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31. 发明申请

US20050162180A1 Semiconductor testing device 有权
标题翻译：半导体测试装置
公开(公告)号：US20050162180A1
公开(公告)日：2005-07-28
申请号：US11046883
申请日：2005-02-01
申请人： Shigeyuki Maruyama , Kazuhiro Tashiro , Makoto Haseyama , Futoshi Fukaya
发明人： Shigeyuki Maruyama , Kazuhiro Tashiro , Makoto Haseyama , Futoshi Fukaya
IPC分类号： G01R31/302 , G01R31/308 , H05K3/32 , G01R31/02
CPC分类号： G01R31/308 , G01R31/302 , H01L2924/0002 , H05K3/326 , H01L2924/00
摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.
摘要翻译：半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部，所述连接部分至少可变形并延伸到所述开口中。

32. 发明申请

US20050072972A1 Method of semiconductor device protection, package of semiconductor device 有权
标题翻译：半导体器件保护方法，半导体器件封装
公开(公告)号：US20050072972A1
公开(公告)日：2005-04-07
申请号：US10800630
申请日：2004-03-16
申请人： Kazuhiro Tashiro , Keisuke Fukuda , Naohito Kohashi , Shigeyuki Maruyama
发明人： Kazuhiro Tashiro , Keisuke Fukuda , Naohito Kohashi , Shigeyuki Maruyama
IPC分类号： G01R31/26 , H01L21/50 , H01L21/66 , H01L21/673 , H01L23/00 , H01L23/04 , H01L23/544 , H01L23/58
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
摘要翻译：公开了一种用于保护半导体器件的方法，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。

33. 发明授权

US06661247B2 Semiconductor testing device 有权
标题翻译：半导体测试装置
公开(公告)号：US06661247B2
公开(公告)日：2003-12-09
申请号：US09828221
申请日：2001-04-09
申请人： Shigeyuki Maruyama , Kazuhiro Tashiro , Makoto Haseyama , Futoshi Fukaya
发明人： Shigeyuki Maruyama , Kazuhiro Tashiro , Makoto Haseyama , Futoshi Fukaya
IPC分类号： G01R3126
CPC分类号： G01R31/308 , G01R31/302 , H01L2924/0002 , H05K3/326 , H01L2924/00
摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.
摘要翻译：半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部，所述连接部分至少可变形并延伸到所述开口中。

34. 发明授权

US06603325B2 Contactor for semiconductor devices, a testing apparatus using such contactor, a testing method using such contactor, and a method of cleaning such contactor 有权
公开(公告)号：US06603325B2
公开(公告)日：2003-08-05
申请号：US10225133
申请日：2002-08-22
申请人： Shigeyuki Maruyama , Futoshi Fukaya , Makoto Haseyama
发明人： Shigeyuki Maruyama , Futoshi Fukaya , Makoto Haseyama
IPC分类号： G01R3102
CPC分类号： H01L21/6838 , G01R1/07314 , G01R31/2831 , G01R31/2886 , H01L21/67126 , H01L21/68735 , H01L21/68785
摘要： A contactor for semiconductor devices includes a base unit for holding a semiconductor device provided with a plurality of terminals and a wiring substrate provided with contact electrodes at positions corresponding to at least some of the terminals. The contact electrodes and the terminals are electrically connected when the wiring substrate is held on the base unit. The contactor further includes a position maintaining force applying mechanism for applying a position maintaining force between the base unit and the wiring substrate and a contact pressure applying mechanism for applying a contact pressure between the semiconductor device and the wiring substrate. The position maintaining force applying mechanism and the contact pressure applying mechanism are operable in an independent manner.

35. 发明授权

US06545363B2 Contactor having conductive particles in a hole as a contact electrode 有权
公开(公告)号：US06545363B2
公开(公告)日：2003-04-08
申请号：US09755023
申请日：2001-01-08
申请人： Shigeyuki Maruyama , Susumu Kida , Naoyuki Watanabe , Takafumi Hashitani , Ei Yano , Ichiro Midorikawa
发明人： Shigeyuki Maruyama , Susumu Kida , Naoyuki Watanabe , Takafumi Hashitani , Ei Yano , Ichiro Midorikawa
IPC分类号： H01L2348
CPC分类号： G01R1/06733 , G01R1/0483 , G01R1/06711 , G01R1/06755 , G01R1/07314 , H01L23/49827 , H01L2924/0002 , H01L2924/00
摘要： A contactor is provided which contactor comprises an insulating substrate, a concave portion formed in the insulating substrate and extending in a perpendicular direction from a surface thereof, and elastic conductive particles disposed in the concave portion. A part of one of the conductive particles protrudes from the surface of the insulating substrate.

36. 发明授权

US06535002B2 IC socket, a test method using the same and an IC socket mounting mechanism 有权
标题翻译： IC插座，使用其的测试方法和IC插座安装机构
公开(公告)号：US06535002B2
公开(公告)日：2003-03-18
申请号：US09809204
申请日：2001-03-16
申请人： Makoto Haseyama , Shigeyuki Maruyama , Masataka Mizukoshi , Futoshi Fukaya
发明人： Makoto Haseyama , Shigeyuki Maruyama , Masataka Mizukoshi , Futoshi Fukaya
IPC分类号： G01R3102
CPC分类号： G01R1/0466 , G01R1/0483 , G01R1/06738 , G01R31/2863 , G01R31/2886 , H01L2924/00013 , H01L2224/29099
摘要： An IC to be tested having solder bumps is mounted on an IC socket mounted on a test board. The IC socket is provided with a contact unit including a plurality of straight contact pins each having an lower end connected to the test board and an upper end connected to the solder bumps and also including an elastic member for supporting the plurality of contact pins. A diameter of the plurality of contact pins is configured to be sufficiently small for the plurality of contact pins to pierce the respective solder bumps so that an electrical connection is established by the upper end of each of the plurality of solder bumps piercing an associated one of the solder bumps.
摘要翻译：将被测试的具有焊锡凸块的IC安装在安装在测试板上的IC插座上。 IC插座设置有接触单元，该接触单元包括多个直接接触针，每个具有连接到测试板的下端和连接到焊料凸块的上端，并且还包括用于支撑多个接触针的弹性构件。多个接触针的直径被构造成足够小以使多个接触针刺穿相应的焊料凸块，使得通过多个焊料凸块中的每一个的上端穿过相关联的一个焊接凸块来建立电连接焊锡凸块。

37. 发明授权

US06512386B2 Device testing contactor, method of producing the same, and device testing carrier 有权
标题翻译：设备测试接触器，其制造方法和设备测试载体
公开(公告)号：US06512386B2
公开(公告)日：2003-01-28
申请号：US09333984
申请日：1999-06-16
申请人： Makoto Haseyama , Shigeyuki Maruyama
发明人： Makoto Haseyama , Shigeyuki Maruyama
IPC分类号： G01R3102
CPC分类号： G01R1/0433 , Y10T29/49147 , Y10T29/49149 , Y10T29/49208 , Y10T29/4922
摘要： A contactor used for testing a semiconductor device is provided. The semiconductor device testing contactor is electrically connected to electrodes of a semiconductor device to be tested. Such a contactor includes a wiring board and a first reinforcing member for reinforcing the wiring board. The contactor has a flexible base film and device connecting pads to be electrically connected to the electrodes of the semiconductor device. The first reinforcing member is disposed on the surface opposite to the semiconductor device connecting surface of the wiring board. The wiring board and the first reinforcing member are collectively bonded.
摘要翻译：提供了用于测试半导体器件的接触器。半导体器件测试接触器电连接到要测试的半导体器件的电极。这种接触器包括布线板和用于加强布线板的第一加强件。接触器具有柔性基膜和与半导体器件的电极电连接的器件连接焊盘。第一加强构件设置在与布线板的半导体器件连接表面相对的表面上。接线板和第一加强件共同接合。

38. 发明授权

US06472744B2 Semiconductor module including a plurality of semiconductor devices detachably 失效
标题翻译：半导体模块可拆卸地包括多个半导体器件
公开(公告)号：US06472744B2
公开(公告)日：2002-10-29
申请号：US09084097
申请日：1998-05-26
申请人： Mitsutaka Sato , Tetsuya Fujisawa , Shigeyuki Maruyama , Junichi Kasai , Toshimi Kawahara , Toshio Hamano , Yoshihiro Kubota , Mitsunada Osawa , Yoshiyuki Yoneda , Kazuto Tsuji , Hirohisa Matsuki
发明人： Mitsutaka Sato , Tetsuya Fujisawa , Shigeyuki Maruyama , Junichi Kasai , Toshimi Kawahara , Toshio Hamano , Yoshihiro Kubota , Mitsunada Osawa , Yoshiyuki Yoneda , Kazuto Tsuji , Hirohisa Matsuki
IPC分类号： H01L2500
CPC分类号： H01L25/105 , H01L2224/48227 , H01L2225/1023 , H01L2924/09701 , H01L2924/1533 , H01L2924/3025 , H01R12/82 , H05K7/1431 , H01L2924/00
摘要： A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.
摘要翻译：半导体模块包括多个半导体器件，每个半导体器件包括承载有单个存储器半导体芯片的电路衬底和用于可分离地保持半导体器件的插座。

39. 发明授权

US06228684B1 Wafer-level package, a method of manufacturing thereof and a method of manufacturing semiconductor devices from such a wafer-level package 有权
标题翻译：晶圆级封装，其制造方法以及从这种晶片级封装制造半导体器件的方法
公开(公告)号：US06228684B1
公开(公告)日：2001-05-08
申请号：US09472824
申请日：1999-12-28
申请人： Shigeyuki Maruyama
发明人： Shigeyuki Maruyama
IPC分类号： H01L2144
CPC分类号： H01L22/32 , G01R31/2831 , G01R31/2884 , H01L24/19 , H01L24/20 , H01L24/94 , H01L24/96 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/24137 , H01L2224/24195 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/14
摘要： A wafer-level package includes a semiconductor wafer having at least one semiconductor chip circuit forming region each including a semiconductor chip circuit each provided with test chip terminals and non test chip terminals, at least one external connection terminal, at least one redistribution trace provided on the semiconductor wafer, at least one testing member, and an insulating material. A first end of the redistribution trace is connected to one of the test chip terminals and a second end of said redistribution trace is extended out to a position offset from the chip terminals. The testing member is provided in an outer region of the semiconductor chip circuit forming region, and the second end of the redistribution trace is connected to the testing member.
摘要翻译：晶片级封装包括具有至少一个半导体芯片电路形成区域的半导体晶片，每个半导体芯片电路形成区域各自包括半导体芯片电路，每个半导体芯片电路分别具有测试芯片端子和非测试芯片端子，至少一个外部连接端子，至少一个再分布迹线半导体晶片，至少一个测试构件和绝缘材料。再分配迹线的第一端连接到测试芯片端子之一，并且所述再分布迹线的第二端延伸到与芯片端子偏移的位置。测试构件设置在半导体芯片电路形成区域的外部区域中，再分布迹线的第二端连接到测试构件。

40. 发明授权

US06191604B1 Integrated circuit testing device 有权
标题翻译：集成电路测试装置
公开(公告)号：US06191604B1
公开(公告)日：2001-02-20
申请号：US09238172
申请日：1999-01-28
申请人： Makoto Haseyama , Shigeyuki Maruyama , Naomi Miyaji , Susumu Moriya
发明人： Makoto Haseyama , Shigeyuki Maruyama , Naomi Miyaji , Susumu Moriya
IPC分类号： G01R3102
CPC分类号： G01R31/2886 , G01R1/07357
摘要： An integrated circuit testing device includes a flexible base of an insulating material, the base having a first surface and a second surface opposite to each other, an integrated circuit to be tested being bonded to the first surface. A conductive wiring layer is provided on the first or second surface of the base, the wiring layer including a plurality of projecting contacts over the first surface at positions which electrodes of the integrated circuit are connected to. An elastic member is provided beneath the second surface of the base opposite to the first surface, the elastic member having a first level of hardness. A flexible film member is provided between the second surface of the base and the elastic member, the film member having a second level of hardness higher than the first level of hardness of the elastic member.
摘要翻译：集成电路测试装置包括绝缘材料的柔性基座，该基座具有彼此相对的第一表面和第二表面，待测试的集成电路与第一表面接合。在基座的第一或第二表面上设置有导电布线层，布线层包括在集成电路的电极连接的位置上的第一表面上的多个突出接点。弹性构件设置在基座的与第一表面相对的第二表面下方，弹性构件具有第一水平的硬度。柔性膜构件设置在基座的第二表面和弹性构件之间，膜构件具有比弹性构件的第一硬度高的第二硬度水平。

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