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    • 38. 发明授权
    • Electronic component package and method of manufacturing same
    • 电子元件封装及其制造方法
    • US07166497B2
    • 2007-01-23
    • US10989675
    • 2004-11-16
    • Kazuhiro ShiomiMasaaki IshioMinoru IizukaYoshikiyo Ogasawara
    • Kazuhiro ShiomiMasaaki IshioMinoru IizukaYoshikiyo Ogasawara
    • H01L21/44H01L21/48H01L21/50
    • H01L23/04H01L23/10H01L2924/01079H01L2924/16195
    • An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer. The ratio of the area of the first and second intermetallic compound layers in a longitudinal section of the fusion-welding layer relative to the area of the longitudinal section of the fusion-welding layer is in a range of from about 25% to about 98%. This package maintains superior airtightness even when exposed to a high-temperature atmosphere, which is higher than the melting point of the soldering material.
    • 电子部件封装包括具有其中包括电子部件的空腔部分的壳体和通过熔融焊接层熔合到壳体上以密封空腔部分的盖部件。 壳体具有层叠在壳体上的第一金属层,以便在空腔部分的开放侧露出。 盖部件具有芯部,层叠在芯部的面向壳体的一侧的第二金属层。 熔焊层具有由焊料形成的焊接材料层,以及由于焊接材料的主要成分扩散到第一金属层中而设置在焊料层的相对侧上的第一和第二金属间化合物层 和第二金属层。 熔融层的纵截面中的第一和第二金属间化合物的面积相对于熔融层的纵截面的面积的比例为约25%〜98% 。 即使暴露在高于焊接材料的熔点的高温气氛下,该包装也保持优异的气密性。
    • 40. 发明申请
    • NEGATIVE-ELECTRODE TERMINAL FOR CELL
    • 负极电极端子
    • US20140178755A1
    • 2014-06-26
    • US14236289
    • 2012-08-01
    • Yoshimitsu OdaMasaaki Ishio
    • Yoshimitsu OdaMasaaki Ishio
    • H01M2/30
    • H01M2/30H01M2/024H01M2/06H01M2/206H01M2/263H01M2/305
    • A negative-electrode terminal for a cell in which separation between a first metal layer and a second metal layer hardly takes place is provided by suppressing excess formation of an intermetallic compound on a bond interface between the first metal layer and the second metal layer. This negative-electrode terminal for a cell includes a clad portion formed by bonding a first metal layer made of Al or an Al alloy and a second metal layer containing Ni and Cu and consisting of one or a plurality of layers to each other. The first metal layer includes a connected region connected with a cell terminal connecting plate and a stacked region adjacent to the connected region on the side of the same surface, while the second metal layer is bonded to the first metal layer in the stacked region and configured to be connectable to cell negative electrodes of cells.
    • 通过抑制金属间化合物在第一金属层和第二金属层之间的键合界面上的过量形成,提供了几乎不发生第一金属层和第二金属层之间的间隔的电池的负极端子。 用于电池的负极端子包括通过将由Al或Al合金制成的第一金属层和包含Ni和Cu的第二金属层彼此结合并由一个或多个层组成的包层部分。 第一金属层包括与电池端子连接板连接的连接区域和与相同表面侧的连接区域相邻的堆叠区域,而第二金属层在堆叠区域中接合到第一金属层并且被配置 可连接到细胞的细胞负极。