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31. 发明授权

US08506362B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08506362B2
公开(公告)日：2013-08-13
申请号：US12667891
申请日：2008-07-08
申请人： Dai Fukushima , Atsushi Shigeta , Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
发明人： Dai Fukushima , Atsushi Shigeta , Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
IPC分类号： B24B7/26
CPC分类号： B24B21/002 , B24B9/065 , H01L21/02021
摘要： A polishing apparatus includes a substrate holder configured to hold and rotate a substrate, a press pad configured to press a polishing tape having a polishing surface against a bevel portion of the substrate held by the substrate holder, and a feeding mechanism configured to cause the polishing tape to travel in its longitudinal direction. The press pad includes a hard member having a pressing surface for pressing the bevel portion of the substrate through the polishing tape, and at least one elastic member for pressing the hard member against the bevel portion of the substrate through the belt-shaped polishing tool.
摘要翻译：抛光装置包括：基板保持器，其构造成保持和旋转基板;压垫，其构造成将具有抛光表面的抛光带压靠在由基板保持器保持的基板的斜面部分上;以及馈送机构，其构造成使抛光胶带沿其纵向行进。压垫包括具有用于通过研磨带挤压基板的斜面部分的按压表面的硬质部件和用于通过带状抛光工具将硬质部件压靠在基板的斜面部分上的至少一个弹性部件。

32. 发明授权

US07976361B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US07976361B2
公开(公告)日：2011-07-12
申请号：US12213186
申请日：2008-06-16
申请人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenya Ito
发明人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenya Ito
IPC分类号： B24B1/00
CPC分类号： B24B21/002 , B24B9/065 , H01L21/68707 , H01L21/68792
摘要： A polishing apparatus is suitable for use in polishing a periphery of a substrate, such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold a workpiece and a polishing head configured to bring a polishing tape into contact with the workpiece. The polishing apparatus also includes a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot at a predetermined point.
摘要翻译：抛光装置适用于抛光半导体晶片等基板的周边。抛光装置包括：保持部，其构造成保持工件;以及抛光头，其被配置为使研磨带与工件接触。抛光装置还包括供给卷轴，其构造成将抛光带供给到抛光头，构造成重绕与工件接触的研磨带的倒带卷轴和摆动机构，其构造成使抛光头与第一抛光头进行摆动运动，其枢轴在预定点。

33. 发明申请

US20090325465A1 POLISHING APPARATUS, POLISHING METHOD, AND PROCESSING APPARATUS 有权
标题翻译：抛光装置，抛光方法和加工装置
公开(公告)号：US20090325465A1
公开(公告)日：2009-12-31
申请号：US12310364
申请日：2007-10-02
申请人： Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
发明人： Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
IPC分类号： B24B49/12 , B24B21/18 , B24B9/08
CPC分类号： B24B21/20 , B24B21/004 , B24B21/04
摘要： The present invention provides a polishing apparatus and a polishing method capable of calculating outside diameters of rolls of a polishing tape on a polishing-tape supply reel and a polishing-tape recovery reel and capable of calculating a remaining amount of the polishing tape and a consumption of the polishing tape from the outside diameters of the rolls. This polishing apparatus includes a polishing-tape supply reel (46), a polishing head (44), a polishing-tape drawing-out mechanism G1, and a polishing-tape supply and recovery mechanism (45) configured to recover the polishing tape (43) from the polishing-tape supply reel (46) via the polishing head (44). The polishing-tape supply and recovery mechanism (45) includes a motor Mb adapted to apply a torque to the polishing-tape supply reel (46) so as to exert a predetermined tension on the polishing tape (43) traveling through the polishing head (44), and a rotation angle detector REa adapted to detect a rotation angle of the polishing-tape supply reel (46).
摘要翻译：本发明提供一种抛光装置和抛光方法，其能够计算研磨带供给卷轴和抛光带回收卷轴上的研磨带的辊的外径，并且能够计算研磨带的剩余量和消耗量的研磨带的外径。该抛光装置包括：抛光带供给卷轴（46），研磨头（44），研磨带引出机构G1和被配置为回收研磨带的研磨带供给和恢复机构（45） 43）从研磨带供给卷轴（46）经由研磨头（44）。抛光带供给和恢复机构（45）包括电动机Mb，该电动机Mb适于向抛光带供给卷轴（46）施加扭矩，以便在穿过抛光头（3）的抛光带（43）上施加预定的张力 44）和适于检测研磨带供给卷轴（46）的旋转角度的旋转角度检测器REa。

34. 发明申请

US20080200100A1 Substrate Processing Apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US20080200100A1
公开(公告)日：2008-08-21
申请号：US11630512
申请日：2006-04-18
申请人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
发明人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
IPC分类号： B24B9/06 , H01L21/304 , B24B49/12
CPC分类号： H01L21/67219 , B24B9/065 , B24B49/04 , H01L21/302 , H01L21/461 , H01L21/67253 , H01L21/68707 , H01L21/68728
摘要： A substrate processing apparatus (1) includes first and second polishing units (70A, 70B) for polishing a peripheral portion of a substrate (W), a primary cleaning unit (100) for cleaning the substrate (W), a secondary cleaning and drying unit (110) for drying the substrate (W) cleaned in the primary cleaning unit (100), and a measurement unit (30) for measuring the peripheral portion of the substrate (W). The measurement unit (30) includes a mechanism for measurement required for polishing in the first and second polishing units (70A and 70B), such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.
摘要翻译：一种基板处理装置（1）包括：用于研磨基板周边部分的第一和第二研磨单元（70A，70B）;用于清洗基板（W）的主清洁单元（100），二次清洗以及用于干燥在主清洗单元（100）中清洁的基板（W）的干燥单元（110），以及用于测量基板（W）的周边部分的测量单元（30）。测量单元（30）包括用于在第一和第二研磨单元（70A和70B）中抛光所需的测量机构，例如直径测量机构，横截面形状测量机构或表面状态测量机构。

35. 发明授权

US06824613B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US06824613B2
公开(公告)日：2004-11-30
申请号：US10156791
申请日：2002-05-30
申请人： Naoki Dai , Masaya Seki , Akihiro Yazawa , Toshio Yokoyama , Akira Owatari
发明人： Naoki Dai , Masaya Seki , Akihiro Yazawa , Toshio Yokoyama , Akira Owatari
IPC分类号： B05C1102
CPC分类号： H01L21/67051 , C23C18/1632 , H01L21/67046 , H01L21/67742 , Y10S134/902 , Y10S414/137 , Y10S414/141
摘要： A substrate processing apparatus can efficiently form, e.g. by electroless plating, an interconnects-protective layer on the surface of a substrate at a low initial cost for the apparatus and a low running cost without the need for a wide installation space. The substrate processing apparatus includes a loading/unloading and cleaning area accommodating a first transfer robot which has a hand adapted for handling a dry substrate and a hand adapted for handling a wet substrate, a loading port which loads a substrate cassette that houses a substrate, and a cleaning unit for cleaning a substrate. A plating treatment area accommodates a second transfer robot which has a back surface-attracting type of hand provided with a reversing mechanism, a pretreatment unit for carrying out pretreatment of a substrate before plating, and a plating treatment unit for carrying out plating treatment of the substrate.
摘要翻译：基板处理装置可以有效地形成，例如，通过化学镀，在基板的表面上以设备的初始成本低的布线保护层和低的运行成本，而不需要宽的安装空间。基板处理装置包括容纳第一传送机器人的装载/卸载和清洁区域，第一传送机器人具有适于处理干燥基板的手和适于处理湿基板的手，装载容纳基板的基板盒的装载口，以及用于清洁基板的清洁单元。电镀处理区域容纳具有设置有反转机构的背面吸引型手的第二传送机器人，用于在电镀之前进行基板的预处理的预处理单元和用于对电镀处理进行电镀处理的电镀处理单元基质。

36. 发明授权

US09138854B2 Polishing apparatus 有权
公开(公告)号：US09138854B2
公开(公告)日：2015-09-22
申请号：US12379983
申请日：2009-03-05
申请人： Kazuaki Maeda , Tamami Takahashi , Masaya Seki , Hiroaki Kusa
发明人： Kazuaki Maeda , Tamami Takahashi , Masaya Seki , Hiroaki Kusa
IPC分类号： B24B9/02 , B24B21/00 , B24B21/06 , B24B21/08 , B24B37/04
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/06 , B24B21/08 , B24B37/04 , B24B41/06
摘要： A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

37. 发明授权

US08506363B2 Substrate holder and substrate holding method 有权
标题翻译：基板支架和基板保持方法
公开(公告)号：US08506363B2
公开(公告)日：2013-08-13
申请号：US12654561
申请日：2009-12-23
申请人： Tamami Takahashi , Hiroaki Kusa , Masaya Seki
发明人： Tamami Takahashi , Hiroaki Kusa , Masaya Seki
IPC分类号： B24B29/02
CPC分类号： H01L21/68792 , B23Q3/088 , B24B37/30 , B24B41/068 , H01L21/6838 , H01L21/6875
摘要： A substrate holder is a mechanism for holding a substrate, to be polished, by vacuum suction. The substrate holder includes a substrate-holding stage having a suction surface for the substrate, and a fluid passage selectively coupled to a vacuum source and a fluid supply source. The suction surface has a plurality of closed sections surrounded by convexities, and the fluid passage includes a plurality of communication passages which are in fluid communication with the plurality of closed segments respectively and independently.
摘要翻译：衬底保持器是用于通过真空抽吸来保持待抛光的衬底的机构。衬底保持器包括具有用于衬底的吸入表面的衬底保持台和选择性地耦合到真空源和流体供应源的流体通道。抽吸面具有由凸部包围的多个封闭部分，并且流体通道包括分别和独立地与多个封闭部分流体连通的多个连通通道。

38. 发明申请

US20110165825A1 POLISHING APPARATUS 有权
标题翻译：抛光装置
公开(公告)号：US20110165825A1
公开(公告)日：2011-07-07
申请号：US12673294
申请日：2008-07-23
申请人： Norio Kimura , Kenya Ito , Tamami Takahashi , Masaya Seki
发明人： Norio Kimura , Kenya Ito , Tamami Takahashi , Masaya Seki
IPC分类号： B24B9/00
CPC分类号： B24B9/065
摘要： A polishing apparatus according to the present invention is a polishing apparatus for polishing a periphery (a bevel portion, a notch portion, an edge-cut portion) of a substrate (W) by bringing a polishing tool (41) into sliding contact with the periphery of the substrate. The polishing apparatus includes a substrate holder (20) configured to hold the substrate (W); and a polishing head (42) configured to polish the periphery of the substrate (W) held by the substrate holder (20) using the polishing tool (41). The polishing head (42) includes a press pad (50) for pressing the polishing tool (41) against the periphery of the substrate (W), and a linear motor (90) configured to reciprocate the press pad (50).
摘要翻译：根据本发明的研磨装置是通过使研磨工具（41）与所述基板（W）滑动接触来研磨基板（W）的周边（斜面部，切口部，边缘切断部）的研磨装置衬底周边。抛光装置包括：基板保持架（20），其构造成保持基板（W）; 以及抛光头（42），其被配置为使用所述抛光工具（41）抛光由所述基板保持器（20）保持的所述基板（W）的周边。抛光头（42）包括用于将抛光工具（41）压靠在基板（W）的周边上的压垫（50）和构造成使压垫（50）往复运动的直线电动机（90）。

39. 发明授权

US06719300B2 Metal gasket 有权
标题翻译：金属垫片
公开(公告)号：US06719300B2
公开(公告)日：2004-04-13
申请号：US09771786
申请日：2001-01-29
申请人： Michio Fujino , Katsunori Ueda , Toshihiko Kumasaka , Masaya Seki
发明人： Michio Fujino , Katsunori Ueda , Toshihiko Kumasaka , Masaya Seki
IPC分类号： F02F1100
CPC分类号： F16J15/123 , F16J15/0818 , F16J15/14 , F16J2015/0856
摘要： A metal gasket for sealing a region whereat there exists three pairs of sets of opposing surfaces between a cylinder block, a chain case and a cylinder head of a chain driving engine. The metal gasket includes an elastic seal member provided on an inner rim of a chain opening formed in said metal gasket, and a storing structure for liquid gasket material used for sealing. The storing structure defined is an enlargement of the chain opening oriented to coincide with a juncture of the region whereat three pairs of opposing surface areas exist, the enlargement defining a cavity in which is housed liquid gasket material and a through hole is provided externally of the cavity.
摘要翻译：一种用于密封在链轮驱动发动机的气缸体，链条壳体和气缸盖之间存在三对相对表面的区域的金属衬垫。金属垫圈包括设置在形成在所述金属垫圈中的链条开口的内缘上的弹性密封件，以及用于密封的液体垫圈材料的储存结构。定义的存储结构是链开口的放大，其定向为与存在三对相对表面区域的区域的接合部重合，限定其中容纳有液体垫圈材料的空腔的扩大部和通孔设置在通孔的外部腔。

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