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    • 32. 发明授权
    • Methods and systems for measuring a characteristic of a substrate or preparing a substrate for analysis
    • 用于测量衬底特性或制备用于分析的衬底的方法和系统
    • US07365321B2
    • 2008-04-29
    • US11086048
    • 2005-03-22
    • Mehran Nasser-GhodsiMark Borowicz
    • Mehran Nasser-GhodsiMark Borowicz
    • H01J37/06
    • H01J37/317G01N1/32H01J37/244H01J37/3005H01J2237/2814H01J2237/3174H01J2237/31745
    • Methods and systems for measuring a characteristic of a substrate or preparing a substrate for analysis are provided. One method for measuring a characteristic of a substrate includes removing a portion of a feature on the substrate using an electron beam to expose a cross-sectional profile of a remaining portion of the feature. The feature may be a photoresist feature. The method also includes measuring a characteristic of the cross-sectional profile. A method for preparing a substrate for analysis includes removing a portion of a material on the substrate proximate to a defect using chemical etching in combination with an electron beam. The defect may be a subsurface defect or a partially subsurface defect. Another method for preparing a substrate for analysis includes removing a portion of a material on a substrate proximate to a defect using chemical etching in combination with an electron beam and a light beam.
    • 提供了用于测量基板的特性或准备用于分析的基板的方法和系统。 用于测量衬底的特性的一种方法包括使用电子束去除衬底上的特征的一部分以暴露特征的剩余部分的横截面轮廓。 该特征可以是光致抗蚀剂特征。 该方法还包括测量横截面轮廓的特性。 制备用于分析的基板的方法包括使用化学蚀刻与电子束结合来去除靠近缺陷的衬底上的材料的一部分。 缺陷可能是地下缺陷或部分地下缺陷。 制备用于分析的衬底的另一种方法包括使用化学蚀刻与电子束和光束组合地去除邻近缺陷的衬底上的材料的一部分。
    • 35. 发明授权
    • Ion implantation with charge neutralization
    • 离子注入与电荷中和
    • US06271529B1
    • 2001-08-07
    • US09083707
    • 1998-05-22
    • Marvin FarleyVadim G. DudnikovMehran Nasser-Ghodsi
    • Marvin FarleyVadim G. DudnikovMehran Nasser-Ghodsi
    • H01S100
    • H01J37/026H01J37/063H01J37/3171H01J2237/0041H01J2237/0042H01J2237/0044H01J2237/0045H05H1/54H05H3/02
    • An ion implanter is provided for implanting ions in a workpiece. The ion implanter includes an apparatus for generating an ion beam and directing it toward a surface of a work piece and a plasma generator for generating plasma to neutralize the ion beam and the work piece surface. The plasma generator has a plasma generator chamber defined by walls, a relatively narrow outlet aperture for plasma produced in the chamber to leave the chamber to neutralize the beam and work piece surface, cathodes, and anodes spaced from the cathodes and from the walls of the chamber. The plasma generator also has magnets arranged within the plasma generator chamber, adjacent the chamber walls to generate a magnetic field to deflect primary electrons emitted from the cathode from directly reaching the anode. The plasma generator also features a conductive shield, positioned within the chamber between the anode and the magnets, the shield having an electric potential selected to deflect electrons, the magnetic field and the conductive shield effective during operation to cause electrons from the cathode to trace extended paths to ionize gas within the chamber to generate plasma before reaching the anode. A drift tube defined by walls through which the ion beam passes before reaching the workpiece is opened into by the aperture opens into the tube. A series of parallel, linear magnets are positioned perpendicular to the general path of the ion beam. The adjacent poles of adjacent magnets are of opposite polarity.
    • 提供离子注入机用于将离子注入到工件中。 离子注入机包括用于产生离子束并将其引导到工件的表面的装置和用于产生等离子体以中和离子束和工件表面的等离子体发生器的装置。 等离子体发生器具有由壁限定的等离子体发生器室,用于在室中产生的等离子体的相对较窄的出口孔,以离开室以中和来自阴极和阴极以及与阴极隔离的工件表面,阴极和阳极 房间。 等离子体发生器还具有布置在等离子体发生器室内的磁体,邻近室壁以产生磁场,以使从阴极发射的一次电子直接到达阳极。 等离子体发生器还具有导电屏蔽,其位于阳极和磁体之间的室内,屏蔽具有选择用于偏转电子的电位,磁场和导电屏蔽在操作期间有效以使来自阴极的电子延伸 在室内电离气体以在到达阳极之前产生等离子体的路径。 由到达工件的离子束通过的由壁限定的漂移管通过孔打开进入管中。 一系列平行的线性磁体垂直于离子束的通用路径定位。 相邻磁体的相邻磁极具有相反的极性。
    • 38. 发明授权
    • Methods and apparatus for electron beam assisted etching at low temperatures
    • 低温电子束辅助蚀刻的方法和装置
    • US08202440B1
    • 2012-06-19
    • US11670928
    • 2007-02-02
    • Mehran Nasser-GhodsiYing WangHarrison ChinAnne TestoniR. Chris Burns
    • Mehran Nasser-GhodsiYing WangHarrison ChinAnne TestoniR. Chris Burns
    • C03C15/00C23F1/00
    • C23F4/00H01L21/32136
    • Disclosed are methods and apparatus for etching a sample, such as a semiconductor device or wafer. In general terms, embodiments of the present invention allow dry etching of a material on a sample, such as a copper material, at room temperature using a reactive substance, such as a chorine based gas. For example, the mechanisms of the present invention allow precise etching of a copper material to produce fine feature patterns without heating up the whole device or substrate to an elevated temperature such as 50° C. and above. The etching is assisted by simultaneously scanning a charged particle beam, such as an electron beam, and a photon beam, such as a laser beam, over a same target area of the sample while the reactive substance is introduced near the same target area. The reactive substance, charged particle beam, and photon beam act in combination to etch the sample at the target area. For example, a copper layer may be etched using the mechanisms of the present invention.
    • 公开了用于蚀刻诸如半导体器件或晶片的样品的方法和装置。 一般来说,本发明的实施方案允许使用反应性物质如基于氯化物的气体在室温下在样品(例如铜材料)上干燥蚀刻材料。 例如,本发明的机构允许铜材料的精确蚀刻以产生精细的特征图案,而不会将整个装置或基板加热到升高的温度,例如50℃及以上。 通过在样品的相同目标区域上同时扫描诸如电子束的带电粒子束和诸如激光束的光子束来辅助蚀刻,同时将反应物质引入到相同目标区域附近。 反应物质,带电粒子束和光子束组合起来,以在目标区域刻蚀样品。 例如,可以使用本发明的机构蚀刻铜层。
    • 39. 发明授权
    • Electron generation and delivery system for contamination sensitive emitters
    • 用于污染敏感发射器的电子发射和传输系统
    • US08188451B1
    • 2012-05-29
    • US12561969
    • 2009-09-17
    • Mehran Nasser-Ghodsi
    • Mehran Nasser-Ghodsi
    • H01J1/304H01J3/12
    • H01J37/073H01J37/265H01J2237/022H01J2237/06341H01J2237/0653
    • Contamination may be removed from an emitter tip of a field emitter during operation of the emitter tip in a system having an electron beam column having an electrode with a beam defining aperture, an electron collector located proximate to the beam defining aperture between the electrode and the field emitter, and an electron deflector located between the emitter tip and the electron collector. At regular predetermined intervals an electron beam from the emitter tip may be deflected away from a path through the beam defining aperture and onto the electron collector. An electron beam current to the electron collector may be determined and the emitter tip may be flash heated if the current to the electron collector is below a threshold.
    • 在具有电子束列的电子束列的系统中,在发射极尖端的操作期间,可以从场致发射体的发射极尖端去除污染,电子束具有限定孔的光束,位于电极和电极之间的光束限定孔附近的电子收集器 位于发射极尖端和电子收集器之间的电子偏转器。 以规则的预定间隔,来自发射极尖端的电子束可以偏离通过光束限定孔径的路径并且到电子收集器上。 可以确定到电子收集器的电子束电流,并且如果到电子收集器的电流低于阈值,则可以将发射极尖端闪光加热。