发明申请
US20100099207A1 LED chip package structure with high-efficiency light-emitting effect and method of packaging the same
有权
基本信息:
- 专利标题： LED chip package structure with high-efficiency light-emitting effect and method of packaging the same
- 专利标题（中）：LED芯片封装结构具有高效发光效果和封装方法相同
- 申请号：US12591329 申请日：2009-11-17
- 公开(公告)号：US20100099207A1 公开(公告)日：2010-04-22
- 发明人： Bily Wang , Jonnie Chuang , Wen-Kuei Wu
- 申请人： Bily Wang , Jonnie Chuang , Wen-Kuei Wu
- 主分类号： H01L21/50
- IPC分类号： H01L21/50
摘要：
An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips. Each package colloid has a colloid cambered surface and a colloid light-emitting surface respectively formed on a top surface and a front surface thereof.
摘要（中）：
具有高效率发光效果的LED芯片封装结构包括基板单元，发光单元和封装胶体单元。 基板单元具有分别形成在基板主体上的基板主体和正极迹线和负极迹线。 发光单元具有布置在基板主体上的多个LED芯片。 各LED芯片分别具有正极侧和负极侧，与基板单元的正极迹线和负极迹线电连接。 封装胶体单元具有分别覆盖在LED芯片上的多个封装胶体。 每个包装胶体具有分别形成在其顶表面和前表面上的胶体弧形表面和胶体发光表面。
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |