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31. 发明申请

US20130177047A1 REPEATER USING DIGITAL FILTER AND METHOD FOR DIGITAL FILTERING USING THE SAME 有权
标题翻译：使用数字滤波器重复使用数字滤波器和使用该数字滤波器的数字滤波方法
公开(公告)号：US20130177047A1
公开(公告)日：2013-07-11
申请号：US13526666
申请日：2012-06-19
申请人： Min Kon KWAK , Sang Jun KIM , You Sik CHOI , Pil Kyu JIN , Se Woong PARK
发明人： Min Kon KWAK , Sang Jun KIM , You Sik CHOI , Pil Kyu JIN , Se Woong PARK
IPC分类号： H04B3/36
CPC分类号： H04B7/155
摘要： A repeater using a digital filter is disclosed. The repeater comprises a MUX filter for filtering an RF signal received through an antenna or a signal to be transmitted through the antenna; a low noise amplifier for lowering noise of the signal filtered by the MUX filter; a down converter for converting the signal outputted from the low noise amplifier into an IF band signal to digitalize the signal; a digital filter for filtering the digital signal outputted form the down converter based on parameters inputted by a user; a filtering controller for controlling the digital filter by using al filtering coefficient calculated based on the parameters; an up converter for converting the signal filtered by the digital filter into an RF band signal; and a high power amplifier for amplifying the signal outputted from the up converter to a high power signal.
摘要翻译：公开了使用数字滤波器的中继器。中继器包括一个MUX滤波器，用于对通过天线接收的RF信号或通过天线传输的信号进行滤波; 用于降低由MUX滤波器滤波的信号的噪声的低噪声放大器; 一个下变频器，用于将从低噪声放大器输出的信号转换为IF频带信号以对信号进行数字化; 数字滤波器，用于根据用户输入的参数对从下转换器输出的数字信号进行滤波; 滤波控制器，用于通过使用基于参数计算的al滤波系数来控制数字滤波器; 用于将由数字滤波器滤波的信号转换成RF频带信号的上变频器; 以及用于将从上变频器输出的信号放大为高功率信号的高功率放大器。

32. 发明授权

US07591714B2 Wafer grinding and tape attaching apparatus and method 失效
标题翻译：晶圆研磨和贴附装置及方法
公开(公告)号：US07591714B2
公开(公告)日：2009-09-22
申请号：US11397883
申请日：2006-04-05
申请人： Jun-Young Ko , Dae-Sang Chan , Sang-Jun Kim
发明人： Jun-Young Ko , Dae-Sang Chan , Sang-Jun Kim
IPC分类号： B25B7/00
CPC分类号： B24B7/228 , B24B37/345
摘要： A wafer grinding and tape attaching apparatus and method, the method includes providing a wafer to a chuck table, grinding a back side of the wafer, providing a wafer ring having dicing tape and attaching the dicing tape to the back side of the ground wafer.
摘要翻译：一种晶片研磨和胶带附着装置及方法，该方法包括将晶片提供到卡盘台，研磨晶片的背面，提供具有切割带的晶片环，并将切割带附接到研磨晶片的背面。

33. 发明申请

US20070040282A1 Printed circuit board and method thereof and a solder ball land and method thereof 有权
标题翻译：印刷电路板及其方法和焊球地及其方法
公开(公告)号：US20070040282A1
公开(公告)日：2007-02-22
申请号：US11486064
申请日：2006-07-14
申请人： Ky-hyun Jung , Heui-seog Kim , Sang-jun Kim , Wa-su Sin , Ho-geon Song , Jun-young Ko
发明人： Ky-hyun Jung , Heui-seog Kim , Sang-jun Kim , Wa-su Sin , Ho-geon Song , Jun-young Ko
IPC分类号： H01L23/48
CPC分类号： H05K3/282 , H01L21/4853 , H01L23/49816 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/05567 , H01L2224/16503 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83102 , H01L2224/83385 , H01L2224/92125 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H05K3/243 , H05K3/3457 , H05K2201/0391 , H05K2201/0989 , H01L2924/00014 , H01L2924/00012
摘要： A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance.
摘要翻译：一种印刷电路板及其方法和焊球地及其方法。示例性印刷电路板（PCB）可以包括具有构造成用于第一类型电阻的第一表面处理部分的第一焊球焊盘和具有被配置为用于第二类型电阻的第二表面处理部分的第二焊球焊盘。示例性焊球焊盘可以包括被配置为用于第一类型电阻的第一表面处理部分和被配置用于第二类型电阻的第二表面处理部分。第一示例性方法可以包括首先处理第一焊球焊盘的第一表面以增加第一类型的电阻，并且第二处理第二焊球焊盘的第二表面以增加除第一类型电阻之外的第二类型的电阻。第二示例性方法可以包括首先处理焊球焊盘以增加第一类型的电阻，并且第二次处理焊球焊盘以增加除第一类型电阻之外的第二类型的电阻。

34. 发明申请

US20060082786A1 Apparatus and method for measurement of film thickness using improved fast fourier transformation 失效
标题翻译：使用改进的快速傅里叶变换测量膜厚度的装置和方法
公开(公告)号：US20060082786A1
公开(公告)日：2006-04-20
申请号：US10541876
申请日：2003-06-18
申请人： Sang-Youl Kim , Sang-Jun Kim
发明人： Sang-Youl Kim , Sang-Jun Kim
IPC分类号： G01B11/02
CPC分类号： G01B11/0625
摘要： The present invention relates to an apparatus and method for a measurement of a film thickness using an improved fast Fourier transformation. The apparatus includes a light source, a light receiving unit for converging a light from the light source, a detection unit for splitting a reflection light reflected by the surface of the sample and inputted into the optical fabric through the lens, and outputted to the other side of the optical fabric based on a light intensity of each wavelength and providing a certain amount of wavelength, a conversion unit for converting a wavelength based spectrum data detected by the detection unit into an analog signal and then converting into a digital signal through a converter, a computation unit for computing the number of vibrations based on a high speed Fourier transformation, and an analyzing unit for measuring a film thickness.
摘要翻译：本发明涉及使用改进的快速傅里叶变换来测量膜厚度的装置和方法。该装置包括光源，用于会聚来自光源的光的光接收单元，用于将由样品的表面反射的反射光分离并通过透镜输入到光学织物中的检测单元，并输出到另一个基于每个波长的光强度并提供一定量的波长的转换单元，用于将由检测单元检测到的基于波长的频谱数据转换为模拟信号，然后通过转换器转换成数字信号的转换单元，用于计算基于高速傅里叶变换的振动次数的计算单元和用于测量膜厚度的分析单元。

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