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1. 发明授权

US06386422B1 Solder reflow oven 有权
标题翻译：焊锡回流炉
公开(公告)号：US06386422B1
公开(公告)日：2002-05-14
申请号：US09847278
申请日：2001-05-03
申请人： Chi Wah Cheng , Ping Chun Benson Chong , Hoi Shuen Joseph Tang , Kai Chiu Adam Wu , Ka On Alfred Yue
发明人： Chi Wah Cheng , Ping Chun Benson Chong , Hoi Shuen Joseph Tang , Kai Chiu Adam Wu , Ka On Alfred Yue
IPC分类号： B23K100
CPC分类号： B23K1/008 , B23K2101/40
摘要： A solder reflow oven for the processing of ball grid array substrates bearing solder balls is described, comprising: input means for introducing substrates into the oven, a processing chamber within which the substrates are subject to a solder reflow process, and output means for discharging substrates from the oven for further processing or handling, and means for transferring the substrates through the processing chamber in a first direction towards the output means. The processing chamber comprises a plurality of heating and cooling zones arranged with a constant pitch in the first direction, and the transferring means is adapted to move the substrates in the first direction in stages, with each component moving a distance equal to the pitch between two zones in each stage, whereby the components are moved from zone to zone in stages. In addition each block of each heating zone and each block of each cooling zone is connected to a source of fresh gas, and each block of each heating zone is provided with means for heating the gas, and each block of each cooling zone is provided with means for cooling the gas, and each block is formed with a serpentine channel between the source of fresh gas and at least one opening through which the gas is discharged from the block towards a substrate.
摘要翻译：描述了用于处理支撑焊球的球栅阵列基板的焊料回流炉，包括：用于将基板引入烘箱的输入装置，其中基板经受焊料回流处理的处理室，以及用于放电基板的输出装置从烤箱进一步处理或处理，以及用于将基板沿着第一方向朝向输出装置传送通过处理室的装置。所述处理室包括沿所述第一方向以恒定间距排列的多个加热和冷却区，并且所述传送装置适于分阶段移动所述基板沿所述第一方向，其中每个部件移动距离等于所述第二方向之间的间距每个阶段的区域，从而分量从一个区域逐步移动到另一个区域。此外，每个加热区和每个冷却区的每个块的每个块连接到新鲜气体源，并且每个加热区的每个块设置有用于加热气体的装置，并且每个冷却区的每个块被提供有用于冷却气体的装置，并且每个块在新鲜气体源和至少一个开口之间形成有蛇形通道，气体通过该开口从块向衬底排出。

2. 发明授权

US07258703B2 Apparatus and method for aligning devices on carriers 有权
标题翻译：用于对准载体上的装置的装置和方法
公开(公告)号：US07258703B2
公开(公告)日：2007-08-21
申请号：US11031024
申请日：2005-01-07
申请人： Chi Wah Cheng , Hoi Shuen Joseph Tang , Tim Wai Tony Mak , Chi Hang Leung
发明人： Chi Wah Cheng , Hoi Shuen Joseph Tang , Tim Wai Tony Mak , Chi Hang Leung
IPC分类号： H01L21/00
CPC分类号： G01R1/045 , Y10T29/41
摘要： An apparatus and method are provided for aligning a plurality of semiconductor devices placed on a carrier. Alignment guides are located adjacent to each device in use, and arranged such that they correspond to a desired alignment of each semiconductor device. For alignment, the semiconductor devices are held by a positioning device comprising a plurality of holders, each holder being configured to generate a force to hold a semiconductor device. Actuators are also provided that are operative to move the positioning device and holders to bias the semiconductor devices against the alignment guides to orientate the semiconductor devices until they are aligned with said alignment guides.
摘要翻译：提供一种用于对准放置在载体上的多个半导体器件的装置和方法。对准引导件位于使用中与每个设备相邻的位置，并且被布置为使得它们对应于每个半导体器件的期望对准。为了对准，半导体器件由包括多个保持器的定位装置保持，每个保持器被配置为产生保持半导体器件的力。还提供了致动器，其可操作以移动定位装置和保持器，以将半导体装置偏压抵靠对准引导件以使半导体器件定向，直到它们与所述对准引导件对准。

3. 发明授权

US07726540B2 Apparatus and method for arranging devices for processing 有权
标题翻译：用于处理装置的装置和方法
公开(公告)号：US07726540B2
公开(公告)日：2010-06-01
申请号：US11301064
申请日：2005-12-12
申请人： Chi Wah Cheng , Hoi Shuen Joseph Tang , Tim Wai Tony Mak , See Lok Chan
发明人： Chi Wah Cheng , Hoi Shuen Joseph Tang , Tim Wai Tony Mak , See Lok Chan
IPC分类号： B23K1/14 , B23K5/22 , H01R43/00
CPC分类号： B23K3/087 , B23K2101/42 , G01R31/2893 , Y10T29/53261
摘要： An apparatus is provided for arranging for processing a semiconductor device having surface components on its surface. A device support comprising a set of protrusions for contacting a surface of the semiconductor device supports the semiconductor device on a plane. The protrusions are arranged and positioned such that they avoid contact with the surface components on the surface. In order to grip the semiconductor device supported on the plane, a clamping device having a first set of clamps is configured for gripping the semiconductor device along a first axis and a second set of clamps is configured for gripping the semiconductor device along a second axis perpendicular to the first axis.
摘要翻译：提供了一种用于布置用于处理其表面上具有表面成分的半导体器件的装置。包括用于接触半导体器件的表面的一组突起的器件支撑件在平面上支撑半导体器件。突起被布置和定位成使得它们避免与表面上的表面部件接触。为了夹持支撑在平面上的半导体器件，具有第一组夹具的夹持装置被配置为沿着第一轴夹持半导体器件，并且第二组夹具被配置为沿着垂直于第二轴的夹持半导体器件到第一轴。

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