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31. 发明申请

US20080036598A1 TAMPER-PROOF STRUCTURES FOR PROTECTIG ELECTRONIC MODULES 失效
标题翻译：用于防护电子模块的防篡改结构
公开(公告)号：US20080036598A1
公开(公告)日：2008-02-14
申请号：US11680120
申请日：2007-02-28
申请人： Stefano Oggioni
发明人： Stefano Oggioni
IPC分类号： G08B13/14
CPC分类号： G06F21/87 , H05K1/0275 , H05K2201/10151 , Y10T29/49155 , Y10T29/4916
摘要： A tamper-proof structure for protecting an electronic module, comprising a pattern of signal lines having a highly unpredictable layout, which is an approximation of a space-filling curve obtained by the replication of at least one elementary space element having an inscribed base curve inscribed therein. The base curve is adapted, by replication of the elementary space element, to generate an approximation of an at least two-dimensional space-filling curve, the replication being such that an end of the base curve in one elementary space element is connected to the end of the base curve in another, adjacent elementary space element of the replication.
摘要翻译：一种用于保护电子模块的防篡改结构，包括具有高度不可预测的布局的信号线图案，其是通过复制具有内切基础曲线的内插的至少一个基本空间元件而获得的空间填充曲线的近似值其中。基本曲线通过基本空间元素的复制来适应以产生至少二维空间填充曲线的近似，该复制使得一个基本空间元素中的基本曲线的一端连接到基本曲线的末端在复制的另一个相邻的基本空间元素中。

32. 发明申请

US20080032520A1 LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES 有权
公开(公告)号：US20080032520A1
公开(公告)日：2008-02-07
申请号：US11865305
申请日：2007-10-01
申请人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号： H01R12/16
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

33. 发明申请

US20080023845A1 LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES 有权
公开(公告)号：US20080023845A1
公开(公告)日：2008-01-31
申请号：US11865395
申请日：2007-10-01
申请人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号： H01L23/48
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

34. 发明申请

US20080020603A1 LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES 失效
公开(公告)号：US20080020603A1
公开(公告)日：2008-01-24
申请号：US11865321
申请日：2007-10-01
申请人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号： H01R12/22
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

35. 发明申请

US20080020596A1 LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES 有权
标题翻译：土地网阵列（LGA）利用金属激光器热电偶和其他多点接触几何
公开(公告)号：US20080020596A1
公开(公告)日：2008-01-24
申请号：US11865231
申请日：2007-10-01
申请人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
摘要翻译：包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。插入件在横截面中具有半环形结构，并由介电弹性体材料构成。多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触飞机还提供了一种制造焊盘栅格阵列中介层结构的方法。

36. 发明授权

US07319197B2 Structure of stacked vias in multiple layer electrode device carriers 有权
标题翻译：多层电极器件载体中堆叠通孔的结构
公开(公告)号：US07319197B2
公开(公告)日：2008-01-15
申请号：US10515511
申请日：2003-04-18
申请人： Stefano Oggioni , Michele Castriotta , Gianluca Rogiani , Mauro Spreafico , Giorgio Viero
发明人： Stefano Oggioni , Michele Castriotta , Gianluca Rogiani , Mauro Spreafico , Giorgio Viero
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H05K1/0251 , H01L23/49827 , H01L23/66 , H01L2223/6616 , H01L2924/0002 , H01L2924/15173 , H01L2924/3011 , H05K1/112 , H05K1/115 , H05K1/116 , H05K3/4602 , H05K2201/09236 , H05K2201/09381 , H05K2201/09536 , H05K2201/096 , H05K2201/0979 , H01L2924/00
摘要： A stacked via structure (200) adapted to transmit high frequency signals or high intensity current through conductive layers of an electronic device carrier is disclosed. The stacked via structure comprises at least three conductive tracks (205a, 205b, 205c) belonging to three adjacent conductive layers (110a, 110b, 110c) separated by dielectric layers (120), aligned according to z axis. Connections between these conductive tracks are done with at least two vias (210, 215) between each conductive layer. Vias connected to one side of a conductive track are disposed such that they are not aligned with the ones connected to the other side according to z axis.
摘要翻译：公开了一种适于通过电子设备载体的导电层传输高频信号或高强度电流的堆叠通孔结构（200）。叠置的通孔结构包括属于由电介质层（120）分开的根据z轴对准的三个相邻导电层（110a，110b，110c）的至少三个导电轨道（205a，205b，205c）。这些导电轨道之间的连接通过在每个导电层之间的至少两个通孔（210,215）进行。连接到导电轨道的一侧的通孔布置成使得它们不与根据z轴连接到另一侧的那些对准。

37. 发明申请

US20070298624A1 LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES 有权
标题翻译：土地网阵列（LGA）利用金属激光器热电偶和其他多点接触几何
公开(公告)号：US20070298624A1
公开(公告)日：2007-12-27
申请号：US11365366
申请日：2006-03-01
申请人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
摘要翻译：包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。插入件在横截面中具有半环形结构，并由介电弹性体材料构成。多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触飞机还提供了一种制造焊盘栅格阵列中介层结构的方法。

38. 发明授权

US06967398B2 Module power distribution network 失效
标题翻译：模块配电网络
公开(公告)号：US06967398B2
公开(公告)日：2005-11-22
申请号：US10906152
申请日：2005-02-04
申请人： Roland Frech , Bernd Garben , Erich Klink , Stefano Oggioni
发明人： Roland Frech , Bernd Garben , Erich Klink , Stefano Oggioni
IPC分类号： H01L23/12 , H01L23/498 , H05K1/00 , H05K1/02 , H01L23/52
CPC分类号： H05K1/0216 , H01L23/49822 , H01L2224/16 , H01L2224/16235 , H01L2924/09701 , H01L2924/15192 , H01L2924/19105 , H01L2924/3011 , H05K1/0231 , H05K1/0298 , H05K2201/09327 , H05K2201/10522 , H05K2201/10734
摘要： A multi-layer module for packaging an electronic component comprises an uppermost electrically conductive layer for mounting the component, a plurality of electrically insulative layers, and a plurality of electrically conductive layers disposed between the insulative layers. The electrically conductive layers form staggered placements of at least three voltage and/or ground distribution layers close to the module surface without signal wiring layers in between, and signal distribution layers comprising signal conductors. Vias form conductive paths through the insulative layers and conductive layers; the corresponding signal, voltage and ground distribution layers are electrically connected with each other and with the uppermost layer.
摘要翻译：用于封装电子部件的多层模块包括用于安装部件的最上层的导电层，多个电绝缘层以及设置在绝缘层之间的多个导电层。导电层在靠近模块表面的至少三个电压和/或接地分布层之间形成交错布置，而其间不包括信号布线层，以及包括信号导体的信号分布层。通孔形成穿过绝缘层和导电层的导电路径; 相应的信号，电压和地面分布层彼此电连接并与最上层电连接。

39. 发明授权

US06710258B2 Circuitized substrate for high-frequency applications 有权
标题翻译：电路板用于高频应用
公开(公告)号：US06710258B2
公开(公告)日：2004-03-23
申请号：US10125624
申请日：2002-04-18
申请人： Stefano Oggioni , Roberto Ravanelli
发明人： Stefano Oggioni , Roberto Ravanelli
IPC分类号： H05K103
CPC分类号： H05K1/0222 , H01L23/49827 , H01L23/66 , H01L2223/6616 , H01L2223/6622 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01322 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H05K1/112 , H05K3/429 , H05K2201/093 , H05K2201/09618 , H05K2201/0969 , H05K2201/09809 , H05K2201/10734 , H01L2224/05599
摘要： A multi-layered circuitized substrate for high-frequency applications. Conductive via-holes extend between two non-adjacent conductive layers for transmitting high-frequency signals therebetween. For each via-hole, shielding rings connectable to a reference voltage are provided, each ring formed in a corresponding intermediate conductive layer between the two non-adjacent conductive layers. The rings define a shielding coaxial structure for the via-hole. Preferably, the intermediate conductive layers are spaced apart from the via-hole, and particularly from respective lands at the ends thereof, in order to reduce stray capacitance associated with the via-hole without losing the shielding effect provided by the rings.
摘要翻译：一种用于高频应用的多层电路衬底。导电通孔在两个不相邻的导电层之间延伸，用于在它们之间传输高频信号。对于每个通孔，提供可连接到参考电压的屏蔽环，每个环形成在两个不相邻的导电层之间的对应的中间导电层中。这些环限定了用于通孔的屏蔽同轴结构。优选地，中间导电层与通孔间隔开，特别是从其端部的相应焊盘间隔开，以便减少与通孔相关联的杂散电容，而不会损失由环提供的屏蔽效应。

40. 发明授权

US06398081B2 Volumetric pump 有权
标题翻译：容量泵
公开(公告)号：US06398081B2
公开(公告)日：2002-06-04
申请号：US09863966
申请日：2001-05-23
申请人： Luigi Bassi , Stefano Oggioni
发明人： Luigi Bassi , Stefano Oggioni
IPC分类号： B65D4700
CPC分类号： G01F11/02 , F04B7/045 , F04B13/00 , F04B15/02
摘要： A volumetric pump for dispensing a controlled and continuous flow of viscous fluid. The pump according to a preferred embodiment of the present invention can ideally dispense from a minimum of 1 mg/sec to 1 g/sec for fluids with a viscosity from 2,000,000 cps (Centipoise) down to 10,000 cps. Such flexibility in the range of viscosity extends the application fields of this pump to microelectronics as well as automotive and consumer products manufacturing. Two cams mounted with an opposing position of 180° on the same shaft generate an alternate motion of two concentric pistons. The alternate movement of the external piston in one phase pumps out the material through a dispensing needle and allows in the returning phase the viscous fluid to be charged in the dispensing chamber from the feeding container. The alternate movement opens and closes the vents during the different working phases.
摘要翻译：用于分配受控和连续流动的粘性流体的体积泵。根据本发明的优选实施方案的泵可以理想地从粘度从2,000,000cps（厘泊）降低到10,000cps的流体中分配至少1mg / sec至1g / sec。在粘度范围内的这种灵活性将该泵的应用领域扩展到微电子以及汽车和消费品制造。安装在相同轴上的相对位置为180°的两个凸轮产生两个同心活塞的交替运动。外部活塞在一个相中的交替运动通过分配针抽出材料，并且允许在返回阶段将粘性流体从进料容器装入分配室中。替代运动在不同的工作阶段打开和关闭通风口。

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