hole, a first conductive layer formed on a first surface of the insulative substrate, a second conductive layer formed on a second surface of the insulative substrate, and a through-hole conductor formed in the penetrating hole through the insulative substrate such that the through-hole conductor is connecting the first conductive layer and second conductive layer. The penetrating hole has a first opening portion formed on a first-surface side of the insulative substrate and a second opening portion formed on a second-surface side of the insulative substrate such that the second opening portion has a depth which is greater than a depth of the first opening portion and the second opening portion has a volume which is greater than a volume of the first opening portion, and the through-hole conductor formed in the second opening portion includes a void portion.
摘要翻译：印刷布线板包括具有贯通孔的绝缘基板，形成在绝缘基板的第一表面上的第一导电层，形成在绝缘基板的第二表面上的第二导电层，和形成在绝缘基板上的通孔导体通孔穿过绝缘基板，使得通孔导体连接第一导电层和第二导电层。所述贯通孔具有形成在所述绝缘基板的第一面侧的第一开口部和形成在所述绝缘基板的第二面侧的第二开口部，使得所述第二开口部的深度大于所述绝缘基板的深度第一开口部分和第二开口部分的体积大于第一开口部分的体积，并且形成在第二开口部分中的通孔导体包括空隙部分。

35. 发明申请

US20150313009A1 THIN-FILM MULTI-LAYER MICRO-WIRE STRUCTURE 有权
标题翻译：薄膜多层微结构
公开(公告)号：US20150313009A1
公开(公告)日：2015-10-29
申请号：US14264499
申请日：2014-04-29
申请人： ROGER G. MARKHAM , Ronald Steven Cok , Yongcai Wang , Mitchell Lawrence Wright
发明人： ROGER G. MARKHAM , Ronald Steven Cok , Yongcai Wang , Mitchell Lawrence Wright
IPC分类号： H05K1/02 , H05K3/10 , H05K3/18 , H01B1/02
CPC分类号： H05K1/0298 , H01B1/02 , H05K1/0293 , H05K1/097 , H05K1/165 , H05K3/103 , H05K3/107 , H05K3/1258 , H05K3/181 , H05K3/246 , H05K3/247 , H05K2201/0317 , H05K2201/0338 , H05K2201/0341 , H05K2201/0344 , H05K2201/0347 , H05K2201/035 , H05K2201/09036 , H05K2201/10098 , H05K2203/1476 , H05K2203/173
摘要： A thin-film multi-layer micro-wire structure includes a substrate and a layer located on the substrate or forming a part of the substrate. One or more micro-channels are located in the layer. Each micro-channel has a width less than or equal to 20 microns. A cured electrically conductive micro-wire is located only within each micro-channel. The micro-wire has a thickness less than or equal to 20 microns, including silver nano-particles, and having a percent ratio of silver that is greater than or equal to 40% by weight. An electrolessly plated layer is located at least partially within each micro-channel between the micro-wire and the layer surface and in electrical contact with the micro-wire. The plated layer has a thickness less than a thickness of the micro-wire so that the micro-wire and plated layer form the thin-film multi-layer micro-wire.
摘要翻译：薄膜多层微线结构包括衬底和位于衬底上或形成衬底的一部分的层。一个或多个微通道位于该层中。每个微通道具有小于或等于20微米的宽度。固化的导电微线仅位于每个微通道内。微线具有小于或等于20微米的厚度，包括银纳米颗粒，并且银的百分比大于或等于40重量％。无电镀层至少部分地位于微线和层表面之间的每个微通道内并与微线电接触。电镀层的厚度小于微线的厚度，使得微线和镀层形成薄膜多层微线。

36. 发明授权

US09095083B2 Manufacturing method for multi-layer circuit board 有权
标题翻译：多层电路板的制造方法
公开(公告)号：US09095083B2
公开(公告)日：2015-07-28
申请号：US14074655
申请日：2013-11-07
申请人： Unimicron Technology Corp.
发明人： Pei-Chang Huang , Cheng-Po Yu , Han-Pei Huang
IPC分类号： B05D5/12 , H05K3/46 , H05K3/00 , H05K3/10 , H05K3/40 , B05D7/00 , H05K3/12 , H05K1/02 , H05K3/24 , H05K1/11 , C23C18/16
CPC分类号： H05K1/0298 , B05D5/12 , B05D7/50 , C23C18/165 , H05K1/0269 , H05K1/111 , H05K3/0038 , H05K3/12 , H05K3/244 , H05K3/40 , H05K3/46 , H05K3/4679 , H05K2203/1476
摘要： A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having a first via penetrating the substrate is provided. Next, a patterned circuit layer is formed on a surface of the substrate by using the first via as an alignment target. The first patterned circuit layer includes a first concentric-circle pattern surrounding the first via. Next, a first stacking layer is formed on the surface. Then, a first through hole penetrating regions where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected on the first stacking layer and the substrate is formed. Next, a second stacking layer is formed on the first stacking layer. Afterward, a second through hole penetrating regions where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected on of the first, the second stacking layers and the substrate is formed.
摘要翻译：多层电路板的制造方法包括以下步骤。首先，提供具有穿过基板的第一通孔的基板。接下来，通过使用第一通孔作为取向对象，在基板的表面上形成图案化电路层。第一图案化电路层包括围绕第一通孔的第一同心圆图案。接下来，在表面上形成第一层叠层。然后，形成从同心圆图案的中心的第一同心圆正交地突出在第一堆叠层和基板上的第一通孔贯穿区域。接着，在第一堆叠层上形成第二层叠层。之后，形成从同心圆图案的中心的第二同心圆正交地突出在第一，第二堆叠层和基板上的第二通孔贯穿区域。

37. 发明授权

US09084379B2 Process for fabricating wiring board 有权
标题翻译：制造布线板的工艺
公开(公告)号：US09084379B2
公开(公告)日：2015-07-14
申请号：US13423578
申请日：2012-03-19
申请人： Tsung-Yuan Chen , Chun-Chien Chen , Cheng-Po Yu
发明人： Tsung-Yuan Chen , Chun-Chien Chen , Cheng-Po Yu
IPC分类号： H01K3/10 , H05K3/00 , H05K3/36 , H05K1/00 , H05K1/14 , H05K3/42 , H05K3/20
CPC分类号： H05K3/428 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/20 , H05K3/205 , H05K2201/09509 , H05K2201/09563 , H05K2201/0969 , H05K2203/0369 , H05K2203/0376 , H05K2203/0384 , H05K2203/0554 , H05K2203/108 , H05K2203/1476 , Y10T29/49124 , Y10T29/49126
摘要： A process for fabricating a wiring board is provided. In the process, a wiring carrying substrate including a carry substrate and a wiring layer is formed. Next, at least one blind via is formed in the wiring carrying substrate. Next, the wiring carrying substrate is laminated to another wiring carrying substrate via an insulation layer. The insulation layer is disposed between the wiring layers of the wiring carrying substrates and full fills the blind via. Next, parts of the carry substrates are removed to expose the insulation layer in the blind via. Next, a conductive pillar connected between the wiring layers is formed. Next, the rest carry substrates are removed.
摘要翻译：提供一种制造布线板的工艺。在该过程中，形成包括携带衬底和布线层的布线承载衬底。接下来，在布线承载基板中形成至少一个盲孔。接下来，通过绝缘层将布线承载基板层叠到另一布线承载基板。绝缘层设置在布线基板的布线层之间，并且完全填充盲孔。接下来，去除部分搬运基板以露出盲孔中的绝缘层。接下来，形成连接在布线层之间的导电柱。接下来，其余的携带衬底被去除。

38. 发明授权

US09084377B2 Integrated circuit package system with mounting features for clearance 有权
标题翻译：集成电路封装系统，具有安装功能，用于间隙
公开(公告)号：US09084377B2
公开(公告)日：2015-07-14
申请号：US11694913
申请日：2007-03-30
申请人： Seng Guan Chow
发明人： Seng Guan Chow
IPC分类号： H05K3/34 , H05K3/28 , H05K1/11 , H05K3/12 , H05K3/40
CPC分类号： H05K3/284 , H01L2224/32225 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2924/19105 , H05K1/111 , H05K3/1216 , H05K3/3442 , H05K3/3452 , H05K3/3463 , H05K3/3484 , H05K3/4007 , H05K2201/035 , H05K2201/0367 , H05K2201/09036 , H05K2201/09072 , H05K2201/10636 , H05K2201/10992 , H05K2203/043 , H05K2203/1476 , Y02P70/611 , Y02P70/613 , Y10T29/49144 , H01L2924/00
摘要： An integrated circuit package system is provided including providing a substrate having a contact pad, forming a first conductor having a first melting point over the contact pad, forming a second conductor having a second melting point over the first conductor with the first melting point higher than the second melting point, and mounting a first device over the second conductor.
摘要翻译：提供了一种集成电路封装系统，包括提供具有接触焊盘的衬底，形成在接触焊盘上具有第一熔点的第一导体，在第一导体上形成具有第二熔点的第二导体，第一熔点高于第二熔点，并且将第一装置安装在第二导体上。

39. 发明申请

US20150177621A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20150177621A1
公开(公告)日：2015-06-25
申请号：US14634527
申请日：2015-02-27
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Jeong Woo LEE , Going Sik Kim
IPC分类号： G03F7/30 , H05K3/46
CPC分类号： G03F7/30 , G03F7/095 , G03F7/2022 , G03F7/2024 , H05K1/0284 , H05K3/28 , H05K3/4673 , H05K2201/0195 , H05K2201/09845 , H05K2201/09881 , H05K2203/0588 , H05K2203/1476
摘要： Disclosed herein is a printed circuit board, including: a base substrate on which a circuit layer is formed; and multi-layer insulating layers formed in a plurality of layers on the base substrate, including the circuit layer, each of the plurality of layers being formed to have a step structure, wherein the multi-layer insulating layer is formed of heterogeneous materials.
摘要翻译：这里公开了一种印刷电路板，包括：基底，其上形成有电路层; 以及在所述基底基板上形成为多层的多层绝缘层，所述多层绝缘层包括所述电路层，所述多层中的每一层形成为具有台阶结构，其中所述多层绝缘层由异质材料形成。

40. 发明申请

US20150157862A1 Cortical Implant System for Brain Stimulation and Recording 有权
标题翻译：脑刺激和记录皮质植入系统
公开(公告)号：US20150157862A1
公开(公告)日：2015-06-11
申请号：US14563778
申请日：2014-12-08
申请人： Second Sight Medical Products, Inc.
发明人： Robert J. Greenberg , Neil H. Talbot , James S. Little
IPC分类号： A61N1/36 , A61N1/05 , A61N1/375 , A61N1/372
CPC分类号： H05K3/282 , A61B5/0006 , A61B5/0478 , A61B5/4836 , A61B5/6868 , A61B2562/0209 , A61B2562/046 , A61B2562/125 , A61N1/0529 , A61N1/0531 , A61N1/0534 , A61N1/3606 , A61N1/36071 , A61N1/36082 , A61N1/36139 , A61N1/375 , A61N1/3752 , A61N1/3754 , H01L23/055 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H05K1/02 , H05K1/0271 , H05K1/028 , H05K1/0281 , H05K1/0306 , H05K1/092 , H05K1/11 , H05K1/111 , H05K1/145 , H05K1/147 , H05K1/189 , H05K3/0044 , H05K3/005 , H05K3/0058 , H05K3/28 , H05K3/321 , H05K3/363 , H05K3/4015 , H05K3/4061 , H05K2201/0245 , H05K2201/053 , H05K2201/055 , H05K2201/09063 , H05K2201/09145 , H05K2201/09163 , H05K2201/097 , H05K2201/09981 , H05K2201/10303 , H05K2201/10318 , H05K2201/10674 , H05K2201/10795 , H05K2201/10931 , H05K2201/2009 , H05K2203/0195 , H05K2203/025 , H05K2203/0278 , H05K2203/0307 , H05K2203/068 , H05K2203/082 , H05K2203/1322 , H05K2203/1327 , H05K2203/1394 , H05K2203/1461 , H05K2203/1476 , H05K2203/162 , H05K2203/304 , H01L2924/00014 , H01L2924/00
摘要： The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.
摘要翻译：本发明包括具有至少一个封装的可植入装置，该封装装置容纳通过连接到至少一个封装件的至少一个线圈从外部系统发送和接收数据或信号并可选地供电的电子装置，并处理数据，包括记录的神经活动，并且通过连接到所述至少一个包装的多个电极的至少一个阵列将电脉冲递送给神经组织。该器件适用于电皮质（ECoG）和局部场电位（LFP）信号。大脑刺激器，优选深部脑刺激器，在闭合反馈环路中响应于神经记录而刺激大脑。该装置有利于为神经障碍如慢性疼痛，创伤后应激障碍（PTSD），主要抑郁症或类似疾病提供神经调节疗法。本发明及其组分旨在安装在头部，或者在头颅或硬脑膜上，或在脑中或脑中。

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