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    • 31. 发明授权
    • Complementary avalanche injection EEPROM cell
    • 互补雪崩注入EEPROM单元
    • US06570212B1
    • 2003-05-27
    • US09578086
    • 2000-05-24
    • Sunil D. MehtaSteven FongStewart Logie
    • Sunil D. MehtaSteven FongStewart Logie
    • H01L27108
    • H01L27/11526G11C16/0441H01L21/28273H01L27/105H01L27/115H01L27/11521H01L27/11529H01L27/11558H01L29/66825
    • A non-volatile memory cell at least partially formed in a semiconductor substrate, comprising a first avalanche injection element having a first active region of a first conductivity type and a second active region of a second conductivity type, separated by a channel region of said second conductivity type; a second avalanche injection element having a third active region of said second conductivity type and sharing said second active region with said first avalanche injection element, the second avalanche injection element having a channel region of said first conductivity type; and a common floating gate at least partially overlying said first and second avalanche injection elements. In a further embodiment, the first avalanche element has an N+/P junction, the second avalanche element has a P+/N junction, and the floating gate capacitively coupled to the first and second avalanche elements.
    • 至少部分地形成在半导体衬底中的非易失性存储单元,包括具有第一导电类型的第一有源区和第二导电类型的第二有源区的第一雪崩注入元件,由所述第二导电类型的沟道区分隔开 导电型; 第二雪崩注入元件,具有所述第二导电类型的第三有源区,并且与所述第一雪崩注入元件共享所述第二有源区,所述第二雪崩注入元件具有所述第一导电类型的沟道区; 以及至少部分地覆盖所述第一和第二雪崩注入元件的公共浮动栅极。在另一实施例中,第一雪崩元件具有N + / P结,第二雪崩元件具有P + / N结,并且浮动栅极电容耦合 到第一和第二雪崩元件。
    • 33. 发明授权
    • Borderless vias on bottom metal
    • 底部金属上的无边界通道
    • US06362527B1
    • 2002-03-26
    • US08754564
    • 1996-11-21
    • Sunil D. Mehta
    • Sunil D. Mehta
    • H01L2348
    • H01L21/76897H01L21/76819H01L23/5226H01L23/5329H01L2924/0002H01L2924/00
    • An improved manufacturing process and an improved device made by the process for forming via interconnects between metal layers in a multilevel metallization structure substantially eliminates trench formation during via overetch and exploding vias during via fill. An insulating multilayer structure comprising a conformal oxide, a spin-on layer, and an etch stop layer for the via etch locally planarizes the region adjacent to metal lines before the ILD is deposited and vias are patterned and etched. Using this process, metal borders around vias can be reduced or eliminated, thereby increasing circuit packing density.
    • 通过用于在多层金属化结构中的金属层之间经由互连形成的工艺制造的改进的制造工艺和改进的装置基本上消除了通孔过孔期间的沟槽形成和在通孔填充过程中爆炸通孔。 包含保形氧化物,旋涂层和用于通孔蚀刻的蚀刻停止层的绝缘多层结构在淀积ILD之前将与金属线相邻的区域平面化,并对通孔进行图案化和蚀刻。 使用该工艺可以减少或消除通孔周围的金属边界,从而增加电路封装密度。
    • 34. 发明授权
    • Avalanche injection EEPROM memory cell with P-type control gate
    • 雪崩注入EEPROM存储单元,带P型控制门
    • US06326663B1
    • 2001-12-04
    • US09277441
    • 1999-03-26
    • Xiao-Yu LiSteven J. FongSunil D. Mehta
    • Xiao-Yu LiSteven J. FongSunil D. Mehta
    • H01L29788
    • H01L27/11517H01L27/115
    • A non-volatile memory cell, comprising a semiconductor substrate having a first conductivity type. A control region is formed of said first conductivity type in the substrate and a control region oxide formed over the control region. The cell includes a program element having a first active region of a second conductivity type formed in said substrate, a doped or implanted region adjacent to said first active region, and a gate oxide overlying at least the channel region. An active region oxide covers a portion of the first active region. A floating gate is formed over said semiconductor substrate on said active region oxide and said control region oxide.
    • 一种非易失性存储单元,包括具有第一导电类型的半导体衬底。 控制区域由衬底中的所述第一导电类型形成,并且在控制区域上形成控制区氧化物。 单元包括具有形成在所述衬底中的第二导电类型的第一有源区,与所述第一有源区相邻的掺杂或注入区以及覆盖至少沟道区的栅极氧化物的程序元件。 有源区氧化物覆盖第一有源区的一部分。 在所述有源区氧化物和所述控制区氧化物上的所述半导体衬底上形成浮栅。
    • 35. 发明授权
    • Floating gate memory cell structure with programming mechanism outside the read path
    • 浮动门存储单元结构,具有读取路径外的编程机制
    • US06232631B1
    • 2001-05-15
    • US09217648
    • 1998-12-21
    • Christopher O. SchmidtSunil D. Mehta
    • Christopher O. SchmidtSunil D. Mehta
    • H01L29788
    • G11C16/0441H01L27/115
    • A non-volatile memory cell structure includes a floating gate, a reverse breakdown hot carrier injection element and a sense transistor. The reverse breakdown hot carrier injection element is at least partially formed in a first region of a semiconductor substrate under at least a portion of the floating gate. The sense transistor is at least partially formed in a second region of a semiconductor substrate, isolated from the first region, and under at least a portion of the floating gate. A read transistor may be connected to the sense transistor. In one embodiment, the read transistor is at least partially formed in the second region of a semiconductor substrate, and connected to the sense transistor.
    • 非易失性存储单元结构包括浮置栅极,反向击穿热载流子注入元件和感测晶体管。 反向击穿热载流子注入元件至少部分地形成在半导体衬底的至少一部分浮动栅极的第一区域内。 感测晶体管至少部分地形成在半导体衬底的与第一区域隔离的第二区域中,并且至少部分地形成在浮置栅极的至少一部分下方。 读取晶体管可以连接到感测晶体管。 在一个实施例中,读取晶体管至少部分地形成在半导体衬底的第二区域中,并连接到感测晶体管。
    • 37. 发明授权
    • EEPROM cell with field-edgeless tunnel window using shallow trench
isolation process
    • 具有无源隧道​​窗的EEPROM单元采用浅沟槽隔离工艺
    • US06093946A
    • 2000-07-25
    • US26814
    • 1998-02-20
    • Xiao-Yu LiSunil D. Mehta
    • Xiao-Yu LiSunil D. Mehta
    • H01L21/28H01L21/8247H01L27/115H01L29/788
    • H01L27/11521H01L21/28273H01L27/115H01L27/11558H01L29/7883
    • An improved EEPROM cell having a field-edgeless tunnel window is provided which is fabricated by a STI process so as to produce reliable endurance and data retention. The EEPROM cell includes a floating gate, a programmable junction region, and a tunneling oxide layer separating the programmable junction region and the floating gate. The tunneling oxide layer defines a tunnel window which allows for programming and erasing of the floating gate by tunneling electrons therethrough. The programmable junction region has a width dimension and a length dimension so as to define a first area. The tunnel window has a width dimension and a length dimension so as to define a second area. The second area of the tunnel window is completely confined within the first area of the programmable junction region so as to form a field-edgeless tunnel window.
    • 提供了具有场无边界隧道窗的改进的EEPROM单元,其通过STI工艺制造,以便产生可靠的耐久性和数据保持。 EEPROM单元包括浮置栅极,可编程结区域和分离可编程结区域和浮置栅极的隧穿氧化物层。 隧道氧化物层限定隧道窗口,其允许通过隧穿电子进行浮动栅极的编程和擦除。 可编程连接区域具有宽度尺寸和长度尺寸,以便限定第一区域。 隧道窗口具有宽度尺寸和长度尺寸,以便限定第二区域。 隧道窗口的第二区域被完全限制在可编程连接区域的第一区域内,从而形成无边界的隧道窗口。
    • 39. 发明授权
    • Non-volatile memory cell having dual avalanche injection elements
    • 具有双雪崩注入元件的非易失性存储单元
    • US6034893A
    • 2000-03-07
    • US334052
    • 1999-06-15
    • Sunil D. Mehta
    • Sunil D. Mehta
    • G11C16/04H01L21/8247H01L29/861
    • H01L29/8616G11C16/0441H01L27/11521H01L27/11558
    • A non-volatile memory cell includes a well region formed in a semiconductor substrate. First and second avalanche injection elements reside in the well region. A bifurcated floating-gate electrode includes a first segment overlying the first avalanche injection element and a second segment overlying the second avalanche injection element. A first contact region resides in the well region adjacent to the first segment of the floating-gate electrode, and a second contact region resides in the well region adjacent to the second segment of the floating-gate electrode. Upon the application of programming or erasing voltage, electrical charge is independently transferred to each of the first and second segments of the floating-gate electrode from the first and second avalanche injection elements, respectively.
    • 非易失性存储单元包括形成在半导体衬底中的阱区。 第一和第二雪崩注入元件驻留在井区域中。 分叉浮栅电极包括覆盖第一雪崩注入元件的第一段和覆盖第二雪崩注入元件的第二段。 第一接触区域位于与浮栅电极的第一段相邻的阱区中,并且第二接触区位于与浮栅电极的第二段相邻的阱区中。 在施加编程或擦除电压时,电荷分别独立地从第一和第二雪崩注入元件转移到浮栅电极的第一和第二段中的每一个。