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1. 发明授权

US08895865B2 Conductive connections allowing XYZ translation 有权
标题翻译：导电连接允许XYZ平移
公开(公告)号：US08895865B2
公开(公告)日：2014-11-25
申请号：US13607317
申请日：2012-09-07
申请人： Conor P. Lenahan , Taylor H. Gilbert
发明人： Conor P. Lenahan , Taylor H. Gilbert
IPC分类号： H05K1/00
CPC分类号： H05K3/361 , H05K1/0215 , H05K2201/10356
摘要： The embodiments relates generally to the use of conductive connections for electrically grounding a series of conductive substrates. More specifically the embodiments teach configurations of conductive connections that do not overly constrain relative motion between the connected conductive substrates. Conductive pressure sensitive adhesive is used to attach opposing ends of the conductive connectors to the conductive substrates. A substrate portion of the conductive connectors is scored by a cutting device such as a die cutter to reduce rigidity of the substrate portion.
摘要翻译：实施例一般涉及使用导电连接来使一系列导电基板电接地。更具体地，实施例教导不会过度约束连接的导电衬底之间的相对运动的导电连接的构造。导电压敏粘合剂用于将导电连接器的相对端附接到导电基板。导电连接器的基板部分通过诸如模切机的切割装置进行刻痕，以降低基板部分的刚性。

2. 发明申请

US20140073152A1 CONDUCTIVE CONNECTIONS ALLOWING XYZ TRANSLATION 有权
标题翻译：导向连接允许XYZ翻译
公开(公告)号：US20140073152A1
公开(公告)日：2014-03-13
申请号：US13607317
申请日：2012-09-07
申请人： Conor P. Lenahan , Taylor H. Gilbert
发明人： Conor P. Lenahan , Taylor H. Gilbert
IPC分类号： H01R4/58 , H05K3/36
CPC分类号： H05K3/361 , H05K1/0215 , H05K2201/10356
摘要： The embodiments relates generally to the use of conductive connections for electrically grounding a series of conductive substrates. More specifically the embodiments teach configurations of conductive connections that do not overly constrain relative motion between the connected conductive substrates. Conductive pressure sensitive adhesive is used to attach opposing ends of the conductive connectors to the conductive substrates. A substrate portion of the conductive connectors is scored by a cutting device such as a die cutter to reduce rigidity of the substrate portion.
摘要翻译：实施例一般涉及使用导电连接来使一系列导电基板电接地。更具体地，实施例教导不会过度约束连接的导电衬底之间的相对运动的导电连接的构造。导电压敏粘合剂用于将导电连接器的相对端附接到导电基板。导电连接器的基板部分通过诸如模切机的切割装置进行刻痕，以降低基板部分的刚性。

3. 发明申请

US20140065851A1 Electrical Connectors With Applicators For Electronic Devices 有权
标题翻译：电子连接器用于电子设备
公开(公告)号：US20140065851A1
公开(公告)日：2014-03-06
申请号：US13601884
申请日：2012-08-31
申请人： Taylor H. Gilbert , Sean S. Corbin
发明人： Taylor H. Gilbert , Sean S. Corbin
IPC分类号： H01R12/52
CPC分类号： H01R12/52 , H01R4/04 , H01R12/00 , H01R12/62 , H01R43/26 , H05K1/00 , H05K3/361 , H05K2201/0281 , H05K2201/0355 , H05K2201/1028 , H05K2201/1034
摘要： Electronic devices may be provided with electronic components and electrical connectors coupled between the electronic components. A connector may be formed in a small gap between the electronic components. The connector may be a thin sheet of flexible conductive material with a conductive adhesive on one surface. The connector may be installed between the components using an applicator that is attached to the connector. The applicator may be a pull-tab liner having a first surface that is tacky and a second opposing surface that is non-stick. The applicator may have an extended portion that can be held by a technician while installing the connector. The connector may be installed by inserting the connector and applicator between the components, pinching the components against the connector and applicator, and removing the applicator by pulling the extended portion to peel the applicator from the connector.
摘要翻译：电子设备可以设置有电子部件和耦合在电子部件之间的电连接器。连接器可以形成在电子部件之间的小间隙中。连接器可以是在一个表面上具有导电粘合剂的柔性导电材料薄片。可以使用附接到连接器的施加器将连接器安装在组件之间。施用器可以是具有粘性的第一表面和不粘的第二相对表面的拉片衬里。涂抹器可以具有在安装连接器的同时由技术人员保持的延伸部分。连接器可以通过将连接器和施加器插入到部件之间，将部件夹持在连接器和施加器上，并且通过拉动延伸部分从连接器剥离施加器来移除施加器来安装。

4. 发明申请

US20140063773A1 Low-Force Gap-Filling Conductive Structures 有权
标题翻译：低能隙填充导电结构
公开(公告)号：US20140063773A1
公开(公告)日：2014-03-06
申请号：US13601542
申请日：2012-08-31
申请人： Taylor H. Gilbert , Derek W. Wright
发明人： Taylor H. Gilbert , Derek W. Wright
IPC分类号： H05K9/00
CPC分类号： G06F1/1656
摘要： Electronic devices may be provided with conductive structures and antennas mounted near a gap between the conductive structures. A conductive member may be used to at least partially fill the gap in order to prevent emission from the antenna from entering the gap and interfering with the operation of the antenna. The conductive gap-filling member may include a conductive outer layer and a non-conductive inner layer. The inner layer may have opposing edge portions that are attached to each other or may be a continuous tubular insulating layer. The outer layer may be a layer of conductive fabric having opposing edge portions that are attached to each other or to opposing edge portions of the inner layer. An edge portion of the outer layer may be attached to a conductive structure. An insulating material may be formed between another edge portion of the outer layer and a second conductive structure.
摘要翻译：电子设备可以设置有导电结构和安装在导电结构之间的间隙附近的天线。可以使用导电构件至少部分填充间隙，以防止天线的发射进入间隙并干扰天线的操作。导电间隙填充构件可以包括导电外层和非导电内层。内层可以具有彼此附接的相对的边缘部分，或者可以是连续的管状绝缘层。外层可以是具有彼此附接或内层的相对边缘部分的相对边缘部分的导电织物层。外层的边缘部分可以附接到导电结构。可以在外层的另一边缘部分和第二导电结构之间形成绝缘材料。

5. 发明授权

US09063700B2 Low-force gap-filling conductive structures 有权
标题翻译：低力填隙导电结构
公开(公告)号：US09063700B2
公开(公告)日：2015-06-23
申请号：US13601542
申请日：2012-08-31
申请人： Taylor H. Gilbert , Derek W. Wright
发明人： Taylor H. Gilbert , Derek W. Wright
IPC分类号： H05K9/00 , G06F1/16
CPC分类号： G06F1/1656
摘要： Electronic devices may be provided with conductive structures and antennas mounted near a gap between the conductive structures. A conductive member may be used to at least partially fill the gap in order to prevent emission from the antenna from entering the gap and interfering with the operation of the antenna. The conductive gap-filling member may include a conductive outer layer and a non-conductive inner layer. The inner layer may have opposing edge portions that are attached to each other or may be a continuous tubular insulating layer. The outer layer may be a layer of conductive fabric having opposing edge portions that are attached to each other or to opposing edge portions of the inner layer. An edge portion of the outer layer may be attached to a conductive structure. An insulating material may be formed between another edge portion of the outer layer and a second conductive structure.
摘要翻译：电子设备可以设置有导电结构和安装在导电结构之间的间隙附近的天线。可以使用导电构件至少部分地填充间隙，以防止天线的发射进入间隙并干扰天线的操作。导电间隙填充构件可以包括导电外层和非导电内层。内层可以具有彼此附接的相对的边缘部分，或者可以是连续的管状绝缘层。外层可以是具有彼此附接或内层的相对边缘部分的相对边缘部分的导电织物层。外层的边缘部分可以附接到导电结构。可以在外层的另一边缘部分和第二导电结构之间形成绝缘材料。

6. 发明授权

US08998622B2 Electrical connectors with applicators for electronic devices 有权
标题翻译：带电子装置的电连接器
公开(公告)号：US08998622B2
公开(公告)日：2015-04-07
申请号：US13601884
申请日：2012-08-31
申请人： Taylor H. Gilbert , Sean S. Corbin
发明人： Taylor H. Gilbert , Sean S. Corbin
IPC分类号： H01R12/00 , H05K1/00 , H01R12/52 , H01R4/04 , H01R43/26 , H05K3/36 , H01R12/62
CPC分类号： H01R12/52 , H01R4/04 , H01R12/00 , H01R12/62 , H01R43/26 , H05K1/00 , H05K3/361 , H05K2201/0281 , H05K2201/0355 , H05K2201/1028 , H05K2201/1034
摘要： Electronic devices may be provided with electronic components and electrical connectors coupled between the electronic components. A connector may be formed in a small gap between the electronic components. The connector may be a thin sheet of flexible conductive material with a conductive adhesive on one surface. The connector may be installed between the components using an applicator that is attached to the connector. The applicator may be a pull-tab liner having a first surface that is tacky and a second opposing surface that is non-stick. The applicator may have an extended portion that can be held by a technician while installing the connector. The connector may be installed by inserting the connector and applicator between the components, pinching the components against the connector and applicator, and removing the applicator by pulling the extended portion to peel the applicator from the connector.
摘要翻译：电子设备可以设置有电子部件和耦合在电子部件之间的电连接器。连接器可以形成在电子部件之间的小间隙中。连接器可以是在一个表面上具有导电粘合剂的柔性导电材料薄片。可以使用附接到连接器的施加器将连接器安装在组件之间。施用器可以是具有粘性的第一表面和不粘的第二相对表面的拉片衬里。涂抹器可以具有在安装连接器的同时由技术人员保持的延伸部分。连接器可以通过将连接器和施加器插入到部件之间，将部件夹持在连接器和施加器上，并且通过拉动延伸部分从连接器剥离施加器来移除施加器来安装。

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