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    • 3. 发明申请
    • COMS image sensors and methods of manufacturing the same
    • COMS图像传感器及其制造方法
    • US20110163363A1
    • 2011-07-07
    • US13064289
    • 2011-03-16
    • Ui-Sik KimYoung-Hoon ParkWon-Je ParkDae-Cheol SeongYeo-Ju YoonBo-Bae Kang
    • Ui-Sik KimYoung-Hoon ParkWon-Je ParkDae-Cheol SeongYeo-Ju YoonBo-Bae Kang
    • H01L27/146
    • H01L27/14689H01L27/14603H01L27/14612H01L27/1463H01L27/14636
    • Complementary metal-oxide semiconductor (CMOS) image sensors (CIS) and methods of manufacturing the same are provided, the sensors include an epitaxial layer on a substrate in which a first, second, third and fourth region are defined. A photodiode may be formed at an upper portion of the epitaxial layer in the first region. A plurality of gate structures may be formed on the epitaxial layer in the second, third and fourth regions. A first blocking layer may be formed on the gate structures and the epitaxial layer in the first and second regions. A first impurity layer may be formed at an upper portion of the epitaxial layer adjacent to the gate structures in the second region, and a second impurity layer at upper portions of the epitaxial layer adjacent to the gate structures in the third and fourth regions. A color filter layer may be formed over the photodiode. A microlens may be formed on the color filter layer.
    • 提供互补金属氧化物半导体(CMOS)图像传感器(CIS)及其制造方法,传感器包括在其中限定了第一,第二,第三和第四区域的基板上的外延层。 可以在第一区域中的外延层的上部形成光电二极管。 可以在第二,第三和第四区域中的外延层上形成多个栅极结构。 可以在栅极结构和第一和第二区域中的外延层上形成第一阻挡层。 可以在与第二区域中的栅极结构相邻的外延层的上部形成第一杂质层,并且在第三和第四区域中与栅极结构相邻的外延层的上部处形成第二杂质层。 可以在光电二极管上方形成滤色器层。 可以在滤色器层上形成微透镜。
    • 4. 发明授权
    • Methods of manufacturing CMOS image sensors
    • CMOS图像传感器的制造方法
    • US07932120B2
    • 2011-04-26
    • US12461903
    • 2009-08-27
    • Ui-Sik KimYoung-Hoon ParkWon-Je ParkDae-Cheol SeongYeo-Ju YoonBo-Bae Kang
    • Ui-Sik KimYoung-Hoon ParkWon-Je ParkDae-Cheol SeongYeo-Ju YoonBo-Bae Kang
    • H01L21/00H01L21/8238
    • H01L27/14689H01L27/14603H01L27/14612H01L27/1463H01L27/14636
    • Complementary metal-oxide semiconductor (CMOS) image sensors (CIS) and methods of manufacturing the same are provided, the sensors include an epitaxial layer on a substrate in which a first, second, third and fourth region are defined. A photodiode may be formed at an upper portion of the epitaxial layer in the first region. A plurality of gate structures may be formed on the epitaxial layer in the second, third and fourth regions. A first blocking layer may be formed on the gate structures and the epitaxial layer in the first and second regions. A first impurity layer may be formed at an upper portion of the epitaxial layer adjacent to the gate structures in the second region, and a second impurity layer at upper portions of the epitaxial layer adjacent to the gate structures in the third and fourth regions. A color filter layer may be formed over the photodiode. A microlens may be formed on the color filter layer.
    • 提供互补金属氧化物半导体(CMOS)图像传感器(CIS)及其制造方法,传感器包括在其中限定了第一,第二,第三和第四区域的基板上的外延层。 可以在第一区域中的外延层的上部形成光电二极管。 可以在第二,第三和第四区域中的外延层上形成多个栅极结构。 可以在栅极结构和第一和第二区域中的外延层上形成第一阻挡层。 可以在与第二区域中的栅极结构相邻的外延层的上部形成第一杂质层,并且在第三和第四区域中与栅极结构相邻的外延层的上部处形成第二杂质层。 可以在光电二极管上方形成滤色器层。 可以在滤色器层上形成微透镜。
    • 5. 发明申请
    • Methods of manufacturing CMOS image sensors
    • CMOS图像传感器的制造方法
    • US20100055823A1
    • 2010-03-04
    • US12461903
    • 2009-08-27
    • Ui-Sik KimYoung-Hoon ParkWon-Je ParkDae-Cheol SeongYeo-Ju YoonBo-Bae Kang
    • Ui-Sik KimYoung-Hoon ParkWon-Je ParkDae-Cheol SeongYeo-Ju YoonBo-Bae Kang
    • H01L31/18
    • H01L27/14689H01L27/14603H01L27/14612H01L27/1463H01L27/14636
    • Complementary metal-oxide semiconductor (CMOS) image sensors (CIS) and methods of manufacturing the same are provided, the sensors include an epitaxial layer on a substrate in which a first, second, third and fourth region are defined. A photodiode may be formed at an upper portion of the epitaxial layer in the first region. A plurality of gate structures may be formed on the epitaxial layer in the second, third and fourth regions. A first blocking layer may be formed on the gate structures and the epitaxial layer in the first and second regions. A first impurity layer may be formed at an upper portion of the epitaxial layer adjacent to the gate structures in the second region, and a second impurity layer at upper portions of the epitaxial layer adjacent to the gate structures in the third and fourth regions. A color filter layer may be formed over the photodiode. A microlens may be formed on the color filter layer.
    • 提供互补金属氧化物半导体(CMOS)图像传感器(CIS)及其制造方法,传感器包括在其中限定了第一,第二,第三和第四区域的基板上的外延层。 可以在第一区域中的外延层的上部形成光电二极管。 可以在第二,第三和第四区域中的外延层上形成多个栅极结构。 可以在栅极结构和第一和第二区域中的外延层上形成第一阻挡层。 可以在与第二区域中的栅极结构相邻的外延层的上部形成第一杂质层,并且在第三和第四区域中与栅极结构相邻的外延层的上部处形成第二杂质层。 可以在光电二极管上方形成滤色器层。 可以在滤色器层上形成微透镜。
    • 6. 发明授权
    • CMOS image sensors
    • CMOS图像传感器
    • US08309996B2
    • 2012-11-13
    • US13064289
    • 2011-03-16
    • Ui-Sik KimYoung-Hoon ParkWon-Je ParkDae-Cheol SeongYeo-Ju YoonBo-Bae Kang
    • Ui-Sik KimYoung-Hoon ParkWon-Je ParkDae-Cheol SeongYeo-Ju YoonBo-Bae Kang
    • H01L31/113
    • H01L27/14689H01L27/14603H01L27/14612H01L27/1463H01L27/14636
    • Complementary metal-oxide semiconductor (CMOS) image sensors (CIS) and methods of manufacturing the same are provided, the sensors include an epitaxial layer on a substrate in which a first, second, third and fourth region are defined. A photodiode may be formed at an upper portion of the epitaxial layer in the first region. A plurality of gate structures may be formed on the epitaxial layer in the second, third and fourth regions. A first blocking layer may be formed on the gate structures and the epitaxial layer in the first and second regions. A first impurity layer may be formed at an upper portion of the epitaxial layer adjacent to the gate structures in the second region, and a second impurity layer at upper portions of the epitaxial layer adjacent to the gate structures in the third and fourth regions. A color filter layer may be formed over the photodiode. A microlens may be formed on the color filter layer.
    • 提供互补金属氧化物半导体(CMOS)图像传感器(CIS)及其制造方法,传感器包括在其中限定了第一,第二,第三和第四区域的基板上的外延层。 可以在第一区域中的外延层的上部形成光电二极管。 可以在第二,第三和第四区域中的外延层上形成多个栅极结构。 可以在栅极结构和第一和第二区域中的外延层上形成第一阻挡层。 可以在与第二区域中的栅极结构相邻的外延层的上部形成第一杂质层,并且在第三和第四区域中与栅极结构相邻的外延层的上部形成第二杂质层。 可以在光电二极管上方形成滤色器层。 可以在滤色器层上形成微透镜。
    • 9. 发明授权
    • CMOS image sensor with photo-detector protecting layers
    • 具有光电检测器保护层的CMOS图像传感器
    • US08129765B2
    • 2012-03-06
    • US12214666
    • 2008-06-20
    • Ui-Sik KimYoung-Hoon Park
    • Ui-Sik KimYoung-Hoon Park
    • H01L27/146
    • H01L27/14609H01L27/14603H01L27/1462
    • An image sensor includes a logic region and an APS region having a first gate electrode, a photo-detector, a first protecting layer, first spacers, and a second protecting layer. The first gate electrode is formed over a semiconductor substrate. The photo-detector is formed to a side of the first gate electrode within the semiconductor substrate. The first protecting layer is formed over the first gate electrode and the photo-detector. The first spacers are formed over the first protecting layer to the sides of the first gate electrode. The second protecting layer is formed over the first protecting layer and the spacers. The first and second protecting layers are for preventing a contaminant from reaching the photo-detector.
    • 图像传感器包括逻辑区域和具有第一栅电极,光检测器,第一保护层,第一间隔物和第二保护层的APS区域。 第一栅电极形成在半导体衬底上。 光检测器形成在半导体衬底内的第一栅电极的一侧。 第一保护层形成在第一栅电极和光检测器之上。 在第一保护层上形成第一间隔物到第一栅电极的侧面。 第二保护层形成在第一保护层和间隔物上。 第一和第二保护层用于防止污染物到达光检测器。
    • 10. 发明申请
    • CMOS image sensor with photo-detector protecting layers
    • 具有光电检测器保护层的CMOS图像传感器
    • US20090014763A1
    • 2009-01-15
    • US12214666
    • 2008-06-20
    • Ui-Sik KimYoung-Hoon Park
    • Ui-Sik KimYoung-Hoon Park
    • H01L27/146
    • H01L27/14609H01L27/14603H01L27/1462
    • An image sensor includes a logic region and an APS region having a first gate electrode, a photo-detector, a first protecting layer, first spacers, and a second protecting layer. The first gate electrode is formed over a semiconductor substrate. The photo-detector is formed to a side of the first gate electrode within the semiconductor substrate. The first protecting layer is formed over the first gate electrode and the photo-detector. The first spacers are formed over the first protecting layer to the sides of the first gate electrode. The second protecting layer is formed over the first protecting layer and the spacers. The first and second protecting layers are for preventing a contaminant from reaching the photo-detector.
    • 图像传感器包括逻辑区域和具有第一栅电极,光检测器,第一保护层,第一间隔物和第二保护层的APS区域。 第一栅电极形成在半导体衬底上。 光检测器形成在半导体衬底内的第一栅电极的一侧。 第一保护层形成在第一栅电极和光检测器之上。 在第一保护层上形成第一间隔物到第一栅电极的侧面。 第二保护层形成在第一保护层和间隔物上。 第一和第二保护层用于防止污染物到达光检测器。