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    • 37. 发明授权
    • Plastic encapsulated semiconductor assemblies
    • 塑料封装半导体组件
    • US3719969A
    • 1973-03-13
    • US3719969D
    • 1971-04-21
    • GOODRICH CO B F
    • MC GINNIS H
    • B29C73/00B29D29/06F16G3/00
    • F16G3/00B29C35/02B29C65/562B29C66/0224B29C66/12822B29C66/12842B29C66/14B29C66/3034B29C66/4322B29C66/4324B29C66/71B29C66/721B29C66/72141B29D29/06B29K2021/00B29K2105/108B29L2031/7092Y10T24/1664B29C65/00B29K2027/06
    • A SPLICED CONVEYOR BELT, AND THE METHOD OF SPLICING A CONVEYOR A PLASTIC ENCAPSULATED, HIGH-FREQUENCY POWER TRANSISTOR ASSEMBLY HAVING A METALLIZED CERAMIC BASE AND A METALLIC HEAT SINK IS BELT, OF THE RUBBER-COVERED TYPE PROVIDED WITH TRANSVERSE AND LONGITUDINAL REINFORCEMENTS WITH THE LONGITUDINAL REINFORCEMENTS FABRICATED BY A METHOD WHICH INCLUDES THE USE OF A THIN, SUBSTANTIALLY FLAT LEAD FRAME MEMBER HAVING AT LEAST FOUR IN THE FORM OF CABLES LOCATED ONLY IN THICKENED EDGES OF THE BELT , CHARACTERIZED IN THAT THE RUBBER COVER IS REMOVED TO EXPOSE THE INWARDLY PROJECTING, SUBSTANTIALLY COPLANAR ELECTROCONDUCTIVE LEADS AND A BRIDGING PORTION INTEGRAL THEREWITH CONNECTING THE REINFORCEMENTS IN THE REGION OF THE SPLICE AND THE ADJACENT ENDS TO BE SPLICED HAVE THE TRANSVERSE REINFORCEMENTS OF THE TWO ENDS ENDS OF TWO OF SAID LEADS. THE LEAD ENDS ARE BONDED TO CORRESPONDING METALLIZED AREAS OF THE CERAMIC BASE, ONE OF SAID PLACED IN BUTTING RELATIONSHIP AND THE ADJACENT ENDS OF THE LONGITUDINAL REINFORCEMENTS IN OVERLAPPING RELATIONSHIP, THE METALLIZED AREAS HAVING A CENTRALLY EXTENDED CONFIGURATION ADAPTED FOR DIE BONDING OF THE SEMICONDUCTOR UNIT. THE ASSEMBLY RUBBER COVER IS REPLACED OVER THE EXPOSED REINFORCEMENTS AND SHAPED TO CONFORM WITH THE OTHER AREAS OF THE BELT. PREFERABLY, IS THEN COMPLETED BY THE ATTACHMENT OF A METALLIC STUD TO THE OPPOSITE SIDE OF THE CERAMIC BASE, WIRE BONDING OF THE EMITTER THE BELT ENDS TO BE JOINED HAVE THE LONGITUDINAL REINFORCEMENTS CUT AT STAGGERED LOCATIONS AND THE OVERLAPPING PORTIONS OF THE REGION TO THE BRIDGING PORTION OF THE LEAD FRAME, WIRE BONDING OF THE BASE REGION TO THE REMAINING LEAD, AND A FINAL STEP OF SAID REINFORCEMENTS ARE MECHANICALLY JOINED IN THE REGION OF THE SPLICE BY A SUCCESSION OF CLAMPS. THE TRANSVERSE REINFORCEMENTS PLASTIC ENCAPSULATION. MAY ALSO BE MECHANICALLY JOINED BY A PLURALITY OF CLAMPS.
    • 具有金属化陶瓷基底和金属散热器的塑料封装的高频功率晶体管组件通过一种方法制造,该方法包括使用具有至少四个向内突出的基本上共面的导电引线的薄的基本平坦的引线框架构件, 与之成一体的桥接部分连接两根所述引线的端部。 引线端部结合到陶瓷基体的相应的金属化区域,所述金属化区域中的一个具有适于半导体单元的裸片接合的中心延伸构造。 然后通过将金属螺柱连接到陶瓷基体的相对侧,将发射极区域引线接合到引线框架的桥接部分,将基极区域与剩余的引线接合,并将最终的 塑料封装的步骤。一种拼接式输送带,以及具有横向和纵向增强件的橡胶覆盖型输送带的方法,其纵向加强件的形式仅位于带的增厚边缘,其特征在于 其中橡胶盖被移除以暴露接头区域中的加强件,并且待接合的相邻端部的两端的横向加强件处于对接关系,并且纵向加强件的相邻端部以重叠关系,橡胶 盖子在暴露的加强件上被更换并成形为与皮带的其他区域一致。 优选地,待接合的带端部具有在交错位置处切割的纵向加强件,并且所述加强件的重叠部分通过一系列夹具机械地接合在接头的区域中。 横向加强件也可以通过多个夹具机械连接。