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    • 36. 发明授权
    • Method of making EEPROM transistor for a DRAM
    • 制造用于DRAM的EEPROM晶体管的方法
    • US06391755B2
    • 2002-05-21
    • US09361471
    • 1999-07-27
    • Manny K. F. MaYauh-Ching Liu
    • Manny K. F. MaYauh-Ching Liu
    • H01L213205
    • H01L27/10852H01L27/105H01L27/1052
    • A floating gate transistor is formed by simultaneously creating buried contact openings on both EEPROM transistor gates and DRAM access transistor source/drain diffusions. Conventional DRAM process steps are used to form cell storage capacitors in all the buried contact openings, including buried contact openings on EEPROM transistor gates. An EEPROM transistor gate and its associated cell storage capacitor bottom plate together forms a floating gate completely surrounded by insulating material. The top cell storage capacitor plate on an EEPROM transistor is used as a control gate to apply programming voltages to the EEPROM transistor. Reading, writing, and erasing the EEPROM element are analogous to conventional floating-gate tunneling oxide (FLOTOX) EEPROM devices. In this way, existing DRAM process steps are used to implement an EEPROM floating gate transistor nonvolatile memory element.
    • 通过在EEPROM晶体管栅极和DRAM存取晶体管源极/漏极扩散两者上同时产生掩埋接触开口形成浮栅晶体管。 常规DRAM工艺步骤用于在所有掩埋的接触开口中形成电池存储电容器,包括EEPROM晶体管栅极上的埋入式接触开口。 EEPROM晶体管栅极及其相关的电池存储电容器底板一起形成完全被绝缘材料包围的浮动栅极。 EEPROM晶体管上的顶部单元存储电容器板用作控制栅极,以将编程电压施加到EEPROM晶体管。 读取,写入和擦除EEPROM元件类似于常规浮栅隧道氧化物(FLOTOX)EEPROM器件。 以这种方式,现有的DRAM处理步骤用于实现EEPROM浮栅晶体管非易失性存储元件。
    • 40. 发明授权
    • Super-voltage circuit with a fast reset
    • 具有快速复位的超压电路
    • US06060896A
    • 2000-05-09
    • US977339
    • 1997-11-24
    • Manny K. F. MaJoseph C. Sher
    • Manny K. F. MaJoseph C. Sher
    • G01R31/317G01R31/28
    • G01R31/31701
    • A super-voltage circuit with a fast reset capability is formed in an integrated circuit for generating a test mode logic state for testing other circuits in the same integrated circuit. The super-voltage circuit includes a sensing circuit, a reset circuit, and an output circuit connected to both the sensing circuit and the reset circuit. When the input voltage receives a super-voltage which is higher than either the logic high or low voltages, the sensing circuit generates at its output a high voltage. The reset circuit also receiving the same input voltage as the sensing circuit generates at its output a logic low state when the input voltage is at the super-voltage or logic high voltage. When the sensing circuit is generating the high voltage and the reset circuit is generating the logic low state the output circuit generates at its output a logic low voltage. The logic low voltage signifies that the integrated circuit is now in the super-voltage test mode. To terminate the test mode, the super-voltage is removed from the input of the sensing circuit. As the input voltage falls to 0 volts, the reset circuit generates a logic high voltage. In response to the logic high voltage, the output circuit quickly resets its output to a logic high state signifying that the integrated circuit is now in a normal operational mode.
    • 在集成电路中形成具有快速复位能力的超压电路,用于产生用于测试同一集成电路中的其它电路的测试模式逻辑状态。 超级电压电路包括感测电路,复位电路和连接到感测电路和复位电路的输出电路。 当输入电压接收到高于逻辑高电平或低电压的超级电压时,感测电路在其输出端产生高电压。 当输入电压处于超电压或逻辑高电压时,复位电路还接收与感测电路在其输出端产生逻辑低电平的相同的输入电压。 当感测电路产生高电压并且复位电路产生逻辑低电平状态时,输出电路在其输出端产生逻辑低电压。 逻辑低电压表示集成电路现在处于超电压测试模式。 为了终止测试模式,从感测电路的输入端去除超电压。 当输入电压降至0伏时,复位电路产生逻辑高电压。 响应于逻辑高电压,输出电路将其输出快速复位到逻辑高电平状态,表示集成电路现在处于正常工作模式。