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31. 发明申请

US20070060677A1 Process for producing polyphenylene ether resin composition 有权
标题翻译：生产聚苯醚树脂组合物的方法
公开(公告)号：US20070060677A1
公开(公告)日：2007-03-15
申请号：US10573980
申请日：2004-09-30
申请人： Kazuo Yoshida , Takeshi Fujisawa
发明人： Kazuo Yoshida , Takeshi Fujisawa
IPC分类号： C08K5/49
CPC分类号： C08L25/06 , C08L9/00 , C08L71/12 , C08L2205/03 , C08L2666/02 , C08L2666/04
摘要： The invention relates to: a process for producing a poly(phenylene ether) resin composition which comprises (A) a poly(phenylene ether) and (B) a styrene resin and in which the styrene resin (B) is a styrene resin comprising a rubber-modified polystyrene containing a polybutadiene having 90% or higher cis-1,4 bonds, the process comprising a first step in which the poly(phenylene ether) (A) is melt-kneaded together with (B1) part or all of the styrene resin which does not include any rubber-modified polystyrene containing an unhydrogenated polybutadiene and a subsequent second step in which the remaining styrene resin including (B2) a rubber-modified polystyrene containing a polybutadiene having 90% or higher cis-1,4 bonds is melt-kneaded; and a poly(phenylene ether) resin composition obtained by the process. According to the invention, a modified PPE can be stably supplied which is free from various appearance failures such as black foreign particles, unmelted matter, and color unevenness and is excellent in practical properties such as stability to high-temperature residence, heat exposure resistance, and low-temperature impact resistance, in particular, heat deterioration resistance.
摘要翻译：本发明涉及一种聚苯醚树脂组合物的制造方法，其包含（A）聚苯醚和（B）苯乙烯系树脂，其中苯乙烯系树脂（B）为苯乙烯系树脂，含有具有90％以上顺式-1,4-键的聚丁二烯的橡胶改性聚苯乙烯，该方法包括第一步，其中聚（苯醚）（A）与（B1）部分或全部熔融捏合苯乙烯树脂，其不包括含有未氢化的聚丁二烯的任何橡胶改性的聚苯乙烯和随后的第二步，其中包含（B2）含有具有90％或更高顺式-1,4-键的聚丁二烯的橡胶改性聚苯乙烯的剩余苯乙烯树脂为熔融捏合; 和通过该方法获得的聚（苯醚）树脂组合物。根据本发明，可以稳定地提供改性的PPE，其不会出现诸如黑色外来颗粒，未熔化物质和颜色不均匀等各种外观故障，并且具有优异的实用性能，例如高温住宅的稳定性，耐热曝光性，耐低温冲击性，特别是耐热劣化性。

32. 发明授权

US07175919B2 Multilayered metal laminate and process for producing the same 失效
标题翻译：多层金属层压板及其制造方法
公开(公告)号：US07175919B2
公开(公告)日：2007-02-13
申请号：US10399530
申请日：2001-10-04
申请人： Kinji Saijo , Kazuo Yoshida , Hiroaki Okamoto , Shinji Ohsawa
发明人： Kinji Saijo , Kazuo Yoshida , Hiroaki Okamoto , Shinji Ohsawa
IPC分类号： B32B15/01
CPC分类号： H05K3/025 , B23K20/04 , B32B15/01 , H05K3/062 , H05K2201/0355 , H05K2201/0361 , H05K2203/0384 , H05K2203/068 , Y10T428/12 , Y10T428/12438 , Y10T428/12896 , Y10T428/12979
摘要： An adhesive-free multilayered metal laminate having a given thickness which is obtained by bonding a metal sheet having a thin metal film on a surface thereof to a metal foil without using an adhesive; and a process for continuously producing the laminate. The process comprises the steps of; setting a metal sheet on a reel for metal sheet unwinding; setting a metal foil on a reel for metal foil unwinding; unwinding the metal sheet from the metal sheet-unwinding reel and activating a surface of the metal sheet to thereby form a first thin metal film on the metal sheet surface; unwinding the metal foil from the metal foil-unwinding reel and activating a surface of the metal foil to thereby form a second thin metal film on the metal foil surface; and press-bonding the activated surface of the first thin metal film to that of the second thin metal film so that the first thin metal film formed on the metal sheet is in contact with the second thin metal film formed on the metal foil.
摘要翻译：具有给定厚度的无粘合剂的多层金属层压体，其通过在其表面上将不具有金属薄膜的金属薄片接合而不使用粘合剂而获得; 以及连续制造层压体的方法。该方法包括以下步骤：将金属板放在卷轴上用于金属板退绕; 在金属箔退绕卷轴上设置金属箔; 从金属板退绕卷轴退绕金属片并激活金属片的表面，从而在金属片表面上形成第一薄金属膜; 从金属箔退绕卷轴退绕金属箔并激活金属箔的表面，从而在金属箔表面上形成第二薄金属膜; 并且将第一薄金属膜的活化表面压接到第二薄金属膜的活化表面，使得形成在金属片上的第一薄金属膜与形成在金属箔上的第二薄金属膜接触。

33. 发明申请

US20050193555A1 Multilayer printed wiring board and method of manufacturing the same 失效
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：US20050193555A1
公开(公告)日：2005-09-08
申请号：US11119820
申请日：2005-05-03
申请人： Kinji Saijo , Kazuo Yoshida , Hiroaki Okamoto , Shinji Ohsawa
发明人： Kinji Saijo , Kazuo Yoshida , Hiroaki Okamoto , Shinji Ohsawa
IPC分类号： H05K1/02 , H05K3/06 , H05K3/46 , H05K1/03
CPC分类号： H05K1/0221 , H05K3/062 , H05K3/4647 , H05K2201/0361 , H05K2201/09254 , H05K2203/0384 , H05K2203/0733 , Y10T29/49126 , Y10T29/4913 , Y10T29/49151 , Y10T29/49155 , Y10T29/49156
摘要： A multilayer printed wiring board having a wiring lead-out port has a signal circuit conductor perfectly covered by an earth circuit in its inside and a wiring lead-out port. A signal circuit conductor having a branch pattern is preferable. A large number of products can be easily manufactured with good size reproducibility. The multilayer printed wiring board is manufactured by selectively etching the copper of a cladding sheet manufactured by bonding a copper foil to a nickel foil with 0.1-3 % reduction and forming a signal circuit conductor covered by an earth circuit and the wiring lead-out port.
摘要翻译：具有布线引出口的多层印刷布线板具有完全被其内部的接地电路覆盖的信号电路导体和布线引出口。具有分支图案的信号电路导体是优选的。可以容易地制造大量的产品，具有良好的尺寸再现性。多层印刷线路板是通过选择性地蚀刻通过将铜箔接合到镍箔上而制造的包层片的铜，其中，铜箔的折射率减少了0.1-3％，并且形成了由接地电路覆盖的信号电路导体和布线引出端口。

34. 发明授权

US06910333B2 Rankine cycle device of internal combustion engine 失效
标题翻译：内燃机的兰金循环装置
公开(公告)号：US06910333B2
公开(公告)日：2005-06-28
申请号：US10398167
申请日：2001-10-05
申请人： Masahiko Minemi , Hiroyuki Miura , Kazuo Yoshida , Masakatsu Miyao
发明人： Masahiko Minemi , Hiroyuki Miura , Kazuo Yoshida , Masakatsu Miyao
IPC分类号： F02B53/00 , F01B17/04 , F01K23/06 , F01K23/10 , F01N3/20 , F01N3/28 , F01N5/02 , F02G1/04 , F02G5/02 , F02G5/04 , F04B41/06
CPC分类号： F01N3/2882 , F01B17/04 , F01K23/065 , F01K23/106 , F01N3/2006 , F01N5/02 , F02G1/04 , F02G5/04 , Y02T10/16 , Y02T10/166 , Y02T10/26
摘要： A Rankine cycle system includes a first Rankine cycle (2A) operated by a first working medium and a second Rankine cycle (2B) operated by a second working medium. The first Rankine cycle (2A) is constituted from an evaporator (3A), an expander (4), a condenser (5A) and a supply pump (6A), and the second Rankine cycle (2B) is constituted from an evaporator (3B), the expander (4), a condenser (5B) and a supply pump (6c). The evaporator (3A) in the first Rankine cycle (2A) and the evaporator (3B) in the second Rankine cycle (2B) are disposed at locations upstream and downstream of an exhaust emission control device (8) mounted in an exhaust passage (7) for the internal combustion engine (1). The first working medium has a boiling point higher than that of the second working medium, and the capacity of the pump (6A) in at least the first Rankine cycle (2A) is variable. Thus, the efficiency of recovery of a waste heat from the internal combustion engine by the Rankine cycle system can be enhanced to the maximum, and the activation of the exhaust emission control device can be promoted.
摘要翻译：兰金循环系统包括由第一工作介质操作的第一兰金循环（2A）和由第二工作介质操作的第二兰金循环（2B）。第一兰金循环（2A）由蒸发器（3A），膨胀机（4），冷凝器（5A）和供给泵（6A）构成，第二兰金循环（2B）构成来自蒸发器（3B），膨胀机（4），冷凝器（5B）和供给泵（6c）。在第二兰金循环（2B）中的第一兰金循环（2A）和蒸发器（3B）中的蒸发器（3A）设置在安装在所述排气排放控制装置（8）的排气排放控制装置（8）的上游和下游的位置。用于内燃机（1）的排气通道（7）。第一工作介质的沸点高于第二工作介质，并且至少第一兰金循环（2A）中的泵（6A）的容量是可变的。因此，通过兰金循环系统从内燃机的废热的回收效率可以最大程度地提高，并且能够促进废气排放控制装置的启动。

35. 发明申请

US20050082669A1 Electronic circuit device and porduction method therefor 审中-公开
标题翻译：电子电路装置及其制造方法
公开(公告)号：US20050082669A1
公开(公告)日：2005-04-21
申请号：US10504426
申请日：2003-03-10
申请人： Kinji Saijo , Kazuo Yoshida , Shinji Ohsawa
发明人： Kinji Saijo , Kazuo Yoshida , Shinji Ohsawa
IPC分类号： H01L21/56 , H01L21/60 , H05K3/32 , H01L21/44 , H01L23/48 , H01L29/40
CPC分类号： H05K3/328 , H01L21/563 , H01L24/11 , H01L24/81 , H01L2224/05571 , H01L2224/05573 , H01L2224/114 , H01L2224/1147 , H01L2224/116 , H01L2224/13099 , H01L2224/16 , H01L2224/81054 , H01L2224/81192 , H01L2224/81208 , H01L2224/8121 , H01L2224/8123 , H01L2224/81815 , H01L2924/01006 , H01L2924/01018 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/19041 , H01L2924/19042 , H01L2924/30107 , H05K2201/0367 , H05K2201/10636 , Y02P70/611 , H01L2224/05647 , H01L2924/00014 , H01L2224/05655
摘要： An electronic circuit device capable of providing a stable electrical connection between an electronic component chip and a connecting multi-layer substrate, and being downsized at high density; and a production method therefor. An electronic component chip (1) and a connecting multi-layer substrate (2) or electronic component chips are heated in an inactive atmosphere such as argon or a reducing atmosphere such as hydrogen and pressure-welded to each other with or without an intermediary of an interposer (6), or their joint surfaces are activated and then pressure-welded at room temperature or by heating, thereby producing an electronic circuit device (40) by directly and metallurgically joining them by using any one of the above methods.
摘要翻译：一种电子电路装置，其能够在电子部件芯片和连接多层基板之间提供稳定的电连接，并且以高密度进行小型化; 及其制造方法。电子元件芯片（1）和连接多层基板（2）或电子元件芯片在诸如氩气或诸如氢气的还原气氛的惰性气氛中被加热，并且在有或没有中间插入器（6）或其接合表面被激活，然后在室温或加热下进行压焊，从而通过使用上述任一方法直接和冶金连接它们来生产电子电路装置（40）。

36. 发明授权

US06838318B1 Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them 失效
标题翻译：用于形成用于半导体器件的插入件的包层板，用于半导体器件的插入件及其制造方法
公开(公告)号：US06838318B1
公开(公告)日：2005-01-04
申请号：US10009196
申请日：2000-06-09
申请人： Kinji Saijo , Kazuo Yoshida , Hiroaki Okamoto , Shinji Ohsawa
发明人： Kinji Saijo , Kazuo Yoshida , Hiroaki Okamoto , Shinji Ohsawa
IPC分类号： H01L23/31 , H01L23/495 , H01L23/498 , H05K3/06 , H05K3/28 , H05K3/40 , H01L21/44 , B21D33/00 , B32B15/20
CPC分类号： H01L23/3114 , H01L23/3107 , H01L23/49582 , H01L23/49861 , H01L2224/16 , H01L2924/07811 , H05K3/062 , H05K3/28 , H05K3/4007 , H05K2201/0355 , H05K2201/0367 , H05K2201/10378 , H05K2203/0384 , H05K2203/1572 , Y10T29/30 , Y10T29/301 , Y10T29/302 , Y10T29/49002 , Y10T428/1291 , H01L2924/00
摘要： A clad plate for forming an interposer for a semiconductor device which can be manufactured at low cost and has good characteristics, an interposer for a semiconductor device, and a method of manufacturing them. Copper foil materials (19, 24, 33) forming conductive layers (10, 17, 18) and nickel plating (20, 21) forming etching stopper layers (11, 12) are formed and pressed to form a clad plate (34) for forming an interposer for a semiconductor device. Thus, a clad plate (34) for forming an interposer for a semiconductor device is manufactured. The clad plate (34) is selectively etched to form a columnar conductor (17), and an insulating layer (13) is formed on the copper foil material forming a wiring layer (10). A bump (18) for connection of a semiconductor chip and the wiring layer (10) are formed on the opposite side to the side on which the columnar conductor (17) is formed. Thus, an interposer for a semiconductor device is manufactured.

37. 发明授权

US06825254B2 Polyphenylene ether resin composition 有权
标题翻译：聚苯醚树脂组合物
公开(公告)号：US06825254B2
公开(公告)日：2004-11-30
申请号：US10343947
申请日：2003-02-05
申请人： Kazuo Yoshida , Yuji Tada
发明人： Kazuo Yoshida , Yuji Tada
IPC分类号： C08K55399
CPC分类号： C08K5/5399 , C08L85/02 , C08L71/12 , C08L2666/14
摘要： The resin composition of the present invention comprises (A) a resin composition comprising a polyphenylene ether resin or a polyphenylene ether resin and a polystyrene resin and (B) a phosphazene compound having an acid value of less than 0.5. This resin composition contains no halogen compounds and hence is environmentally preferred, and furthermore is excellent in electrical characteristics, heat resistance and mechanical properties, causes substantially no problems such as smoking during injection molding and desposition of flame-retardants on the mold, and has high flame retardancy.
摘要翻译：本发明的树脂组合物包含（A）包含聚苯醚树脂或聚苯醚树脂和聚苯乙烯树脂的树脂组合物和（B）酸值小于0.5的磷腈化合物。该树脂组合物不含有卤素化合物，因此是环境优选的，而且还具有优异的电特性，耐热性和机械性能，基本上没有问题，例如注射成型期间的吸烟和阻燃剂在模具上的脱落，并且具有高的阻燃性

38. 发明授权

US06423440B1 Closed battery and closing member 失效
标题翻译：闭合电池和关闭件
公开(公告)号：US06423440B1
公开(公告)日：2002-07-23
申请号：US09436488
申请日：1999-11-09
申请人： Akiyoshi Takada , Kinji Saijo , Kazuo Yoshida , Nobuyuki Yoshimoto , Yoshihiko Isobe
发明人： Akiyoshi Takada , Kinji Saijo , Kazuo Yoshida , Nobuyuki Yoshimoto , Yoshihiko Isobe
IPC分类号： H01M212
CPC分类号： H01M2/345 , H01M2/1241 , H01M2/34
摘要： The object of the present invention is to provide a closed battery capable of rapidly releasing the internal pressure thereof and at the same time disconnecting the current to effectively prevent itself from temperature rising and exploding so that in such a completely closed battery it may assure the safety and reliability thereof, when the internal pressure is elevated due to short circuit, overcharge, reverse charge, or the like. A valve element 5 is provided with a slit 3 between the circumference thereof and a metal substrate 1. When the internal pressure of a battery is elevated, the valve element 5 is smoothly raised up together with a metal foil 2 from a bending fulcrum portion 4 to thereby cut a lead wire 6 or permit a braze portion 8 to detach from the lead wire 6, thus disconnecting the current reliably. Then, the metal foil which usually closes the slit formed around the circumference of the valve element 5 is allowed to burst stably and accurately at a prescribed pressure to thereby form a valve opening portion 7 so that the internal gas of the battery can be discharged.
摘要翻译：本发明的目的是提供一种能够快速释放其内部压力并且同时断开电流以有效防止其升高和爆炸的封闭电池，使得在这种完全闭合的电池中可确保安全性当内部压力由于短路，过充电，反向充电等而升高时的可靠性。阀元件5在其周边和金属基板1之间设置有狭缝3。当电池的内部压力升高时，阀元件5与金属箔2一起从弯曲支点部分4平滑地升起从而切断引线6，或者使钎焊部8与引线6分离，从而可靠地断开电流。然后，通过闭合形成在阀体5的周围的狭缝的金属箔，能够在规定的压力下稳定而准确地突出，从而形成阀开口部7，从而能够排出电池的内部气体。

39. 发明授权

US5534073A Semiconductor producing apparatus comprising wafer vacuum chucking device 失效
标题翻译：半导体制造装置，包括晶片真空吸附装置
公开(公告)号：US5534073A
公开(公告)日：1996-07-09
申请号：US116968
申请日：1993-09-07
申请人： Yoshimi Kinoshita , Tomoyuki Kanda , Katsuhisa Kitano , Kazuo Yoshida , Hiroshi Ohnishi , Kenichiro Yamanishi , Shigeo Sasaki , Hideki Komori , Taizo Eshima , Kouichirou Tsutahara , Toshihiko Noguchi , Toru Takahama , Yoshihiko Kusakabe , Takeshi Iwamoto , Nobuyuki Kosaka
发明人： Yoshimi Kinoshita , Tomoyuki Kanda , Katsuhisa Kitano , Kazuo Yoshida , Hiroshi Ohnishi , Kenichiro Yamanishi , Shigeo Sasaki , Hideki Komori , Taizo Eshima , Kouichirou Tsutahara , Toshihiko Noguchi , Toru Takahama , Yoshihiko Kusakabe , Takeshi Iwamoto , Nobuyuki Kosaka
IPC分类号： B23Q3/08 , B25B11/00 , C23C16/34 , C23C16/44 , C23C16/455 , C23C16/458 , C23C16/48 , H01L21/683 , C23C16/00 , B23B5/22 , B23B31/30
CPC分类号： C23C16/34 , B25B11/005 , C23C16/4405 , C23C16/455 , C23C16/4583 , C23C16/481 , H01L21/6838 , Y10T279/11
摘要： It is an object of the present invention to obtain a vacuum chucking which can vacuum suck a wafer even if dusts attach thereon. The main body of vacuum chuck (101) has a plurality of block grooves (125) on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided for each block groove (125). When the wafer(1) is sucked and fixed under low pressure, even if the degree of vacuum in one of the block grooves (125) decreases due to attachment of dusts on part of the suction surface, or the like, the wafer (1) can surely be sucked and held.
摘要翻译：本发明的目的是获得即使在其上附着有灰尘也能真空吸附晶片的真空吸盘。真空吸盘（101）的主体在其上吸引和固定晶片（1）的表面上具有多个块状凹槽（125），其中各真空抽空路径（105）用于真空抽吸每个块状凹槽（125））被设置用于每个块槽（125）。当晶片（1）在低压下被吸入和固定时，即使一个块状槽（125）中的一个真空度由于吸附表面的一部分上的灰尘等的附着而降低，晶片（1））肯定被吸住了。

40. 发明授权

US5336857A Roller contact device 失效
标题翻译：滚筒接触装置
公开(公告)号：US5336857A
公开(公告)日：1994-08-09
申请号：US995042
申请日：1992-12-22
申请人： Kazuo Yoshida
发明人： Kazuo Yoshida
IPC分类号： H01H1/16 , H01H1/06
CPC分类号： H01H1/16
摘要： To achieve a small-sized roller contact device having an increased capacity of current flow, the front and rear roller contacts 4a and 4b are arranged such that they face each other with the contact portions 1a and 2a of the first and second fixed contacts 1 and 2 therebetween to bridge-contact the contact portions 1a a and 2a of first and second fixed contacts 1 and 2 from the front and rear sides of the portions of the first and second fixed contacts 1 and 2 which are arranged in parallel to each other. The front and rear roller contacts 4a and 4b are supported by the front and rear roller contact supporting members 5a and 5b, respectively. The driving member 6 extends between the first and second fixed contacts 1 and 2 and supports the front and rear roller contact supporting members 5a and 5b. The springs are installed between the front and rear roller contact supporting members 5a and 5b.
摘要翻译：为了实现具有增加的电流容量的小型辊接触装置，前辊和后辊接触件4a和4b被布置成使得它们彼此面对着第一和第二固定触头1的接触部分1a和2a， 2之间，从第一和第二固定触点1和2的彼此平行布置的部分的前侧和后侧与第一和第二固定触头1,2的接触部分1a和2a桥接接触。前辊和后辊接触件4a和4b分别由前和后辊接触支撑件5a和5b支撑。驱动构件6在第一固定触点1和第二固定触头2之间延伸并支撑前辊和后辊接触支撑件5a和5b。弹簧安装在前辊和后辊接触支撑件5a和5b之间。

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