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31. 发明授权

US5647932A Method of processing a piezoelectric device 失效
标题翻译：压电装置的处理方法
公开(公告)号：US5647932A
公开(公告)日：1997-07-15
申请号：US601539
申请日：1996-02-14
申请人： Yutaka Taguchi , Kazuo Eda , Akihiro Kanaboshi , Tetsuyoshi Ogura , Yoshihiro Tomita
发明人： Yutaka Taguchi , Kazuo Eda , Akihiro Kanaboshi , Tetsuyoshi Ogura , Yoshihiro Tomita
IPC分类号： H03H3/02 , H01L21/30 , H01L21/304 , H01L21/306
CPC分类号： H03H3/02 , Y10S148/012 , Y10S148/135
摘要： The following steps are performed when processing electronic components such as piezoelectric devices. At Step 1 inter-atom bond is created between a functional member such as a quartz crystal plate and a first substrate, and the functional member and the quartz crystal plate are directly joined together. At Step 2, the functional member and a second substrate are fixed together with an adhesive agent or by a direct bond. At Step 3, the first substrate is removed chemically or mechanically, with said functional member and said second substrate still being joined together. A step of polishing said functional member for the adjustment of thickness thereof may be done between Step 1 and Step 2. For example, a silicon dioxide thin film may be provided between the functional member and the first substrate. Since no adhesive layer exists between the functional member and the first substrate, this improves the degree of plane of the functional member when joined to the first substrate. Therefore, functional member thickness accuracy becomes extremely high and mass productivity is also improved.
摘要翻译：在处理诸如压电装置的电子部件时执行以下步骤。在步骤1中，在诸如石英晶体板的功能部件和第一基板之间产生原子间键合，并且功能部件和石英晶体板直接接合在一起。在步骤2中，功能部件和第二基板通过粘合剂或直接粘合固定在一起。在步骤3中，第一衬底被化学或机械地移除，所述功能构件和所述第二衬底仍然连接在一起。可以在步骤1和步骤2之间进行用于调整其厚度的抛光所述功能部件的步骤。例如，可以在功能部件和第一基板之间设置二氧化硅薄膜。由于在功能部件和第一基板之间不存在粘接层，因此能够提高与第一基板接合时的功能部件的平面度。因此，功能元件厚度精度变得非常高，并且也提高了批量生产率。

32. 发明授权

US4930044A Thin-film capacitor and method of manufacturing a hybrid microwave integrated circuit 失效
标题翻译：薄膜电容器和混合微波集成电路的制造方法
公开(公告)号：US4930044A
公开(公告)日：1990-05-29
申请号：US398731
申请日：1989-08-25
申请人： Kazuo Eda , Tetsuji Miwa , Yutaka Taguchi
发明人： Kazuo Eda , Tetsuji Miwa , Yutaka Taguchi
IPC分类号： H01G4/10 , H01L27/01
CPC分类号： H01L27/016 , H01G4/10 , H01L2224/48091 , H01L2224/48227 , H01L2924/12044 , H01L2924/1423 , H01L2924/30107 , H01L2924/3011 , Y10T29/435
摘要： A thin-film capacitor which has excellent withstand voltage characteristic, dielectric loss characteristic and production yield can be obtained by forming its dielectric film with a 3-layered structure comprising a first silicon oxide film formed on a polycrystalline sintered body substrate by a chemical vapor-phase deposition method, a second silicon oxide film formed by coating on the first silicon oxide film a solution state silicon oxide precursor followed by denaturing by heat treatment, and a third silicon oxide film formed on the second silicon oxide film by a chemical vapor-phase deposition method. A hybrid microwave integrated circuit is manufactured in which the above-mentioned thin-film capacitors are used as input/output coupling and DC blocking capacitors, bypass capacitors and impedance matching capacitors.

33. 发明授权

US06236141B1 Surface acoustic wave element 有权
标题翻译：表面声波元件
公开(公告)号：US06236141B1
公开(公告)日：2001-05-22
申请号：US09459107
申请日：1999-12-13
申请人： Hiroki Sato , Keiji Onishi , Akihiko Namba , Yutaka Taguchi , Yosihiro Tomita
发明人： Hiroki Sato , Keiji Onishi , Akihiko Namba , Yutaka Taguchi , Yosihiro Tomita
IPC分类号： H03H925
CPC分类号： H03H9/02834 , H03H3/10 , H03H9/02574 , H03H9/25
摘要： Disclosed is a SAW element with a propagation substrate that is a piezoelectric substrate. An auxiliary substrate is laminated on one surface of the propagation substrate by way of direct bonding, and a comb-shaped electrode is formed on another surface of the propagation substrate that is opposite the surface with the auxiliary substrate. The electrode excites an acoustic wave. The propagation substrate and the auxiliary substrate are not bonded to each other in at least a region immediately below a region where the comb-shaped electrode is formed. A coefficient of thermal expansion in a propagation direction of the acoustic wave of the auxiliary substrate is smaller than a coefficient of thermal expansion in a propagation direction of the acoustic wave of the propagation substrate.
摘要翻译：公开了具有作为压电基板的传播基板的SAW元件。辅助基板通过直接接合层叠在传播基板的一个表面上，并且梳状电极形成在传播基板的与辅助基板的表面相对的另一表面上。电极激发声波。传播基板和辅助基板在至少形成有梳状电极的区域的正下方的区域中不结合。辅助基板的声波的传播方向的热膨胀系数小于传播基板的声波的传播方向的热膨胀系数。

34. 发明授权

US07336234B2 Antenna apparatus and communication method employing it 失效
标题翻译：采用天线设备和通信方法
公开(公告)号：US07336234B2
公开(公告)日：2008-02-26
申请号：US11315174
申请日：2005-12-23
申请人： Yutaka Taguchi , Hideki Kusunoki , Toshiyasu Tanaka
发明人： Yutaka Taguchi , Hideki Kusunoki , Toshiyasu Tanaka
IPC分类号： H01Q13/00
CPC分类号： B60C23/0408 , B60C23/0444 , H01Q1/2241 , H01Q9/36 , H01Q9/40
摘要： An antenna apparatus includes a monopole antenna forming an antenna element having a metal shell body, and the antenna element has an approximately conical part, a vertex of which is on the side of a power supply part.
摘要翻译：天线装置包括形成具有金属壳体的天线元件的单极天线，天线元件具有大致圆锥形的部分，顶点位于电源部分的一侧。

35. 发明授权

US07061100B2 Semiconductor built-in millimeter-wave band module 有权
标题翻译：半导体内置毫米波段模块
公开(公告)号：US07061100B2
公开(公告)日：2006-06-13
申请号：US10405524
申请日：2003-04-02
申请人： Hideki Iwaki , Yutaka Taguchi , Tetsuyosi Ogura , Yasuhiro Sugaya , Toshiyuki Asahi , Tousaku Nishiyama , Yoshinobu Idogawa
发明人： Hideki Iwaki , Yutaka Taguchi , Tetsuyosi Ogura , Yasuhiro Sugaya , Toshiyuki Asahi , Tousaku Nishiyama , Yoshinobu Idogawa
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L23/66 , H01L21/481 , H01L21/56 , H01L23/552 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/162 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/1305 , H01L2924/14 , H01L2924/1423 , H01L2924/1532 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/20752
摘要： A semiconductor built-in millimeter-wave band module includes: an insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a high thermal conductivity substrate made of a dielectric material having thermal conductivity higher than the insulating substrate and laminated on one surface of the insulating substrate; a plurality of wiring patterns formed on the high thermal conductivity substrate and the insulating substrate; a semiconductor device operating at millimeter-wave band, which is arranged inside of the insulating substrate, is packaged on the high thermal conductivity substrate in a face-up manner, and is connected electrically with the wiring patterns; and a distributed constant circuit element and an active element provided on the semiconductor device. In this module, a void is provided inside of the insulating substrate and in the vicinity of a surface of the distributed constant circuit element and the active element. With this configuration, heat from the semiconductor device operating at a millimeter-wave band can be dissipated effectively and the semiconductor and other circuit components can be packaged with high density.
摘要翻译：半导体内置毫米波段模块包括：绝缘基板，由含有无机填料和热固性树脂的混合物制成; 高导热性衬底，其由具有高于绝缘衬底的导热率的电介质材料制成并且层压在绝缘衬底的一个表面上; 形成在高导热性基板和绝缘基板上的多个布线图案; 布置在绝缘基板内部的以毫米波段工作的半导体器件以面朝上的方式封装在高导热性基板上，并与布线图形电连接; 以及设置在半导体器件上的分布常数电路元件和有源元件。在该模块中，在绝缘基板内部和分布常数电路元件和有源元件的表面附近设置有空隙。利用这种结构，可以有效地消耗来自在毫米波段工作的半导体器件的热量，并可以高密度地封装半导体和其它电路部件。

36. 发明授权

US06392164B1 Multi-level circuit substrate, method for manufacturing same and method for adjusting a characteristic impedance therefor 有权
标题翻译：多电平电路基板及其制造方法以及调整其特性阻抗的方法
公开(公告)号：US06392164B1
公开(公告)日：2002-05-21
申请号：US09417662
申请日：1999-10-14
申请人： Hideki Iwaki , Yutaka Taguchi , Tetsuyoshi Ogura
发明人： Hideki Iwaki , Yutaka Taguchi , Tetsuyoshi Ogura
IPC分类号： H05K111
CPC分类号： H05K1/0251 , H01L23/66 , H01L2223/6616 , H01L2924/0002 , H01L2924/3011 , H05K1/024 , H05K1/0298 , H05K1/116 , H05K2201/0715 , H05K2201/09454 , H05K2201/096 , H05K2201/09718 , H05K2201/09781 , H05K2201/09881 , H01L2924/00
摘要： An insulator is provided between interconnect layers oppositely placed. The interconnect layers are connected between by connection members provided through the insulator. The connection members at one and the other ends are connected between in their center positions. A shield layer is provided spaced from the intermediate connection layer generally on a same plane as the intermediate connection layer. The interconnect layers where considered generally as a circular cylinder have a diameter m, and the intermediate connection layer where considered generally as circular has a diameter r, r
摘要翻译：在相互布置的互连层之间设置绝缘体。互连层通过通过绝缘体提供的连接构件连接在一起。连接构件在一端和另一端连接在它们的中心位置之间。屏蔽层设置成与中间连接层间隔开，通常在与中间连接层相同的平面上。通常被认为是圆柱体的互连层具有直径m，并且被认为通常为圆形的中间连接层具有直径r，r

37. 发明授权

US07248482B2 Module with built-in circuit component and method for producing the same 有权
标题翻译：具有内置电路元件的模块及其制造方法
公开(公告)号：US07248482B2
公开(公告)日：2007-07-24
申请号：US10844823
申请日：2004-05-12
申请人： Toshiyuki Asahi , Yutaka Taguchi , Yasuhiro Sugaya , Seiichi Nakatani , Toshio Fujii
发明人： Toshiyuki Asahi , Yutaka Taguchi , Yasuhiro Sugaya , Seiichi Nakatani , Toshio Fujii
IPC分类号： H01R12/16 , H05K1/14
CPC分类号： H05K1/186 , H01L25/165 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/97 , H01L2924/19105 , H05K1/115 , H05K3/20 , H05K3/4614 , H05K2201/09609 , H05K2201/09618 , H05K2201/10378 , H05K2203/061 , H01L2224/81 , H01L2224/83
摘要： A module with a built-in circuit component of the present invention includes an electric insulating layer, a pair of wiring layers provided on both principal planes of the electric insulating layer, a plurality of via conductors electrically connecting the pair of wiring layers and passing through the electric insulating layer in a thickness direction thereof, and a circuit component buried in the electric insulating layer, wherein the plurality of via conductors are disposed in a circumferential portion of the electric insulating layer in accordance with a predetermined rule. The plurality of via conductors are placed at an interval, for example, so as to form at least one straight line, in a cut surface of the electric insulating layer in a direction parallel to a principal plane thereof.
摘要翻译：具有本发明的内置电路部件的模块包括电绝缘层，设置在电绝缘层的两个主平面上的一对布线层，多个通孔导体，电连接该对布线层并通过所述电绝缘层的厚度方向以及埋设在所述电绝缘层中的电路部件，其中，所述多个通孔导体按照规定的规则配置在所述电绝缘层的周向部分。多个通孔导体例如在与绝缘层的主平面平行的方向上在电绝缘层的切割面上形成至少一条直线的间隔。

38. 发明授权

US06998932B2 High-frequency switch 失效
标题翻译：高频开关
公开(公告)号：US06998932B2
公开(公告)日：2006-02-14
申请号：US10809309
申请日：2004-03-24
申请人： Yutaka Taguchi , Yuki Satoh
发明人： Yutaka Taguchi , Yuki Satoh
IPC分类号： H01P1/10 , H01P5/12
CPC分类号： H01P1/15
摘要： A high-frequency switch having two input terminals and two output terminals of which a broad pass band is required has (i) a circuit board that has two input electrodes along one side and two output electrodes along another side, and (ii) four PIN diodes mounted on this circuit board. Each side of the quadrangle made by connecting the input electrodes and the output electrodes is not parallel to the corresponding side of the quadrangle made by connecting electrodes for mounting the PIN diodes. Each side and the corresponding side form an angle other than 180°. This structure can provide a high-frequency switch capable of reducing a transmission loss in the paths and facilitating impedance matching.
摘要翻译：具有需要宽通带的两个输入端子和两个输出端子的高频开关具有：（i）沿着一侧具有两个输入电极和沿着另一侧具有两个输出电极的电路板，以及（ii）四个PIN 安装在该电路板上的二极管。通过连接输入电极和输出电极制成的四边形的每一侧不平行于用于安装PIN二极管的连接电极制成的四边形的相应侧。每一侧和相应的一侧形成除180°以外的角度。该结构可以提供能够减小路径中的传输损耗并促进阻抗匹配的高频开关。

39. 发明授权

US06885788B2 Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling member of the module 失效
标题翻译：光接收/发射装置内置模块，其中组合有光学和电气布线，用于制造模块和组件的组件的方法
公开(公告)号：US06885788B2
公开(公告)日：2005-04-26
申请号：US10609494
申请日：2003-06-20
申请人： Hideki Iwaki , Yutaka Taguchi , Tetsuyoshi Ogura , Yasuhiro Sugaya , Toshiyuki Asahi , Tousaku Nishiyama , Yoshinobu Idogawa
发明人： Hideki Iwaki , Yutaka Taguchi , Tetsuyoshi Ogura , Yasuhiro Sugaya , Toshiyuki Asahi , Tousaku Nishiyama , Yoshinobu Idogawa
IPC分类号： H05K3/46 , G02B6/43 , H05K1/02 , H05K1/18 , G02B6/10 , G02B6/12 , G02B6/26 , G02B6/42
CPC分类号： G02B6/43 , H05K1/0274 , H05K1/185
摘要： A light reception/emission device built-in module with optical and electrical wiring combined therein includes: an optical waveguide layer including a core portion and a cladding portion; first and second wiring patterns formed on a main surface of the optical waveguide layer; a light reception device disposed inside the optical waveguide layer, the light reception device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the first wiring pattern; and a light emission device disposed inside the optical waveguide layer, the light emission device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the second wiring pattern. With this configuration, optical coupling between the optical waveguide and the light reception/emission device can be conducted precisely.
摘要翻译：其中组合有光电布线的光接收/发射装置内置模块包括：包括芯部分和包层部分的光波导层; 形成在光波导层的主表面上的第一和第二布线图案; 光接收装置，其设置在所述光波导层的内部，所述光接收装置与所述光波导层的芯部部分光学连接并与所述第一布线图案电连接; 以及发光装置，其配置在所述光波导层的内部，所述发光装置与所述光波导层的芯部部分光学连接并且与所述第二布线图案电连接。利用这种结构，可以精确地进行光波导与光接收/发射装置之间的光耦合。

40. 发明授权

US06683260B2 Multilayer wiring board embedded with transmission line conductor 失效
标题翻译：多层布线板嵌入传输线导体
公开(公告)号：US06683260B2
公开(公告)日：2004-01-27
申请号：US09897127
申请日：2001-07-03
申请人： Takeshi Shimamoto , Kazufumi Yamaguchi , Masahide Tsukamoto , Fumikazu Tateishii , Yutaka Taguchi
发明人： Takeshi Shimamoto , Kazufumi Yamaguchi , Masahide Tsukamoto , Fumikazu Tateishii , Yutaka Taguchi
IPC分类号： H05K100
CPC分类号： H05K1/0245 , H01P3/08 , H05K1/0219 , H05K1/0242 , H05K1/09 , H05K3/107 , H05K2201/0305 , H05K2201/09036 , H05K2201/09118 , H05K2201/09236 , H05K2201/098 , H05K2201/09981 , Y10T29/49126
摘要： Transmission line structure is composed of a pair of signal conductors which are embedded in one wiring region of a dielectric layer and a thickness in height of the signal conductor is larger than a width, and is constituted so that a coupling impedance between the adjacent signal conductors is lower than a coupling impedance between the signal conductor and another conductor formed in another wiring region, and thus to provide a multi-layer wiring board having a transmission line structure of high wiring density and excellent transmission characteristic.
摘要翻译：传输线结构由嵌入在电介质层的一个布线区域中的一对信号导体组成，信号导体的高度大于宽度，并且构成为使得相邻信号导体之间的耦合阻抗低于在另一布线区域中形成的信号导体和另一导体之间的耦合阻抗，从而提供具有高布线密度和优良传输特性的传输线结构的多层布线板。

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