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    • 40. 发明申请
    • LIQUID FOR PROTECTING COPPER WIRING SURFACE AND METHOD FOR MANUFACTURING SEMICONDUCTOR CIRCUIT ELEMENT
    • 用于保护铜线表面的液体和制造半导体电路元件的方法
    • US20110212617A1
    • 2011-09-01
    • US13062365
    • 2009-09-02
    • Kenji YamadaKenji ShimadaHiroshi Matsunaga
    • Kenji YamadaKenji ShimadaHiroshi Matsunaga
    • H01L21/28C09D7/00
    • H01L21/321H01L21/02074
    • A copper wiring material surface protective liquid is provided that is used in production of a semiconductor circuit device containing copper wiring, and consists of an aqueous solvent and an acetylene alcohol compound containing at least 3-phenyl-2-propyn-1-ol. A method for producing a semiconductor circuit device is provided that contains: forming an insulating film and/or a diffusion preventing film on a silicon substrate; then forming a copper film by a sputtering; then forming a copper film or a copper alloy film containing 80% by mass or more of copper thereon by a plating method; and flattening the film by a chemical mechanical polishing (CMP) method, thereby providing a semiconductor substrate containing a flattened copper wiring, in which the semiconductor substrate having an exposed surface of a copper wiring material is treated by making in contact with the copper wiring material surface protective liquid.
    • 提供铜线材料表面保护液,其用于生产含有铜布线的半导体电路器件,并由含水溶剂和至少含有3-苯基-2-丙炔-1-醇的乙炔醇化合物组成。 提供一种制造半导体电路器件的方法,其包括:在硅衬底上形成绝缘膜和/或防扩散膜; 然后通过溅射形成铜膜; 然后通过电镀法形成含有80质量%以上的铜的铜膜或铜合金膜; 并通过化学机械抛光(CMP)方法使膜平坦化,从而提供含有扁平铜布线的半导体基板,其中通过与铜布线材料接触来处理具有铜布线材料的暴露表面的半导体基板 表面保护液。