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31. 发明授权

US07190446B2 System for processing electronic devices 有权
标题翻译：电子设备处理系统
公开(公告)号：US07190446B2
公开(公告)日：2007-03-13
申请号：US10741862
申请日：2003-12-19
申请人： Chi Wah Cheng , Hoi Fung Tsang , Chi Yat Yeung , Wang Lung Alan Tse
发明人： Chi Wah Cheng , Hoi Fung Tsang , Chi Yat Yeung , Wang Lung Alan Tse
IPC分类号： G01N21/00
CPC分类号： G01R31/2893 , G01N21/956
摘要： A system is provided for processing electronic devices, and in particular for handling, inspecting, sorting and offloading the same. An apparatus for inspecting an electronic device comprises a holder for supporting the electronic device and a driving mechanism for moving the electronic device between an onloading position where the electronic device is placed onto the holder and an offloading position where the electronic device is removed from the holder. A first optical system between the onloading and offloading positions is configured to inspect a first surface of the electronic device while it is supported by the holder, Concurrently or subsequently, a second optical system between the onloading and offloading positions is configured to inspect a second surface of the electronic device that is opposite to the first surface while it is supported by the holder.
摘要翻译：提供一种用于处理电子设备的系统，特别是用于处理，检查，分类和卸载它们的系统。一种用于检查电子装置的装置包括一个用于支撑该电子装置的支架和一个驱动机构，用于使电子装置在电子装置放置在保持架上的装载位置和电子装置从支架上移出的卸载位置之间移动。负载和卸载位置之间的第一光学系统被配置为在由所述保持器支撑的同时检查所述电子设备的第一表面，并且所述第二光学系统在所述上载位置和卸载位置之间并行地或后续地被配置为检查所述第二表面与第一表面相对的电子设备。

32. 发明授权

US06607118B2 Apparatus and method for ball release 有权
公开(公告)号：US06607118B2
公开(公告)日：2003-08-19
申请号：US09843704
申请日：2001-04-30
申请人： Chi Wah Cheng , Ping Kong Joseph Choy , Ping Chun Benson Chong , Ka Kin Wong , Chi Fung Chan
发明人： Chi Wah Cheng , Ping Kong Joseph Choy , Ping Chun Benson Chong , Ka Kin Wong , Chi Fung Chan
IPC分类号： B23K106
CPC分类号： B23K3/0623 , B23K35/0244 , H01L21/67138 , H01L21/6838 , H05K3/3478
摘要： There is disclosed a method and apparatus for ensuring release of objects such as solder balls from a pick head in a transfer and placement apparatus, comprising causing said pick head to vibrate by applying a vibration signal to said pick head over a range of frequencies. The range of frequencies is chosen such that it bounds the resonant frequencies of the pick head which may be calculated by computer simulation.

33. 发明授权

US06386422B1 Solder reflow oven 有权
标题翻译：焊锡回流炉
公开(公告)号：US06386422B1
公开(公告)日：2002-05-14
申请号：US09847278
申请日：2001-05-03
申请人： Chi Wah Cheng , Ping Chun Benson Chong , Hoi Shuen Joseph Tang , Kai Chiu Adam Wu , Ka On Alfred Yue
发明人： Chi Wah Cheng , Ping Chun Benson Chong , Hoi Shuen Joseph Tang , Kai Chiu Adam Wu , Ka On Alfred Yue
IPC分类号： B23K100
CPC分类号： B23K1/008 , B23K2101/40
摘要： A solder reflow oven for the processing of ball grid array substrates bearing solder balls is described, comprising: input means for introducing substrates into the oven, a processing chamber within which the substrates are subject to a solder reflow process, and output means for discharging substrates from the oven for further processing or handling, and means for transferring the substrates through the processing chamber in a first direction towards the output means. The processing chamber comprises a plurality of heating and cooling zones arranged with a constant pitch in the first direction, and the transferring means is adapted to move the substrates in the first direction in stages, with each component moving a distance equal to the pitch between two zones in each stage, whereby the components are moved from zone to zone in stages. In addition each block of each heating zone and each block of each cooling zone is connected to a source of fresh gas, and each block of each heating zone is provided with means for heating the gas, and each block of each cooling zone is provided with means for cooling the gas, and each block is formed with a serpentine channel between the source of fresh gas and at least one opening through which the gas is discharged from the block towards a substrate.
摘要翻译：描述了用于处理支撑焊球的球栅阵列基板的焊料回流炉，包括：用于将基板引入烘箱的输入装置，其中基板经受焊料回流处理的处理室，以及用于放电基板的输出装置从烤箱进一步处理或处理，以及用于将基板沿着第一方向朝向输出装置传送通过处理室的装置。所述处理室包括沿所述第一方向以恒定间距排列的多个加热和冷却区，并且所述传送装置适于分阶段移动所述基板沿所述第一方向，其中每个部件移动距离等于所述第二方向之间的间距每个阶段的区域，从而分量从一个区域逐步移动到另一个区域。此外，每个加热区和每个冷却区的每个块的每个块连接到新鲜气体源，并且每个加热区的每个块设置有用于加热气体的装置，并且每个冷却区的每个块被提供有用于冷却气体的装置，并且每个块在新鲜气体源和至少一个开口之间形成有蛇形通道，气体通过该开口从块向衬底排出。

34. 发明授权

US06276598B1 Method and apparatus for ball placement 有权
标题翻译：球放置方法和装置
公开(公告)号：US06276598B1
公开(公告)日：2001-08-21
申请号：US09352368
申请日：1999-07-13
申请人： Chi Wah Cheng , Alfred Ka On Yue , Chiu Fai Wong
发明人： Chi Wah Cheng , Alfred Ka On Yue , Chiu Fai Wong
IPC分类号： B23K3704
CPC分类号： B23K3/0623 , B23K2101/40 , H05K3/3478
摘要： A method and apparatus are described for placing a plurality of balls in a predetermined array. The method and apparatus are particularly suitable for transferring solder balls to a ball grid array package. In the method the balls are transferred from a supply means 1 to a template 2 in which the balls are positioned in the desired array before being picked up by a ball pick head 3 for transfer to the final position while remaining in the desired array.
摘要翻译：描述了将多个球放置在预定阵列中的方法和装置。该方法和装置特别适用于将焊球转移到球栅阵列封装。在该方法中，球从供给装置1转移到模板2，在该模板2中，球被定位在期望的阵列中，在由拾取头3拾取之前，将球转移到最终位置，同时保持在期望的阵列中。

35. 发明授权

US5897048A Radial wire bonder and selectable side view inspection system 失效
标题翻译：径向焊线机和可选侧视检测系统
公开(公告)号：US5897048A
公开(公告)日：1999-04-27
申请号：US745680
申请日：1996-11-08
申请人： Chi Wah Cheng , Ka On Yue , Chiu Fai Wong
发明人： Chi Wah Cheng , Ka On Yue , Chiu Fai Wong
IPC分类号： H01L21/00 , H01L21/607 , H01L21/66 , H01L21/60
CPC分类号： H01L24/85 , H01L24/78 , H01L22/12 , H01L2224/05554 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/49171 , H01L2224/78301 , H01L2224/78901 , H01L2224/85181 , H01L2224/85205 , H01L2224/859 , H01L24/45 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181
摘要： A wire bonding machine has a wire bonding head that provides five directions of movement or degrees of freedom. The radial direction of movement supports the wire bonding process and reduces the moving mass of the wire bonder during the generation of the wire bonds. The wire bonding machine further includes a selectable side view inspection system. Through a group of optical components, the assembly process can be selectively viewed from either a side view or a top view. The side view of the assembly process provides for improved analysis of the wire bond quality which can be monitored by a camera.
摘要翻译：引线接合机具有提供五个运动方向或自由度的引线接合头。径向移动方向支持引线接合工艺，并且在引线接合的产生期间减少引线接合器的移动质量。引线接合机还包括可选侧视检查系统。通过一组光学部件，可以从侧视图或俯视图选择性地观看组装过程。组装过程的侧视图提供了可以通过照相机监视的线接合质量的改进分析。

36. 发明授权

US09519007B2 Handling system for testing electronic components 有权
标题翻译：电子元件检测系统
公开(公告)号：US09519007B2
公开(公告)日：2016-12-13
申请号：US13753706
申请日：2013-01-30
申请人： Chi Wah Cheng , Wang Lung Tse , Chi Kit Cheung , Cho Tao Cheung
发明人： Chi Wah Cheng , Wang Lung Tse , Chi Kit Cheung , Cho Tao Cheung
IPC分类号： G01R31/01 , G01R1/02 , G01R31/28
CPC分类号： G01R1/02 , G01R31/01 , G01R31/2891 , G01R31/2893
摘要： A handling system for testing electronic components comprises a rotary turret and pick heads mounted on the rotary turret, each pick head being configured to hold a respective electronic component provided by a supply source. A carrier system which is positionable adjacent to the rotary turret is configured to carry a plurality of electronic components. The carrier system is receivable by a testing station that is operative to simultaneously test a plurality of the electronic components which have been arranged on the carrier system. The pick heads or other transfer mechanism may transfer the electronic components onto the carrier system prior to testing the same at the testing station and remove electronic components from the carrier system after testing the same at the testing station.
摘要翻译：用于测试电子部件的处理系统包括安装在旋转转台上的旋转转台和拾取头，每个拾取头构造成保持由供应源提供的相应电子部件。可相对于旋转转台定位的载体系统构造成承载多个电子部件。载波系统可由测试台接收，该测试台可操作以同时测试已经布置在载波系统上的多个电子部件。拾取头或其他传送机构可以在测试台进行测试之前将电子部件转移到载体系统上，并在测试台上对其进行测试之后从载体系统中移除电子部件。

37. 发明授权

US09465383B2 Apparatus and method of using an imaging device for adjustment of at least one handling device for handling semiconductor components 有权
标题翻译：使用成像装置调整至少一个用于处理半导体部件的处理装置的装置和方法
公开(公告)号：US09465383B2
公开(公告)日：2016-10-11
申请号：US14311856
申请日：2014-06-23
申请人： Hing Suen Siu , Yu Sze Cheung , Chi Wah Cheng , Chung Yan Lau
发明人： Hing Suen Siu , Yu Sze Cheung , Chi Wah Cheng , Chung Yan Lau
IPC分类号： G06F7/00 , G05B19/418
CPC分类号： G05B19/4182 , G05B2219/39106 , G05B2219/40554 , G05B2219/45031 , G05B2219/45054 , Y02P90/083
摘要： Disclosed is an apparatus for handling electronic components. The apparatus comprises: i) a rotary device and a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; ii) a position-determining device for determining an arrangement of the electronic components as held by the respective pick heads; iii) a fiducial mark arranged in a position that is indicative of the arrangement of the electronic components, as determined by the position-determining device; iv) a first imaging device arranged relative to the fiducial mark; and v) at least one handling device for handling the electronic components. Specifically, the first imaging device is operable to capture at least one image comprising the fiducial mark and the at least one handling device so that a position of the at least one handling device is adjustable to align the at least one handling device with respect to the arrangement of the electronic components, based on an offset between the fiducial mark and the at least one handling device as derived from the at least one image captured by the first imaging device. A method of adjusting the position of at least one handling device of an apparatus for handling electronic components is also disclosed.
摘要翻译：公开了一种处理电子部件的装置。该装置包括：i）旋转装置和围绕旋转装置周向布置的多个拾取头，每个拾取头可操作以保持电子部件; ii）位置确定装置，用于确定由各个拾取头保持的电子部件的布置; iii）布置在由位置确定装置确定的指示电子部件的布置的位置的基准标记; iv）相对于基准标记布置的第一成像装置; 以及v）用于处理电子部件的至少一个处理装置。具体地，第一成像装置可操作以捕获包括基准标记和至少一个处理装置的至少一个图像，使得至少一个处理装置的位置是可调节的，以使至少一个处理装置相对于基于从由第一成像装置拍摄的至少一个图像得出的基准标记和至少一个处理装置之间的偏移，电子部件的布置。还公开了一种调节用于处理电子部件的装置的至少一个处理装置的位置的方法。

38. 发明授权

US08091762B1 Wedge bonding method incorporating remote pattern recognition system 有权
标题翻译：结合远程模式识别系统的楔形键合方法
公开(公告)号：US08091762B1
公开(公告)日：2012-01-10
申请号：US12962755
申请日：2010-12-08
申请人： Chi Wah Cheng , Man Kit Mui , Hon Kam Ng , Hei Lam Chang
发明人： Chi Wah Cheng , Man Kit Mui , Hon Kam Ng , Hei Lam Chang
IPC分类号： B23K31/02
CPC分类号： B23K20/004 , H01L24/85 , H01L2224/78313 , H01L2224/85 , H01L2924/00014 , H01L2224/48 , H01L2224/45099
摘要： A wire is bonded to a target surface using a rotary bond head by positioning a wedge bonding tool of the bond head over the target surface. A camera system is tilted at an oblique angle relative to an arrangement of the bond head to conduct pattern recognition of bonding points on the target surface for determining actual positions of the bonding points and an orientation between the actual positions of first and second bonding points. The bond head is moved to the actual position of the first bonding point and rotated to the determined orientation. Thereafter, the wire is bonded to the target surface at the first bonding point with the bond head.
摘要翻译：通过将接合头的楔形焊接工具定位在目标表面上，使用旋转接合头将导线结合到目标表面。照相机系统相对于接合头的布置以倾斜角倾斜，以对目标表面上的接合点进行图案识别，以确定接合点的实际位置和第一和第二接合点的实际位置之间的取向。接合头移动到第一接合点的实际位置并旋转到确定的取向。此后，在与焊接头的第一接合点处将导线接合到目标表面。

39. 发明授权

US07849847B2 Drainage apparatus for a singulation system 有权
标题翻译：排水系统的排水装置
公开(公告)号：US07849847B2
公开(公告)日：2010-12-14
申请号：US11853326
申请日：2007-09-11
申请人： Chi Wah Cheng , Lap Kei Eric Chow , Chi Hang Leung
发明人： Chi Wah Cheng , Lap Kei Eric Chow , Chi Hang Leung
IPC分类号： B28D1/02
CPC分类号： B28D5/0076 , Y10T83/242 , Y10T83/647
摘要： A singulation system for a workpiece has a carrier for mounting the workpiece during singulation and a receptacle for collecting debris formed. A driving mechanism, which is operative to move the carrier and the workpiece, is at least partially covered by a bellows. A bellows protecting cover extending over the bellows is coupled between the carrier and the receptacle and is operative to guide debris from the carrier along its longitudinal length towards the receptacle. The bellows protecting cover further comprises side walls extending along opposite sides of its longitudinal length to prevent debris from falling off its sides.
摘要翻译：用于工件的分割系统具有用于在分割期间安装工件的载体和用于收集形成的碎屑的容器。用于移动载体和工件的驱动机构至少部分地被波纹管覆盖。延伸在波纹管上方的波纹管保护盖联接在托架和插座之间，并且可操作以沿着其纵向长度朝向容器引导载体的碎屑。波纹管保护盖还包括沿其纵向长度的相对侧延伸的侧壁，以防止碎屑从其侧面脱落。

40. 发明授权

US07258703B2 Apparatus and method for aligning devices on carriers 有权
标题翻译：用于对准载体上的装置的装置和方法
公开(公告)号：US07258703B2
公开(公告)日：2007-08-21
申请号：US11031024
申请日：2005-01-07
申请人： Chi Wah Cheng , Hoi Shuen Joseph Tang , Tim Wai Tony Mak , Chi Hang Leung
发明人： Chi Wah Cheng , Hoi Shuen Joseph Tang , Tim Wai Tony Mak , Chi Hang Leung
IPC分类号： H01L21/00
CPC分类号： G01R1/045 , Y10T29/41
摘要： An apparatus and method are provided for aligning a plurality of semiconductor devices placed on a carrier. Alignment guides are located adjacent to each device in use, and arranged such that they correspond to a desired alignment of each semiconductor device. For alignment, the semiconductor devices are held by a positioning device comprising a plurality of holders, each holder being configured to generate a force to hold a semiconductor device. Actuators are also provided that are operative to move the positioning device and holders to bias the semiconductor devices against the alignment guides to orientate the semiconductor devices until they are aligned with said alignment guides.
摘要翻译：提供一种用于对准放置在载体上的多个半导体器件的装置和方法。对准引导件位于使用中与每个设备相邻的位置，并且被布置为使得它们对应于每个半导体器件的期望对准。为了对准，半导体器件由包括多个保持器的定位装置保持，每个保持器被配置为产生保持半导体器件的力。还提供了致动器，其可操作以移动定位装置和保持器，以将半导体装置偏压抵靠对准引导件以使半导体器件定向，直到它们与所述对准引导件对准。

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