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31. 发明授权

US09089057B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US09089057B2
公开(公告)日：2015-07-21
申请号：US13891620
申请日：2013-05-10
申请人： Panasonic Corporation
发明人： Kohei Masuda , Osamu Shibata , Yoshiyuki Saito
IPC分类号： H05K7/02 , H05K7/04 , H05K1/02 , H05K1/14
CPC分类号： H05K1/0218 , H05K1/025 , H05K1/0277 , H05K1/0281 , H05K1/14 , H05K1/147 , H05K2201/10189 , H05K2201/10356 , H05K2201/10371 , H05K2201/2009 , H05K2201/2036
摘要： An electronic device includes a conductor plate, a circuit board placed with a distance to a surface of the conductor plate, a connector provided on the circuit board, a flexible cable having one end connected to the connector and laid down along the surface of the conductor plate, and a cable holding member which includes a sloped holding surface for holding at least part of a portion of the flexible cable ranging from the connector to the surface of the conductor plate and which is electrically connected to the conductor plate.
摘要翻译：电子设备包括导体板，与导体板的表面一定距离放置的电路板，设置在电路板上的连接器，柔性电缆，其一端连接到连接器并沿着导体的表面放置板和电缆保持构件，其包括倾斜的保持表面，用于将柔性电缆的至少一部分从连接器保持到导体板的表面，并且电连接到导体板。

32. 发明授权

US09072192B2 Composite flexible circuit planar cable 有权
标题翻译：复合柔性电路平面电缆
公开(公告)号：US09072192B2
公开(公告)日：2015-06-30
申请号：US13563989
申请日：2012-08-01
申请人： Gwun-Jin Lin , Kuo-Fu Su
发明人： Gwun-Jin Lin , Kuo-Fu Su
IPC分类号： H01B7/08 , H05K1/14 , H01R12/62 , H05K1/02
CPC分类号： H05K1/148 , H01R12/62 , H05K1/0219 , H05K2201/0715 , H05K2201/09245 , H05K2201/10356
摘要： A composite flexible circuit planar cable includes a flat cable, a first section, and a second section. The flat cable includes a plurality of straight line like parallel and non-jumping conductor lines. At least one jumping line is formed on the first section to interchangeably connect a selected conductive line of the first section to an another selected conductive line. The second section may also form at least one jumping line to interchangeably connect a selected conductive line of the second section to an another selected conductive line. Through such a jumping line, electrical connection can be formed between signal terminals and corresponding and interchanged signal terminals. The plurality of conductor lines of the flat cable includes at least a pair of differential signal conductor lines, a grounding line, and a power line.
摘要翻译：复合柔性电路平面电缆包括扁平电缆，第一部分和第二部分。扁平电缆包括多条直线，如平行和非跳跃导体线。在第一部分上形成至少一条跳线，以将第一部分的所选择的导线互换连接到另一选定的导线上。第二部分还可以形成至少一个跳线，以将第二部分的所选择的导线互换地连接到另一选定的导线。通过这样的跳线，可以在信号端子与对应和互换的信号端子之间形成电连接。扁平电缆的多条导线包括至少一对差分信号导体线，接地线和电力线。

33. 发明申请

US20150084201A1 IMPRINTED MICRO-WIRE CIRCUIT MULTI-LEVEL STAMP METHOD 有权
标题翻译：显影微电路多层压印方法
公开(公告)号：US20150084201A1
公开(公告)日：2015-03-26
申请号：US14032250
申请日：2013-09-20
申请人： RONALD STEVEN COK
发明人： RONALD STEVEN COK
IPC分类号： H01L23/538 , H01L21/768
CPC分类号： G02B6/122 , G02B6/13 , G02B6/138 , G02B6/4214 , G02B6/4274 , G02B2006/121 , G02B2006/12104 , G02B2006/12126 , G02B2006/12147 , G06F3/044 , H01L21/76895 , H01L23/5386 , H01L31/12 , H01L31/18 , H01L2924/0002 , H05K1/0274 , H05K3/10 , H05K3/101 , H05K3/1258 , H05K3/32 , H05K2201/0108 , H05K2201/09036 , H05K2201/10356 , H05K2203/0108 , H01L2924/00
摘要： A method of making a multi-level micro-wire structure includes imprinting first micro-channels in a curable first layer over a substrate, curing the first layer, and locating and curing a curable conductive ink in the first micro-channels to form first micro-wires. Multi-level second micro-channels are imprinted in a curable second layer in contact with the first layer with a multi-level stamp, the second layer is cured, and a curable conductive ink is located and cured in the multi-level second micro-channels to form multi-level second micro-wires. At least one of the multi-level second micro-channels contacts at least one first micro-wire. A multi-level second micro-wire in at least one of the multi-level second micro-channels is in electrical contact with at least one first micro-wire.
摘要翻译：制造多级微线结构的方法包括在基板上的可固化的第一层中印刷第一微通道，固化第一层，以及定位和固化第一微通道中的可固化导电油墨以形成第一微通道电线。多级第二微通道印刷在与第一层接触的可固化第二层中，其具有多级印模，第二层被固化，并且可固化导电油墨在多级第二微孔中定位和固化，通道形成多级第二微线。多级第二微通道中的至少一个接触至少一个第一微线。至少一个多级第二微通道中的多级第二微线与至少一个第一微线电接触。

34. 发明申请

US20150036302A1 LONG-TERM PACKAGING FOR THE PROTECTION OF IMPLANT ELECTRONICS 有权
标题翻译：用于保护植入电子的长期包装
公开(公告)号：US20150036302A1
公开(公告)日：2015-02-05
申请号：US14142180
申请日：2013-12-27
申请人： California Institute of Technology
发明人： Yu-Chong Tai , Han-Chieh Chang
IPC分类号： H05K5/06 , H05K3/40 , H05K1/11
CPC分类号： H05K3/4038 , A61F9/0017 , H01L23/3135 , H01L2224/73204 , H01L2924/0002 , H05K1/032 , H05K3/0041 , H05K3/281 , H05K3/282 , H05K3/284 , H05K3/285 , H05K3/381 , H05K2201/017 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10075 , H05K2201/10083 , H05K2201/10287 , H05K2201/10356 , H05K2203/0139 , H05K2203/0514 , H05K2203/1316 , H05K2203/1322 , H05K2203/1338 , Y10T29/49165 , H01L2924/00
摘要： The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.
摘要翻译：本发明提供一种微封装装置，包括：用于固定装置的基板; 附着在所述基板上的腐蚀屏障; 可选地，至少一个馈通设置在所述衬底中，以允许至少一个输入和/或至少一个输出线进入所述微封装装置; 以及被配置为封装所述微封装设备的封装材料层。

35. 发明申请

US20150035433A1 VEHICLE ACCESSORY CONTROL ARRANGEMENT 有权
标题翻译：车辆附件控制装置
公开(公告)号：US20150035433A1
公开(公告)日：2015-02-05
申请号：US14168036
申请日：2014-01-30
申请人： UUSI, LLC d/b/a NARTRON
发明人： David W. SHANK , John M. WASHELESKI , Edward J. COX, II
IPC分类号： B60R16/02 , B60Q3/00 , H05B33/08 , H05K1/02
CPC分类号： H05B33/0803 , H05B33/086 , H05K1/02 , H05K1/117 , H05K1/142 , H05K1/16 , H05K2201/09027 , H05K2201/09045 , H05K2201/09081 , H05K2201/09154 , H05K2201/09163 , H05K2201/097 , H05K2201/09709 , H05K2201/0979 , H05K2201/0999 , H05K2201/10053 , H05K2201/10356
摘要： An illustrative inventory of vehicle accessory control components includes a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards each have a substrate with a plurality of circuit elements supported on the substrate. The first circuit board substrates have an overall perimeter shape including an outer edge profile and a plurality of first deviations from the outer edge profile. The second circuit boards each have a substrate with a plurality of circuit elements supported on them. The second circuit board substrates have the overall perimeter shape including the same outer edge profile as the first circuit board substrates. The second circuit board substrates include a plurality of second deviations from the outer edge profile. At least one portion of the second deviations is different than the first deviations of the first circuit boards.
摘要翻译：车辆附件控制部件的说明性库存包括多个第一电路板和多个第二电路板。第一电路板各自具有支撑在基板上的多个电路元件的基板。第一电路板基板具有包括外缘轮廓和从外边缘轮廓的多个第一偏离的总体周边形状。第二电路板各自具有支撑在它们上的多个电路元件的基板。第二电路板基板具有包括与第一电路板基板相同的外边缘轮廓的整体周边形状。第二电路板基板包括与外边缘轮廓的多个第二偏差。第二偏差的至少一部分不同于第一电路板的第一偏差。

36. 发明申请

US20150002358A1 RADIO COMMUNICATION MODULE 审中-公开
标题翻译：无线电通信模块
公开(公告)号：US20150002358A1
公开(公告)日：2015-01-01
申请号：US14317578
申请日：2014-06-27
申请人： SAMSUNG ELECTRO-MECHANICS CO.. LTD.
发明人： Hee Sun OH , Hee Jun PARK , Gye Won LEE , Jong Yun KIM
IPC分类号： H01Q1/52
CPC分类号： H01Q1/526 , H01Q1/103 , H01Q1/243 , H01R13/6277 , H01R13/6395 , H01R24/52 , H01R2201/02 , H05K1/0216 , H05K1/0243 , H05K2201/10098 , H05K2201/10189 , H05K2201/10356 , H05K2201/10371 , H05K2201/10598
摘要： Embodiments of the invention provide a radio communication module, including a printed circuit board including a receiving connector, a shield can provided on the printed circuit board and configured to shield an electromagnetic wave, and an antenna including a transmitting connector connected to the receiving connector and connected to the printed circuit board through the transmitting connector. The shield can includes a blocking part formed at one side surface thereof and protruding toward the transmitting connector and the receiving connector.
摘要翻译：本发明的实施例提供了一种无线通信模块，包括：印刷电路板，包括接收连接器，设置在印刷电路板上并被配置为屏蔽电磁波的屏蔽壳;以及天线，包括连接到接收连接器的发送连接器和通过发送连接器连接到印刷电路板。屏蔽件可以包括形成在其一个侧表面处并朝向传输连接器和接收连接器突出的阻挡部分。

37. 发明授权

US08920199B2 Patch cord having a plug with differential transmission lines 有权
标题翻译：具有带差动传输线的插头的跳线
公开(公告)号：US08920199B2
公开(公告)日：2014-12-30
申请号：US13802882
申请日：2013-03-14
申请人： CommScope, Inc. of North Carolina
发明人： Richard A. Schumacher , Amid I. Hashim , Brian J. Fitzpatrick , Bryan S. Moffitt , Wayne D. Larsen
IPC分类号： H01R24/00 , H01R24/64 , H05K1/11 , H01R13/6469 , H01R13/6466 , H05K1/02 , H01R13/66 , H01R12/53 , H01R24/28 , H05K1/16
CPC分类号： H01R13/6469 , H01R12/53 , H01R13/6461 , H01R13/6466 , H01R13/6658 , H01R23/005 , H01R24/28 , H01R24/64 , H01R2107/00 , H01R2201/04 , H05K1/0228 , H05K1/0245 , H05K1/117 , H05K1/162 , H05K2201/09181 , H05K2201/0949 , H05K2201/1034 , H05K2201/10356
摘要： Patch cords are provided that include a communications cable that has at least first through fourth conductors and a plug that is attached to the cable. The plug includes a housing that receives the cable, a printed circuit board, first through fourth plug contacts, and first through fourth conductive paths that connect the first through fourth conductors to the respective first through fourth plug contacts. The first and second conductors, conductive paths, and plug contacts form a first differential transmission line, and the third and fourth conductors, conductive paths, and plug contacts form a second differential transmission line. Each of the first through fourth plug contacts has a first segment that extends longitudinally along a first surface of the printed circuit board, and the signal current injection point into the first segment of at least some of the first through fourth plug contacts is into middle portions of their respective first segments.
摘要翻译：提供了包括至少具有第一至第四导体的通信电缆和附接到电缆的插头的跳线。插头包括容纳电缆的外壳，印刷电路板，第一至第四插头触头以及将第一至第四导体连接到相应的第一至第四插头触头的第一至第四导电路径。第一和第二导体，导电路径和插头触点形成第一差分传输线，并且第三和第四导体，导电路径和插头触点形成第二差分传输线。第一至第四插头触点中的每一个具有沿着印刷电路板的第一表面纵向延伸的第一段，并且进入第一至第四插头触点中的至少一些的第一段的信号电流注入点进入中间部分的各自的第一部分。

38. 发明授权

US08915756B2 Communication connector having a printed circuit board with thin conductive layers 有权
标题翻译：通信连接器具有具有薄导电层的印刷电路板
公开(公告)号：US08915756B2
公开(公告)日：2014-12-23
申请号：US13802844
申请日：2013-03-14
申请人： CommScope, Inc. of North Carolina
发明人： Richard A. Schumacher , Ryan E. Enge , Wayne D. Larsen , Bryan S. Moffitt , Julian Pharney
IPC分类号： H01R24/00 , H01R13/6473 , H01R13/6461 , H01R13/6466 , H01R24/64
CPC分类号： H01R13/6473 , H01R13/6461 , H01R13/6466 , H01R24/64 , H05K1/0219 , H05K1/0228 , H05K1/024 , H05K1/0245 , H05K1/117 , H05K2201/0187 , H05K2201/0191 , H05K2201/09672 , H05K2201/09727 , H05K2201/09781 , H05K2201/1034 , H05K2201/10356
摘要： Communications connectors include a housing and a printed circuit board that is at least partially mounted in the housing that has a plurality of conductive paths that are arranged in pairs to form a plurality of differential transmission lines. These connectors further include a plurality of contacts, each of which is electrically connected to a respective one of the conductive paths of the printed circuit board. The printed circuit board further includes at least a first floating image plane that is located between a top surface and a bottom surface thereof, the floating image plane being electrically isolated from the plurality of conductive paths.
摘要翻译：通信连接器包括壳体和印刷电路板，其至少部分地安装在壳体中，该壳体具有成对布置成多个导电路径以形成多个差动传输线。这些连接器还包括多个触点，每个触点电连接到印刷电路板的相应一个导电路径。印刷电路板还包括位于其顶表面和底表面之间的至少第一浮动图像平面，浮动图像平面与多个导电路径电隔离。

39. 发明授权

US08895865B2 Conductive connections allowing XYZ translation 有权
标题翻译：导电连接允许XYZ平移
公开(公告)号：US08895865B2
公开(公告)日：2014-11-25
申请号：US13607317
申请日：2012-09-07
申请人： Conor P. Lenahan , Taylor H. Gilbert
发明人： Conor P. Lenahan , Taylor H. Gilbert
IPC分类号： H05K1/00
CPC分类号： H05K3/361 , H05K1/0215 , H05K2201/10356
摘要： The embodiments relates generally to the use of conductive connections for electrically grounding a series of conductive substrates. More specifically the embodiments teach configurations of conductive connections that do not overly constrain relative motion between the connected conductive substrates. Conductive pressure sensitive adhesive is used to attach opposing ends of the conductive connectors to the conductive substrates. A substrate portion of the conductive connectors is scored by a cutting device such as a die cutter to reduce rigidity of the substrate portion.
摘要翻译：实施例一般涉及使用导电连接来使一系列导电基板电接地。更具体地，实施例教导不会过度约束连接的导电衬底之间的相对运动的导电连接的构造。导电压敏粘合剂用于将导电连接器的相对端附接到导电基板。导电连接器的基板部分通过诸如模切机的切割装置进行刻痕，以降低基板部分的刚性。

40. 发明申请

US20140285990A1 CIRCUIT BOARD FOR CONNECTING SECONDARY BATTERY 审中-公开
标题翻译：用于连接二次电池的电路板
公开(公告)号：US20140285990A1
公开(公告)日：2014-09-25
申请号：US14225098
申请日：2014-03-25
申请人： Samsung SDI Co., Ltd.
发明人： Hyung-Sin Kim , Ji-Yeon Choi , Seok-Bong Lee , Sang-Joo Lee
IPC分类号： H01M2/10 , H05K1/18
CPC分类号： H05K1/181 , H01M10/425 , H05K1/0295 , H05K1/111 , H05K3/244 , H05K3/3421 , H05K2201/09954 , H05K2201/10356 , H05K2203/304 , Y02P70/611
摘要： A circuit board for connecting a secondary battery including a first insulation layer, a conductive layer positioned on one surface of the first insulation layer, and a pad layer positioned on the conductive layer and divided into at least two areas is disclosed. In the circuit board, the conductive layer has an area wider than that of the pad layer. Accordingly, the conductive layer has an area wider than that of the pad layer, so that it is possible to miniaturize the circuit board and to improve the safety of the circuit board.
摘要翻译：公开了一种用于连接包括第一绝缘层，位于第一绝缘层的一个表面上的导电层和位于导电层上并分成至少两个区域的焊盘层的二次电池的电路板。在电路板中，导电层的面积比衬垫层宽。因此，导电层的面积比焊盘层的面积宽，能够使电路基板小型化，提高电路基板的安全性。

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