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31. 发明授权

US08106306B2 Ceramic multi-layer circuit substrate and manufacturing method thereof 有权
标题翻译：陶瓷多层电路基板及其制造方法
公开(公告)号：US08106306B2
公开(公告)日：2012-01-31
申请号：US12405729
申请日：2009-03-17
申请人： Won Hee Yoo , Byeung Gyu Chang , Taek Jung Lee , Yong Suk Kim
发明人： Won Hee Yoo , Byeung Gyu Chang , Taek Jung Lee , Yong Suk Kim
IPC分类号： H05K1/00
CPC分类号： H05K3/4629 , B32B18/00 , C04B37/005 , C04B2237/04 , C04B2237/32 , C04B2237/52 , C04B2237/562 , C04B2237/565 , C04B2237/595 , C04B2237/62 , C04B2237/68 , C04B2237/704 , C04B2237/708 , H05K1/0306 , H05K3/1291 , H05K3/4617 , H05K2201/0195 , H05K2201/096 , H05K2201/10378 , H05K2203/1126 , H05K2203/1476
摘要： Provided is a method of manufacturing a ceramic multi-layer circuit substrate. A plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes are layered one atop the other, are formed and are then fired. The fired ceramic blocks are aligned with each other. One or more bonding green sheets each having bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks are prepared. Each of the bonding green sheets is interposed between a pair of the ceramic blocks opposing each other. The ceramic blocks and the bonding green sheets are bonded and are then fired.
摘要翻译：提供一种制造陶瓷多层电路基板的方法。形成多个陶瓷块，每个陶瓷块中的一个或多个具有通孔电极的陶瓷生片分别彼此层叠，然后烧制。烧制的陶瓷块彼此对准。制备一个或多个接合生片，每个接合生片具有与陶瓷块的通孔电极对应的位置的接合电极。每个接合生片被插入在彼此相对的一对陶瓷块之间。陶瓷块和接合生片结合，然后烧制。

32. 发明申请

US20110148447A1 MULTILAYER CERAMIC SUBSTRATE AND PROBE BOARD USING PILLAR-TYPE CONDUCTOR AND FABRICATING METHODS OF THE SAME 审中-公开
标题翻译：多层陶瓷基板和探针板使用支柱导体及其制作方法
公开(公告)号：US20110148447A1
公开(公告)日：2011-06-23
申请号：US12836955
申请日：2010-07-15
申请人： Won Hee YOO , Byeung Gyu Chang , Yong Suk Kim
发明人： Won Hee YOO , Byeung Gyu Chang , Yong Suk Kim
IPC分类号： G01R1/067 , C04B35/74 , H05K1/11
CPC分类号： B32B18/00 , C04B35/63436 , C04B35/63456 , C04B37/026 , C04B2237/04 , C04B2237/12 , C04B2237/32 , C04B2237/40 , C04B2237/52 , C04B2237/592 , C04B2237/62 , C04B2237/68 , C04B2237/72 , G01R1/06711 , G01R3/00 , H05K3/4007 , H05K3/4046 , H05K3/4061 , H05K3/4629 , H05K2201/0367 , H05K2203/025
摘要： There are provided a multilayer ceramic substrate and a probe board formed using a pillar-type conductor formed by including preparing a ceramic sheet having at least one through hole; filling the inside of the through hole with a conductive material; firing the ceramic sheet so that the conductive material is fired to form a pillar-type conductor; and removing the ceramic sheet so that the pillar-type conductor remains, and fabricating methods of the same. The multilayer ceramic substrate and the probe board use the pillar-type conductor that can fill the unfilled region formed within the ceramic sintered body, such that the electrical characteristics and surface flatness thereof are improved. In addition, the multilayer ceramic substrate and the probe board formed by using the pillar-type conductor with the improved adhesion and electrical characteristics between the ceramic sintered body and the connecting pad, and the fabricating methods of the same are provided.
摘要翻译：提供了一种多层陶瓷基板和使用柱状导体形成的探针板，所述柱状导体通过包括制备具有至少一个通孔的陶瓷片而形成; 用导电材料填充通孔的内部; 烧制陶瓷片，使得导电材料被烧制以形成柱状导体; 并且去除陶瓷片以使柱状导体残留，并且制造其方法。多层陶瓷基板和探针板使用可以填充陶瓷烧结体内形成的未填充区域的柱状导体，使得其电特性和表面平坦性得到改善。此外，提供了通过使用具有改善的陶瓷烧结体和连接焊盘之间的粘合性和电特性的柱状导体形成的多层陶瓷基板和探针板及其制造方法。

33. 发明申请

US20100300733A1 Multilayer ceramic board and manufacturing method thereof 审中-公开
标题翻译：多层陶瓷板及其制造方法
公开(公告)号：US20100300733A1
公开(公告)日：2010-12-02
申请号：US12458780
申请日：2009-07-22
申请人： Yong Suk Kim , Byeung Gyu Chang , Won Hee Yoo , Yong Soo Oh
发明人： Yong Suk Kim , Byeung Gyu Chang , Won Hee Yoo , Yong Soo Oh
IPC分类号： H05K1/09 , B05D5/12 , B32B38/00
CPC分类号： H05K3/28 , C04B37/006 , C04B2237/125 , C04B2237/365 , C04B2237/62 , H05K1/0269 , H05K1/0306 , H05K1/113 , H05K3/108 , H05K3/388 , H05K3/4629 , H05K2201/0112 , H05K2201/0175 , H05K2201/0179 , H05K2201/096 , H05K2201/09918 , H05K2203/1383 , H05K2203/166
摘要： The present invention relates to a multilayer ceramic board and manufacturing method thereof. The multilayer ceramic board includes: a ceramic stacked structure in which multiple ceramic layers are stacked and interconnected to one another through vias; diffused reflection preventing patterns which expose the vias provided on each of the uppermost ceramic layer and the lowermost ceramic layer, and are disposed on each of a top surface and a bottom surface of the ceramic stacked structure; and contact pads which are electrically connected to the vias exposed by the diffused reflection preventing patterns.
摘要翻译：本发明涉及一种多层陶瓷板及其制造方法。多层陶瓷板包括：陶瓷层叠结构，其中多个陶瓷层通过通孔彼此堆叠并彼此互连; 扩散反射防止图案，其暴露设置在最上层陶瓷层和最下层陶瓷层中的每一个上的通孔，并且设置在陶瓷堆叠结构的顶表面和底表面中的每一个上; 以及电连接到由扩散反射防止图案暴露的通孔的接触焊盘。

34. 发明授权

US07689753B2 Method of operating wireless USB apparatus by receiving operation state information and wireless USB apparatus using the same 失效
标题翻译：通过接收操作状态信息来操作无线USB设备的方法和使用其的无线USB设备
公开(公告)号：US07689753B2
公开(公告)日：2010-03-30
申请号：US11598747
申请日：2006-11-14
申请人： Dong Won Kwak , Yong Suk Kim , Chang Mo Chung
发明人： Dong Won Kwak , Yong Suk Kim , Chang Mo Chung
IPC分类号： G06F13/14
CPC分类号： H04W48/16 , H04W28/26 , H04W48/08 , H04W88/04 , H04W88/06 , H04W92/02
摘要： A method of operating a wireless universal serial bus (USB) apparatus and the wireless USB apparatus using the same. The method including: receiving operation state information from a neighboring wireless USB apparatus in a beacon period (BP); the wireless USB apparatus, which is operating as a host in a first cluster by using the operation state information, identifying a distributed reservation protocol (DRP) corresponding to a second cluster; and the wireless USB apparatus, which is operating as the host in the first cluster, participating in the second cluster as a device by transmitting and receiving data in the DRP corresponding to the second cluster. Accordingly, the wireless USB apparatus which operates as a host may participate in a neighboring WUSB cluster as a device.
摘要翻译：一种操作无线通用串行总线（USB）设备的方法和使用其的无线USB设备。该方法包括：在信标周期（BP）中从相邻的无线USB设备接收操作状态信息; 所述无线USB装置通过使用所述操作状态信息在第一集群中作为主机运行，识别与第二集群对应的分布式预留协议（DRP）; 以及作为第一群集中的主机操作的无线USB装置，通过在对应于第二群集的DRP中发送和接收数据来作为设备参与第二群集。因此，作为主机操作的无线USB装置可以作为设备参与相邻的WUSB群集。

35. 发明授权

US08854354B2 Power supply circuit for liquid crystal display device that changes durations of control signals 有权
标题翻译：用于改变控制信号持续时间的液晶显示装置的电源电路
公开(公告)号：US08854354B2
公开(公告)日：2014-10-07
申请号：US12909272
申请日：2010-10-21
申请人： Yong Sung Ahn , Jung Min Choi , Sang Rok Cha , Dae Keun Han , Hyung Seog Oh , Yong Suk Kim
发明人： Yong Sung Ahn , Jung Min Choi , Sang Rok Cha , Dae Keun Han , Hyung Seog Oh , Yong Suk Kim
IPC分类号： G09G5/00 , G09G3/36
CPC分类号： G09G3/3696 , G09G3/3677 , G09G2330/02 , G09G2330/06
摘要： A power supply circuit of a liquid crystal display device includes a first positive polarity charge charging unit including a first capacitor connected to positive and negative power terminals through switches to charge a charge, a second positive polarity charge charging unit including a second capacitor connected to the positive power terminal and a ground terminal through switches to charge a charge, a first positive polarity charge loading unit loading the charge supplied through the positive power terminal to a negative polarity terminal, a second positive polarity charge loading unit loading the charge charged in the first capacitor to a negative polarity terminal, a third positive polarity charge loading unit loading the charge charged in the second capacitor, and a positive polarity charge charging/loading control unit outputting charging control signals with a same phase to the switches, and periodically or irregularly changing durations of the charging and loading control signals.
摘要翻译：液晶显示装置的电源电路包括第一正极性充电充电单元，其包括通过开关对正电源端子和负电源端子连接的第一电容器进行充电;第二正极性充电单元，包括连接到正电源端子和接地端子，通过开关对电荷充电，第一正极性电荷负载单元将通过正电源端子提供的电荷负载到负极端子;第二正极性电荷负载单元，负载在第一电容器连接到负极端子，第三正极性电荷负载单元加载充电在第二电容器中的电荷;以及正极性充电充电/负载控制单元，向开关输出具有相同相位的充电控制信号，并周期性地或不规则地改变充电和加载控制的持续时间诺尔斯

36. 发明授权

US07819995B2 Manufacturing method of multi-layer ceramic substrate 有权
标题翻译：多层陶瓷基板的制造方法
公开(公告)号：US07819995B2
公开(公告)日：2010-10-26
申请号：US12411156
申请日：2009-03-25
申请人： Yong Suk Kim , Byeung Gyu Chang , Taek Jung Lee
发明人： Yong Suk Kim , Byeung Gyu Chang , Taek Jung Lee
IPC分类号： C03B29/00 , C04B33/34
CPC分类号： H05K3/4611 , C04B33/32 , H05K3/4629 , H05K2203/0789 , H05K2203/308
摘要： There is provided a method of manufacturing a multilayer ceramic substrate, the method including: providing a non-sintered multilayer ceramic substrate having a plurality of low temperature sintering green sheets laminated therein; disposing a hard-to-sinter constraining green sheet on at least one of top and bottom surfaces of the non-sintered multilayer ceramic substrate; sintering the non-sintered multilayer ceramic substrate having the hard-to-sinter constraining layer disposed thereon; immersing the sintered multilayer ceramic substrate into an acidic solution; and activating a contact between the hard-to-sinter constraining layer and the acidic solution such that the hard-to-sinter constraining layer is removed.
摘要翻译：提供一种制造多层陶瓷基板的方法，该方法包括：提供层叠有多个低温烧结生片的非烧结多层陶瓷基板; 在非烧结多层陶瓷基板的顶表面和底表面中的至少一个上设置难以烧结的约束生片; 烧结其上设置有难烧结约束层的非烧结多层陶瓷衬底; 将烧结的多层陶瓷衬底浸入酸性溶液中; 并且激活硬烧结约束层和酸性溶液之间的接触，从而去除硬烧结约束层。

37. 发明授权

US07496270B2 Light emitting unit, apparatus and method for manufacturing the same, apparatus for molding lens thereof, and light emitting device package thereof 有权
标题翻译：发光单元，其制造方法及其制造方法，发光装置封装
公开(公告)号：US07496270B2
公开(公告)日：2009-02-24
申请号：US11707112
申请日：2007-02-16
申请人： Yong Suk Kim , Hoon Hur
发明人： Yong Suk Kim , Hoon Hur
IPC分类号： G02B6/00
CPC分类号： B29C45/14655 , B29C45/14836 , B29C45/2704 , B29C2045/14327 , B29L2031/3475 , B29L2031/747 , H01L33/52
摘要： A light emitting unit, an apparatus and method for manufacturing the same, an apparatus for molding a lens thereof, and a light emitting device package thereof, which are capable of achieving an enhancement in light extraction efficiency and an improvement in mass productivity, are disclosed. The light emitting unit manufacturing apparatus includes a mold including a first mold and a second mold coupled to each other under a condition in which at least one light emitting unit is interposed between the first and second molds, a groove formed in one of the first and second molds at a position facing the light emitting unit, the groove having a lens shape, and a passage extending from an outer surface of the mold to the groove.
摘要翻译：公开了一种能够实现光提取效率提高和批量生产率提高的发光单元，其制造方法及其制造方法，其透镜成型装置及其发光装置封装。发光单元制造装置包括：模具，其包括第一模具和第二模具，所述模具在第一模具和第二模具之间插入有至少一个发光单元的条件下彼此耦合;沟槽，其形成在第一模具和第二模具之一中; 在面向发光单元的位置处的第二模具，所述凹槽具有透镜形状，以及从模具的外表面延伸到凹槽的通道。

38. 发明申请

US20070286550A1 Light emitting unit, apparatus and method for manufacturing the same, apparatus for molding lens thereof, and light emitting device package thereof 有权
标题翻译：发光单元，其制造方法及其制造方法，发光装置封装
公开(公告)号：US20070286550A1
公开(公告)日：2007-12-13
申请号：US11707112
申请日：2007-02-16
申请人： Yong Suk Kim , Hoon Hur
发明人： Yong Suk Kim , Hoon Hur
IPC分类号： H01L21/00 , G02B6/32
CPC分类号： B29C45/14655 , B29C45/14836 , B29C45/2704 , B29C2045/14327 , B29L2031/3475 , B29L2031/747 , H01L33/52
摘要： A light emitting unit, an apparatus and method for manufacturing the same, an apparatus for molding a lens thereof, and a light emitting device package thereof, which are capable of achieving an enhancement in light extraction efficiency and an improvement in mass productivity, are disclosed. The light emitting unit manufacturing apparatus includes a mold including a first mold and a second mold coupled to each other under a condition in which at least one light emitting unit is interposed between the first and second molds, a groove formed in one of the first and second molds at a position facing the light emitting unit, the groove having a lens shape, and a passage extending from an outer surface of the mold to the groove.
摘要翻译：公开了一种能够实现光提取效率提高和批量生产率提高的发光单元，其制造方法及其制造方法，其透镜成型装置及其发光装置封装。发光单元制造装置包括：模具，其包括第一模具和第二模具，所述模具在第一模具和第二模具之间插入有至少一个发光单元的条件下彼此耦合;沟槽，其形成在第一模具和第二模具之一中; 在面向发光单元的位置处的第二模具，所述凹槽具有透镜形状，以及从模具的外表面延伸到凹槽的通道。

39. 发明授权

US08198198B2 Method for forming electrode pattern of ceramic substrate 有权
标题翻译：形成陶瓷基板电极图案的方法
公开(公告)号：US08198198B2
公开(公告)日：2012-06-12
申请号：US12458834
申请日：2009-07-23
申请人： Won Hee Yoo , Byeung Gyu Chang , Yong Suk Kim
发明人： Won Hee Yoo , Byeung Gyu Chang , Yong Suk Kim
IPC分类号： H01L21/302
CPC分类号： G01R3/00 , G01R1/06761 , H05K1/0306 , H05K3/108 , H05K3/143 , H05K3/388
摘要： The present invention relates to a method for forming electrode patterns of a ceramic substrate including the steps of: forming a plurality of conductive adhesion patterns on the ceramic substrate to be separated apart from one another; forming a plating seed layer, covering the conductive adhesion patterns, on the ceramic substrate; forming photoresist patterns, exposing parts corresponding to the conductive adhesion patterns, on the plating seed layer; forming a plating layer on the plating seed layer exposed by the photoresist patterns; removing the photoresist patterns; and etching parts of the plating seed layer exposed by removal of the photoresist patterns.
摘要翻译：本发明涉及一种形成陶瓷基板的电极图案的方法，包括以下步骤：在陶瓷基板上形成多个导电粘合图案以彼此分开; 在陶瓷基板上形成覆盖导电粘合图案的电镀种子层; 在电镀种子层上形成光致抗蚀剂图案，暴露与导电粘合图案相对应的部分; 在由光致抗蚀剂图案曝光的电镀种子层上形成镀层; 去除光致抗蚀剂图案; 以及通过去除光致抗蚀剂图案来蚀刻暴露的电镀种子层的部分。

40. 发明授权

US08035205B2 Molding compound flow controller 有权
标题翻译：成型复合流量控制器
公开(公告)号：US08035205B2
公开(公告)日：2011-10-11
申请号：US11620561
申请日：2007-01-05
申请人： Seong Won Park , Cheng Yu Hsia , Yong Suk Kim
发明人： Seong Won Park , Cheng Yu Hsia , Yong Suk Kim
IPC分类号： H01L23/495
CPC分类号： H01L21/565 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2225/06568 , H01L2924/01029 , H01L2924/14 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that several semiconductor packages can be manufactured at once. A molding compound flow controller is optimally associated with the substrate or semiconductor package at one or more various locations. Flow controllers can control or direct the flow of the molding compound during the encapsulation process. Flow controllers can be sized, shaped, and positioned in order to smooth out the flow of the molding compound, such that the speed of the flow is substantially equivalent over areas of the substrate containing dies and over areas of the substrate without dies. In this manner, defects such as voids in the encapsulation, wire sweeping, and wire shorts can be substantially avoided during encapsulation.
摘要翻译：半导体封装可以包括附接到衬底的管芯堆叠，其中接合线电连接两者。通常，多个管芯堆叠被粘附到单个衬底上，使得可以一次制造几个半导体封装。模制复合流量控制器在一个或多个不同位置处与衬底或半导体封装最佳地相关联。流动控制器可以在封装过程中控制或引导模塑料的流动。流量控制器的尺寸，形状和位置可以平滑模制化合物的流动，从而在含有模具的基材的区域和没有模具的基材的超过区域上流动的速度基本相当。以这种方式，在封装期间可以基本上避免诸如封装，电线清扫和电线短路之类的缺陷的缺陷。

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