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    • 34. 发明申请
    • Semiconductor integrated circuit device and method of fabricating the same
    • 半导体集成电路器件及其制造方法
    • US20060291115A1
    • 2006-12-28
    • US11472374
    • 2006-06-22
    • Jae-Ho SongYoung-Hoon ParkEun-Soo Kim
    • Jae-Ho SongYoung-Hoon ParkEun-Soo Kim
    • H02H9/00
    • H01L27/14601H01L27/1463
    • Provided are a semiconductor integrated circuit (IC) device and a method of fabricating the same. The semiconductor IC device may include first, second and third deep wells of a first conductivity type formed in a semiconductor substrate, and electrically isolated from one another; first and second wells of a second conductivity type and an active pixel sensor (APS) array formed between a top surface of the semiconductor substrate and the first, second and third deep wells, respectively; and first, second and third protective wells of the first conductivity type formed in the semiconductor substrate. The first and second wells of the second conductivity type and the APS array may be connected to different power supply voltages. The first, second and third protective wells of the first conductivity type may surround side surfaces of the first and second wells and the APS array, respectively.
    • 提供一种半导体集成电路(IC)装置及其制造方法。 半导体IC器件可以包括形成在半导体衬底中并且彼此电隔离的第一导电类型的第一,第二和第三深阱; 分别形成在半导体衬底的顶表面和第一,第二和第三深孔之间的第二导电类型的第一和第二阱和有源像素传感器(APS)阵列; 以及形成在半导体衬底中的第一导电类型的第一,第二和第三保护阱。 第二导电类型的第一和第二阱和APS阵列可以连接到不同的电源电压。 第一导电类型的第一,第二和第三保护阱可分别围绕第一和第二阱和APS阵列的侧表面。