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31. 发明申请

US20070128833A1 Manufacturing method of semiconductor device 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US20070128833A1
公开(公告)日：2007-06-07
申请号：US11600070
申请日：2006-11-16
申请人： Tomoyuki Aoki , Tomoko Tamura , Takuya Tsurume , Koji Dairiki
发明人： Tomoyuki Aoki , Tomoko Tamura , Takuya Tsurume , Koji Dairiki
IPC分类号： H01L21/00
CPC分类号： H01L27/1266 , H01L21/78 , H01L27/1214
摘要： It is an object to provide a manufacturing method of a semiconductor device with high reliability. A plurality of first semiconductor integrated circuits, a plurality of second semiconductor integrated circuits each of which is arranged to be adjacent to one of the first semiconductor integrated circuits, a plurality of third semiconductor integrated circuits each of which is arranged to be adjacent to one of the first semiconductor integrated circuits and one of the second semiconductor integrated circuits, and a plurality of fourth semiconductor integrated circuits each of which is arranged to be adjacent to one of the first semiconductor integrated circuits, one of the second semiconductor integrated circuits, and one of the third semiconductor integrated circuits are formed over a first substrate. The first semiconductor integrated circuits are transferred to a second substrate. A first protective layer is formed to cover the first semiconductor integrated circuits and a surface of the second substrate in the periphery of the first semiconductor integrated circuits. The second substrate and the first protective layer are divided so that the plurality of the first semiconductor integrated circuits is divided into individual pieces and part of the second substrate remains in the periphery of the first semiconductor integrated circuits. Accordingly, a semiconductor device having the first semiconductor integrated circuit is manufactured.
摘要翻译：本发明的目的是提供一种具有高可靠性的半导体器件的制造方法。多个第一半导体集成电路，多个第二半导体集成电路，每个第二半导体集成电路被布置为与第一半导体集成电路中的一个相邻，多个第三半导体集成电路被布置为与第一半导体集成电路和第二半导体集成电路之一，以及多个第四半导体集成电路，每个第四半导体集成电路被布置为与第一半导体集成电路之一相邻，第二半导体集成电路之一和第二半导体集成电路之一第三半导体集成电路形成在第一基板上。第一半导体集成电路被转移到第二衬底。形成第一保护层以覆盖第一半导体集成电路和第一半导体集成电路的周边中的第二基板的表面。第二基板和第一保护层被分割成使得多个第一半导体集成电路被分成单独的部分，并且第二基板的一部分保留在第一半导体集成电路的周围。因此，制造具有第一半导体集成电路的半导体器件。

32. 发明申请

US20060134918A1 Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor device 有权
标题翻译：具有导电层的基板的制造方法和半导体装置的制造方法
公开(公告)号：US20060134918A1
公开(公告)日：2006-06-22
申请号：US11295471
申请日：2005-12-07
申请人： Gen Fujii , Masafumi Morisue , Hironobu Shoji , Junya Maruyama , Kouji Dairiki , Tomoyuki Aoki
发明人： Gen Fujii , Masafumi Morisue , Hironobu Shoji , Junya Maruyama , Kouji Dairiki , Tomoyuki Aoki
IPC分类号： H01L21/311 , H01L21/302
CPC分类号： H01L27/12 , H01L23/48 , H01L23/5227 , H01L24/11 , H01L27/0629 , H01L27/1266 , H01L27/1292 , H01L27/13 , H01L28/10 , H01L29/78621 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2924/00014 , H01L2924/07811 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The manufacturing method of a substrate having a conductive layer has the steps of: forming an inorganic insulating layer over a substrate; forming an organic resin layer with a desired shape over the inorganic insulating layer, forming a low wettability layer with respect to a composition containing conductive particles on a first exposed portion of the inorganic insulating layer; removing the organic resin layer; and coating a second exposed portion of the inorganic insulating layer with a composition containing conductive particles and baking, thereby forming a conductive layer.
摘要翻译：具有导电层的基板的制造方法具有以下步骤：在基板上形成无机绝缘层; 在所述无机绝缘层上形成具有所需形状的有机树脂层，在所述无机绝缘层的第一暴露部分上相对于含有导电颗粒的组合物形成低润湿性层; 去除有机树脂层; 并用含有导电颗粒的组合物涂覆无机绝缘层的第二暴露部分并进行烘烤，由此形成导电层。

33. 发明申请

US20050166078A1 Information processing apparatus with a function for low-power operation 有权
标题翻译：具有低功率运行功能的信息处理装置
公开(公告)号：US20050166078A1
公开(公告)日：2005-07-28
申请号：US11028072
申请日：2005-01-04
申请人： Hisashi Taniguchi , Tetsuya Esaki , Tomoyuki Aoki
发明人： Hisashi Taniguchi , Tetsuya Esaki , Tomoyuki Aoki
IPC分类号： G06F1/32 , G06F1/30 , G06F3/06
CPC分类号： G06F1/3256 , G06F1/3203 , G06F1/3287 , Y02D10/1542 , Y02D10/171
摘要： An information processing apparatus which comprises a recording section for recording information in a removable recording medium, a switch, a computer, a power supply section for supplying power to the recording section and the computer, and an operating system which is software for controlling the computer. In which, the power supply section controls power supply to the recording section and the computer individually, only the power supply to the recording section is controlled ON/OFF corresponding to a state of the switch. The operating system conducts a processing based on a presumption that the recording section is not connected to. Under the above-described configuration, when there is no access made to the recording section, the power supply is disconnected not only to the recording section but also to a constituent part used for making access to the recording section. Thus the advantage of low-power operation is further enhanced.
摘要翻译：一种信息处理设备，包括用于在可移动记录介质中记录信息的记录部分，开关，计算机，用于向记录部分和计算机供电的电源部分，以及作为控制计算机的软件的操作系统。其中，电源部分分别控制对记录部分和计算机的电源，只有与记录部分的电源相对应地被控制为ON / OFF。操作系统基于假设记录部分未连接进行处理。在上述配置下，当不存在对记录部分的访问时，电源不仅与记录部分断开，而且与用于访问记录部分的组成部分断开。因此，进一步提高了低功率运行的优点。

34. 发明授权

US5520959A Surface-treatment method for tin-plated drawn and ironed cans 失效
标题翻译：镀锡拉丝和熨烫罐的表面处理方法
公开(公告)号：US5520959A
公开(公告)日：1996-05-28
申请号：US910081
申请日：1992-07-10
申请人： Shigeo Tanaka , Tomoyuki Aoki , Masayuki Yoshida
发明人： Shigeo Tanaka , Tomoyuki Aoki , Masayuki Yoshida
IPC分类号： C23C22/08 , C23C22/23 , B05D3/02
CPC分类号： C23C22/08 , C23C22/23
摘要： A surface which has excellent adhesivity to paint, good corrosion resistance, and low friction may be obtained on drawn and iron tin plated cans by spraying the can surface for a time between 5 and 60 seconds at a temperature between 40.degree. and 60.degree. C. with an aqueous treating liquid having a pH between 4 and 6 and comprising (i) orthophosphoric acid and/or condensed phosphoric acids and (ii) a concentration of at least 0.1 w/o of a water soluble oligomer according to the general formula: ##STR1## wherein n is a number with a value between 10 and 30 and each of X and Y independently represents hydrogen or a group Z, wherein Z has a chemical composition conforming to the general formula: ##STR2## wherein each of R.sub.1 and R.sub.2 is an alkyl or hydroxyalkyl group having from 1 to 5 carbon atoms, except that at least 25% of the total of all the X and Y groups in the oligomer are Z rather than hydrogen; and drying the surface thus sprayed, optionally after having first rinsed the sprayed surface with water.
摘要翻译： PCT No.PCT / US91 / 00202 Sec。 371日期：1992年7月10日 102（e）日期1992年7月10日PCT 1991年1月1日PCT PCT。公开号WO91 / 10756 日期：1991年7月25日。通过在5和60秒之间的温度下，在拉伸和镀锡的罐上获得具有优异的涂料粘附性，良好的耐腐蚀性和低摩擦力的表面， 40℃和60℃，pH为4至6，并包含（i）正磷酸和/或缩合磷酸的水性处理液，和（ii）至少0.1w / o的水溶性低聚物的浓度根据通式：其中n是数值在10和30之间，X和Y各自独立地表示氢或基团Z，其中Z具有符合以下通式的化学组成：其中R 1和R 2各自为具有1至5个碳原子的烷基或羟烷基，除了低聚物中所有X和Y基团的总和中的至少25％为Z而不是氢; 并且任选地在首先用水冲洗喷射表面之后干燥所喷射的表面。

35. 发明授权

US5498300A Composition and process for treating tinplate 失效
标题翻译：用于处理马口铁的组合物和方法
公开(公告)号：US5498300A
公开(公告)日：1996-03-12
申请号：US454205
申请日：1995-06-09
申请人： Tomoyuki Aoki , Masayuki Yoshida
发明人： Tomoyuki Aoki , Masayuki Yoshida
IPC分类号： C23C22/08 , C23C22/23 , C23C22/47 , C23C22/10
CPC分类号： C23C22/23 , C23C22/08 , C23C22/47
摘要： To impart an excellent corrosion resistance and adherence to the surface of tinplate while avoiding the production of sludge in the treatment bath during continuous treatment, a bath is used that contains phosphate ions, from 0.1 to 5.0 g/L of chelating agent, and tin ions; has a pH from 2.0 to 4.5; is essentially free of oxidizing agent and ferric ion; and has an oxidation-reduction potential of .ltoreq.450 mV more oxidizing than a silver-saturated silver chloride reference electrode.
摘要翻译： PCT No.PCT / US93 / 11435 Sec。 371日期：1995年6月9日 102（e）1995年6月9日PCT 1993年12月1日PCT PCT。公开号WO94 / 13855 日期：1994年6月23日。为了赋予马口铁表面优异的耐腐蚀性和粘附性，同时避免在连续处理期间在处理槽中产生污泥，使用含有0.1至5.0g / L的磷酸根离子的浴的螯合剂和锡离子; pH为2.0〜4.5; 基本上不含氧化剂和铁离子; 并且具有比银饱和氯化银参比电极更氧化的氧化还原电位

36. 发明授权

US5382295A Method for cleaning aluminum and aluminum alloys 失效
标题翻译：铝和铝合金清洗方法
公开(公告)号：US5382295A
公开(公告)日：1995-01-17
申请号：US64082
申请日：1993-05-20
申请人： Tomoyuki Aoki , Yoji Ono
发明人： Tomoyuki Aoki , Yoji Ono
IPC分类号： F28F13/18 , C23G1/22 , F28F19/02 , C11D7/06 , C23G1/14
CPC分类号： C23G1/22
摘要： An aqueous alkaline cleaner for aluminum has a pH in the range from 10.0-12.0 and contains:(A) from 0.5 to 10.0 g/L of an alkali builder component;(B) from 0.5 to 10.0 g/L of aminoalkyl- and/or hydroxyalkyldi-phosphonic acids and/or their water soluble salts;(C) from 0.1 to 3.0 g/L of an aluminum ion sequestering agent component; and(D) from 0.5 to 5.0 g/L of a surfactant component.Cleaning aluminum and aluminum alloy with such a cleaner generates an excellent surface condition with respect to de-smutting performance, water wettability, avoidance of black smut production, blackening, and paint adherence at least as good as that achieved with conventional acid cleaners, without requiring any acid wash.
摘要翻译： PCT No.PCT / US91 / 08250 Sec。 371日期：1993年5月20日 102（e）日期1993年5月20日PCT 1991年11月12日PCT。用于铝的碱性水性碱性清洁剂的pH为10.0-12.0，含有：（A）0.5至10.0g / L的碱助洗剂零件; （B）0.5至10.0g / L氨基烷基 - 和/或羟烷基二膦酸和/或其水溶性盐; （C）为0.1〜3.0g / L的铝离子螯合剂成分; 和（D）0.5-5.0g / L表面活性剂组分。使用这种清洁剂清洁铝和铝合金，在去除斑点性能，水润湿性，避免黑色黑点生成，黑化和涂料粘附性方面产生极好的表面状况，至少与常规酸性清洁剂相同，不需要任何酸洗。

37. 发明授权

US5370909A Liquid composition and process for treating aluminum or tin cans to impart corrosion resistance and mobility thereto 失效
标题翻译：用于处理铝罐或锡罐的液体组合物和方法以赋予其耐腐蚀性和迁移性
公开(公告)号：US5370909A
公开(公告)日：1994-12-06
申请号：US949258
申请日：1992-12-18
申请人： Shigeo Tanaka , Tomoyuki Aoki , Masayuki Yoshida , Yasuo Iino , Shinichiro Asai
发明人： Shigeo Tanaka , Tomoyuki Aoki , Masayuki Yoshida , Yasuo Iino , Shinichiro Asai
IPC分类号： C23C22/23 , C23C22/68 , B05D1/02 , C23F11/00
CPC分类号： C23C22/23 , C23C22/68
摘要： A corrosion resistant film with a low coefficient of friction that facilitates automatic conveying can be formed on the surface of tin-plated steel or of aluminum, particularly DI cans of one of these types of metal, by contacting the aluminum or the tin plated steel with an aqueous liquid composition having a pH in the range from 2.0 to 6.5 and containing:(A) from 1 to 30 g/L of phosphate ions,(B) from 0.1 to 10 g/L of condensed phosphate ions, and(C) from 0.1 to 20 g/L as solids of water-soluble polymers of N-vinylphenol substituted on the phenolic rings with dialkylaminomethyl groups.
摘要翻译： PCT No.PCT / US91 / 04250 Sec。 371日期1992年12月18日 102（e）日期1992年12月18日PCT 1991年6月13日PCT。可以在镀锡钢或铝，特别是DI罐的表面上形成便于自动输送的具有低摩擦系数的耐腐蚀膜的这些金属之一，通过使铝或镀锡钢与pH为2.0-6.5的含水液体组合物接触，并含有：（A）1至30g / L的磷酸根离子（ B）0.1〜10g / L的缩合磷酸根离子，（C）0.1〜20g / L作为在具有二烷基氨基甲基的酚醛环上取代的N-乙烯基苯酚的水溶性聚合物的固体。

38. 发明授权

US4980076A Fluoride and chromium free acid etchant rinse for aluminum 失效
标题翻译：氟化物和无铬铬酸蚀刻剂冲洗铝
公开(公告)号：US4980076A
公开(公告)日：1990-12-25
申请号：US403625
申请日：1989-09-06
申请人： Shigeo Tanaka , Tomoyuki Aoki , Yasuo Iino , Yoji Ono
发明人： Shigeo Tanaka , Tomoyuki Aoki , Yasuo Iino , Yoji Ono
IPC分类号： C23G1/12
CPC分类号： C23G1/125
摘要： Problems with previously known aqueous acidic rinsing solutions for aluminum after shaping while using surface lubricants are avoided by use of a solution which contains water and (A) orthophosphoric acid in an amount to give a stoichiometric equivalent of 3.0 to 50 g/L as PO.sub.4.sup.-3, (B) an aluminum ion sequestrant component in an amount of 0.01 to 10.0 g/L; and (C) 20 to 170 ppm of ferric ion. The ferric ions act to inhibit corrosion of the stainless steel process equipment. Preferably the solution also contains 0.1 to 1.0 g/L of H.sub.2 O.sub.2, NO.sub.2.sup.-1 ions, or a mixture thereof to reoxidize ferrous ions formed by reduction of ferric ions during use of the solution and thus maintain the concentration of ferric ions above 20 ppm at all times. The solution may also contain surfactant and up to 10 g/L of dissolved aluminum ions.
摘要翻译：使用含有水的溶液和（A）正磷酸的量，通过使用表面润滑剂成型后的铝的先前已知的水性酸性漂洗溶液的问题可以避免，其量为化学计量当量为3.0〜50g / L，PO4- 3，（B）0.01〜10.0g / L的铝离子螯合剂成分; 和（C）20〜170ppm的铁离子。铁离子用于抑制不锈钢工艺设备的腐蚀。优选地，溶液还含有0.1至1.0g / L的H 2 O 2，NO 2 -1离子或其混合物，以在溶液的使用期间再氧化由铁离子还原形成的亚铁离子，并且因此将铁离子的浓度保持在20ppm以上一直。该溶液还可以含有表面活性剂和高达10g / L的溶解的铝离子。

39. 发明授权

US09284410B2 Polyamide production method 有权
标题翻译：聚酰胺生产方法
公开(公告)号：US09284410B2
公开(公告)日：2016-03-15
申请号：US14406607
申请日：2012-06-19
申请人： Taku Ishimaru , Katsumi Akaike , Daisuke Kikuno , Tomoyuki Aoki , Minoru Noda , Yasunori Tsuda
发明人： Taku Ishimaru , Katsumi Akaike , Daisuke Kikuno , Tomoyuki Aoki , Minoru Noda , Yasunori Tsuda
IPC分类号： C08G69/26 , C08L77/06 , C08G69/36 , C08G69/28 , B29C47/10 , B29C47/36 , D01F6/90 , C08L77/00
CPC分类号： C08G69/26 , B29C47/1063 , B29C47/364 , C08G69/265 , C08G69/28 , C08G69/36 , C08L77/00 , C08L77/06 , D01F6/90
摘要： A method of producing a polyamide includes (i) polycondensating a polyamide precursor containing a salt made from a dicarboxylic acid and a diamine under pressure in a pre-polymerization tank to obtain a prepolymer, and (ii) highly polymerizing the prepolymer with an extruder, wherein when the prepolymer in a molten state which is obtained in the step (i) is fed, by a pump, to the low-pressure extruder from the pre-polymerization tank through a discharge side pipe disposed downstream of the pump, the prepolymer is fed such that the length L [cm] of the discharge side pipe and the linear velocity of discharge v [cm/s] of the prepolymer by the pump satisfy the relationship expressed by the equation, 0.1 [s]≦L/v
摘要翻译：制备聚酰胺的方法包括：（i）在预聚合槽中将压缩下由二羧酸和二胺制成的盐的聚酰胺前体缩聚得到预聚物，和（ii）用挤出机使聚合物高度聚合，其中当步骤（i）中获得的处于熔融状态的预聚物通过泵从预聚合槽通过布置在泵下游的排放侧管被泵送到低压挤出机中时，预聚物是进料使得排出侧管的长度L [cm]和泵的预定液体的线速度v [cm / s]满足由式表示的关系：0.1 [s]＆nlE; L / v < 10 [s]。

40. 发明授权

US09155204B2 Method for manufacturing a wiring board 有权
标题翻译：线路板制造方法
公开(公告)号：US09155204B2
公开(公告)日：2015-10-06
申请号：US12690992
申请日：2010-01-21
申请人： Junya Maruyama , Tomoyuki Aoki
发明人： Junya Maruyama , Tomoyuki Aoki
IPC分类号： H05K3/30 , H05K3/20 , H05K3/24
CPC分类号： H05K3/205 , H01L2224/11 , H01L2924/12044 , H05K3/245 , H05K2203/0117 , Y10T29/49016 , Y10T29/49018 , Y10T29/49117 , Y10T29/49144 , Y10T29/49155 , Y10T29/49224 , H01L2924/00
摘要： A manufacturing method of a wiring board and a semiconductor device at low cost and by a simple process, without performing complicated steps many times is proposed. Furthermore, a manufacturing method of a wiring board at low cost and with fewer adverse effects on the environment, and a manufacturing method of a semiconductor device using the wiring board are proposed. A pattern of a conductive material is formed over a first substrate, a conductive film is formed over the pattern by an electrolytic plating process, the pattern and the conductive film are separated, an IC chip including at least one thin film transistor is formed over a second substrate, and the conductive film is electrically connected to the IC chip.
摘要翻译：提出了一种以低成本和简单的方法制造布线板和半导体器件的方法，而不需要多次复杂的步骤。此外，提出了一种低成本并且对环境的不利影响较少的布线板的制造方法以及使用该布线板的半导体装置的制造方法。导电材料的图形形成在第一基板上，通过电解电镀工艺在图案上形成导电膜，图案和导电膜被分离，包括至少一个薄膜晶体管的IC芯片形成在第二基板，并且导电膜电连接到IC芯片。

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