专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 外观设计

USD509195S1 Light emitting diode package 失效
标题翻译：发光二极管封装
公开(公告)号：USD509195S1
公开(公告)日：2005-09-06
申请号：US29179243
申请日：2003-04-08
申请人： Bily Wang , Jonnie Chuang , Yann Lee
设计人： Bily Wang , Jonnie Chuang , Yann Lee

32. 发明授权

US06919584B2 White light source 有权
标题翻译：白光源
公开(公告)号：US06919584B2
公开(公告)日：2005-07-19
申请号：US10677783
申请日：2003-10-03
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin
IPC分类号： H01L25/075 , H01L33/50 , H01L29/06
CPC分类号： H01L25/0753 , F21Y2113/17 , F21Y2115/10 , H01L33/504 , H01L2924/0002 , Y10S257/918 , H01L2924/00
摘要： A colorless light approaching that of white light in nature, is produced by using a blue color LEDs and a green color LED are covered with a red color phosphorescent glue and a yellow phosphorescent glue in separate layers or a mixed layer.
摘要翻译：通过使用蓝色LED产生白色光的无色光，绿色LED由分开的层或混合层中的红色磷光胶和黄色磷光胶覆盖。

33. 发明申请

US20050128767A1 Light source structure of light emitting diode 审中-公开
标题翻译：发光二极管的光源结构
公开(公告)号：US20050128767A1
公开(公告)日：2005-06-16
申请号：US10731097
申请日：2003-12-10
申请人： Bily Wang , Jonnie Chuang , Chi-Wen Hung
发明人： Bily Wang , Jonnie Chuang , Chi-Wen Hung
IPC分类号： F21V7/04 , H01L25/075 , H01L25/16
CPC分类号： H01L25/167 , H01L25/0753 , H01L2224/48137
摘要： A light source structure for a light emitting diode (LED) has a high modulating flexibility and a low manufacturing cost. The LED light source is a white light source for an electrical device. The LED light source structure is used to meet the illumination requirement of the electrical device and the benefit from the light source structure of LED is more modulating ability with a small volume. The Led light source structure has an electrical circuit substrate, a red light LED chip, a green light LED chip, a blue light LED chip, a controlling integral circuit chip and a certain shape of packaging material.
摘要翻译：用于发光二极管（LED）的光源结构具有高调制灵活性和低制造成本。 LED光源是用于电气设备的白色光源。 LED光源结构用于满足电气设备的照明要求，LED的光源结构受益于较小的体积调制能力。 LED光源结构具有电路基板，红光LED芯片，绿光LED芯片，蓝光LED芯片，控制集成电路芯片和一定形状的封装材料。

34. 发明授权

US06841934B2 White light source from light emitting diode 有权
标题翻译：来自发光二极管的白光源
公开(公告)号：US06841934B2
公开(公告)日：2005-01-11
申请号：US10372848
申请日：2003-02-26
申请人： Bily Wang , Jonnie Chuang , Yann Lee
发明人： Bily Wang , Jonnie Chuang , Yann Lee
IPC分类号： H01J1/62 , H01L33/50 , H01L33/54 , H01L33/62 , H05B33/00 , H05B33/04
CPC分类号： H01L33/505 , H01L33/54 , H01L33/62 , H01L2224/48247 , H05B33/04 , H01L2224/48091 , H01L2924/00014
摘要： A white light source is obtained by converting short wavelength color light emitted from a light emitting diode (LED). The conversion is achieved by covering the LED chip with a fluorescent glue. The LED chip is mounted on a split substrate, and the outer ends of the substrate serve as terminals for the LED. A wall may be erected around the LED chip to contain the fluorescent glue, and another transparent glue may be used to cover the fluorescent glue for protection.
摘要翻译：通过转换从发光二极管（LED）发射的短波长颜色光获得白色光源。通过用荧光胶覆盖LED芯片来实现转换。 LED芯片安装在分离的基板上，并且基板的外端用作LED的端子。可以在LED芯片周围竖起一个墙壁以容纳荧光胶，另外透明胶可以用来覆盖荧光胶以进行保护。

35. 发明授权

US08137999B2 Package for a light emitting diode and method for fabricating the same 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US08137999B2
公开(公告)日：2012-03-20
申请号：US13214337
申请日：2011-08-22
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
IPC分类号： H01L21/56
CPC分类号： H01L33/486 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A method for fabricating a LED includes: providing a metal substrate; etching the metal substrate to form a first terminal, a second terminal, and a gap between the first terminal and the second terminal, wherein the first terminal has at least one first etching concave and the second terminal has at least one second etching concave; placing at least one LED chip in the at least one first etching concave, wherein the at least one LED chip has a first electrode and a second electrode; electrically connecting the first electrode with the first terminal, and electrically connecting the second electrode with the second terminal; and then covering the at least one LED chip with synthetic polymer, wherein the synthetic polymer is filled into the at least one first etching concave, the at least one second etching concave and the gap to connect the first terminal with the second terminal.
摘要翻译：一种制造LED的方法包括：提供金属基板; 蚀刻金属基板以形成第一端子，第二端子和第一端子和第二端子之间的间隙，其中第一端子具有至少一个第一蚀刻凹部，并且第二端子具有至少一个第二蚀刻凹部; 将至少一个LED芯片放置在所述至少一个第一蚀刻凹部中，其中所述至少一个LED芯片具有第一电极和第二电极; 将第一电极与第一端子电连接，并将第二电极与第二端子电连接; 然后用合成聚合物覆盖所述至少一个LED芯片，其中所述合成聚合物填充到所述至少一个第一蚀刻凹部中，所述至少一个第二蚀刻凹部和所述间隙将所述第一端子与所述第二端子连接。

36. 发明授权

US07923745B2 LED chip package structure with high-efficiency light-emitting effect and method of packaging the same 有权
标题翻译： LED芯片封装结构具有高效发光效果和封装方法相同
公开(公告)号：US07923745B2
公开(公告)日：2011-04-12
申请号：US11779556
申请日：2007-07-18
申请人： Bily Wang , Jonnie Chuang , Wen-Kuei Wu
发明人： Bily Wang , Jonnie Chuang , Wen-Kuei Wu
IPC分类号： H01L33/00
CPC分类号： B29C45/14655 , B29C33/0022 , F21K9/00 , F21K9/20 , F21Y2103/10 , F21Y2115/10 , G09F9/33 , G09F13/22 , H01L24/97 , H01L33/52 , H01L2224/16225 , H01L2224/48091 , H01L2224/97 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/12041 , H01L2924/15747 , H01L2924/15787 , H01L2224/81 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips.
摘要翻译：具有高效率发光效果的LED芯片封装结构包括基板单元，发光单元和封装胶体单元。基板单元具有分别形成在基板主体上的基板主体和正极迹线和负极迹线。发光单元具有布置在基板主体上的多个LED芯片，并且每个LED芯片分别具有正极侧和负极侧，并与基板单元的正极迹线和负极迹线电连接。封装胶体单元具有分别覆盖在LED芯片上的多个封装胶体。

37. 发明申请

US20100301349A1 WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：用于增加发光效率和散热效果的WAFER LEVEL LED封装结构及其制造方法
公开(公告)号：US20100301349A1
公开(公告)日：2010-12-02
申请号：US12856968
申请日：2010-08-16
申请人： BILY WANG , JONNIE CHUANG , CHUAN-FA LIN , CHI-WEN HUNG
发明人： BILY WANG , JONNIE CHUANG , CHUAN-FA LIN , CHI-WEN HUNG
IPC分类号： H01L33/60 , H01L33/30 , H01L21/50
CPC分类号： H01L23/544 , H01L23/60 , H01L24/03 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/48 , H01L25/167 , H01L27/0248 , H01L33/46 , H01L33/62 , H01L2223/54493 , H01L2224/0401 , H01L2224/0603 , H01L2224/06102 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1403 , H01L2224/16 , H01L2224/16145 , H01L2224/48091 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2224/45111 , H01L2224/131 , H01L2224/13099 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A wafer level LED package structure includes a light-emitting unit, a reflecting unit, a first conductive unit and a second conductive unit. The light-emitting unit has a substrate body, a light-emitting body disposed on the substrate body, a positive and a negative conductive layers formed on the light-emitting body, and a light-emitting area formed in the light-emitting body. The reflecting unit has a reflecting layer formed between the positive and the negative conductive layers and on the substrate body for covering external sides of the light-emitting body. The first conductive unit has a first positive conductive layer formed on the positive conductive layer and a first negative conductive layer formed on the negative conductive layer. The second conductive unit has a second positive conductive structure formed on the first positive conductive layer and a second negative conductive structure formed on the first negative conductive layer.
摘要翻译：晶圆级LED封装结构包括发光单元，反射单元，第一导电单元和第二导电单元。发光单元具有基板主体，设置在基板主体上的发光体，形成在发光体上的正极和负极导电层，以及形成在发光体中的发光区域。反射单元具有形成在正导电层和负导电层之间的反射层和用于覆盖发光体的外侧的基板主体。第一导电单元具有形成在正导电层上的第一正导电层和形成在负导电层上的第一负导电层。第二导电单元具有形成在第一正导电层上的第二正导电结构和形成在第一负导电层上的第二负导电结构。

38. 发明授权

US07824938B2 Method for manufacturing an LED chip package structure 有权
标题翻译：制造LED芯片封装结构的方法
公开(公告)号：US07824938B2
公开(公告)日：2010-11-02
申请号：US12382760
申请日：2009-03-24
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
IPC分类号： H01L21/00
CPC分类号： H01L25/0753 , H01L24/97 , H01L33/483 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/01082 , H01L2924/12041 , H01L2224/85 , H01L2924/00014
摘要： An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.
摘要翻译：具有厚引导针的LED芯片封装结构包括彼此分离的多个导电引脚，绝缘壳体，多个LED芯片和封装胶体。绝缘壳体覆盖每个导电销的底侧，以形成用于暴露每个导电销的顶表面的注入凹槽。每个导电针的两个侧面从绝缘壳体向外延伸。 LED芯片布置在注入凹槽中，并且每个LED芯片分别具有正极侧和负极侧，并且与不同的导电针电连接。此外，将包装胶体填充到用于覆盖LED芯片的注入凹槽中。

39. 发明授权

US07737635B2 High efficiency white light emitting diode and method for manufacturing the same 有权
标题翻译：高效白光发光二极管及其制造方法
公开(公告)号：US07737635B2
公开(公告)日：2010-06-15
申请号：US11702496
申请日：2007-02-06
申请人： Bily Wang , Jonnie Chuang , Chao-Yuan Huang
发明人： Bily Wang , Jonnie Chuang , Chao-Yuan Huang
IPC分类号： H01J1/62
CPC分类号： C09K11/7721 , C09K11/7731 , C09K11/7734 , H01L25/0753 , H01L33/502 , H01L2224/48091 , H05B33/14 , Y02B20/181 , H01L2924/00014 , H01L2924/00
摘要： A light source module of a white light emitting diode comprising a blue LED, a packaging substrate, wherein the blue LED is mounted on and electrically connected to the packaging substrate, a cap layer, enclosing the blue LED, wherein the cap layer includes a mixture of silicon and phosphor blend at ratio of 1:0.2-0.5, and a protective layer over the cap layer.
摘要翻译：一种白光发光二极管的光源模块，包括蓝色LED，封装衬底，其中所述蓝色LED安装在所述封装衬底上并与所述封装衬底电连接，盖层包围所述蓝色LED，其中，所述覆盖层包括混合物的硅和磷光体共混物的比例为1:0.2-0.5，并且覆盖层上的保护层。

40. 发明申请

US20100099207A1 LED chip package structure with high-efficiency light-emitting effect and method of packaging the same 有权
标题翻译： LED芯片封装结构具有高效发光效果和封装方法相同
公开(公告)号：US20100099207A1
公开(公告)日：2010-04-22
申请号：US12591329
申请日：2009-11-17
申请人： Bily Wang , Jonnie Chuang , Wen-Kuei Wu
发明人： Bily Wang , Jonnie Chuang , Wen-Kuei Wu
IPC分类号： H01L21/50
CPC分类号： G02F1/133603 , H01L2224/48091 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012
摘要： An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips. Each package colloid has a colloid cambered surface and a colloid light-emitting surface respectively formed on a top surface and a front surface thereof.
摘要翻译：具有高效率发光效果的LED芯片封装结构包括基板单元，发光单元和封装胶体单元。基板单元具有分别形成在基板主体上的基板主体和正极迹线和负极迹线。发光单元具有布置在基板主体上的多个LED芯片。各LED芯片分别具有正极侧和负极侧，与基板单元的正极迹线和负极迹线电连接。封装胶体单元具有分别覆盖在LED芯片上的多个封装胶体。每个包装胶体具有分别形成在其顶表面和前表面上的胶体弧形表面和胶体发光表面。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式