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1. 发明授权

US06849939B2 Electronic component package and method of manufacturing same 有权
标题翻译：电子元件封装及其制造方法
公开(公告)号：US06849939B2
公开(公告)日：2005-02-01
申请号：US10363395
申请日：2002-03-22
申请人： Kazuhiro Shiomi , Masaaki Ishio , Minoru Iizuka , Yoshikiyo Ogasawara
发明人： Kazuhiro Shiomi , Masaaki Ishio , Minoru Iizuka , Yoshikiyo Ogasawara
IPC分类号： H01L23/04 , H01L23/10 , H01L23/12
CPC分类号： H01L23/04 , H01L23/10 , H01L2924/01079 , H01L2924/16195
摘要： An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer. The ratio of the area of the first and second intermetallic compound layers in a longitudinal section of the fusion-welding layer relative to the area of the longitudinal section of the fusion-welding layer is in a range of from about 25% to about 98%. This package maintains superior airtightness even when exposed to a high-temperature atmosphere, which is higher than the melting point of the soldering material.
摘要翻译：电子部件封装包括具有其中包括电子部件的空腔部分的壳体和通过熔融焊接层熔合到壳体上以密封空腔部分的盖部件。壳体具有层叠在壳体上的第一金属层，以便在空腔部分的开放侧露出。盖部件具有芯部，层叠在芯部的面向壳体的一侧的第二金属层。熔焊层具有由焊料形成的焊接材料层，以及由于焊接材料的主要成分扩散到第一金属层中而设置在焊料层的相对侧上的第一和第二金属间化合物层和第二金属层。熔融层的纵截面中的第一和第二金属间化合物的面积相对于熔融层的纵截面的面积的比例为约25％〜98％。即使暴露在高于焊接材料的熔点的高温气氛下，该包装也保持优异的气密性。

2. 发明授权

US07166497B2 Electronic component package and method of manufacturing same 有权
标题翻译：电子元件封装及其制造方法
公开(公告)号：US07166497B2
公开(公告)日：2007-01-23
申请号：US10989675
申请日：2004-11-16
申请人： Kazuhiro Shiomi , Masaaki Ishio , Minoru Iizuka , Yoshikiyo Ogasawara
发明人： Kazuhiro Shiomi , Masaaki Ishio , Minoru Iizuka , Yoshikiyo Ogasawara
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/04 , H01L23/10 , H01L2924/01079 , H01L2924/16195
摘要： An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer. The ratio of the area of the first and second intermetallic compound layers in a longitudinal section of the fusion-welding layer relative to the area of the longitudinal section of the fusion-welding layer is in a range of from about 25% to about 98%. This package maintains superior airtightness even when exposed to a high-temperature atmosphere, which is higher than the melting point of the soldering material.
摘要翻译：电子部件封装包括具有其中包括电子部件的空腔部分的壳体和通过熔融焊接层熔合到壳体上以密封空腔部分的盖部件。壳体具有层叠在壳体上的第一金属层，以便在空腔部分的开放侧露出。盖部件具有芯部，层叠在芯部的面向壳体的一侧的第二金属层。熔焊层具有由焊料形成的焊接材料层，以及由于焊接材料的主要成分扩散到第一金属层中而设置在焊料层的相对侧上的第一和第二金属间化合物层和第二金属层。熔融层的纵截面中的第一和第二金属间化合物的面积相对于熔融层的纵截面的面积的比例为约25％〜98％。即使暴露在高于焊接材料的熔点的高温气氛下，该包装也保持优异的气密性。

3. 发明授权

US06700312B2 Quartz oscillator device 有权
标题翻译：石英振荡器装置
公开(公告)号：US06700312B2
公开(公告)日：2004-03-02
申请号：US09959476
申请日：2001-10-26
申请人： Minoru Iizuka , Hiroyuki Ishihara , Yoshikiyo Ogasawara , Akihiro Mori , Susumu Hirao , Tatsuya Murakami
发明人： Minoru Iizuka , Hiroyuki Ishihara , Yoshikiyo Ogasawara , Akihiro Mori , Susumu Hirao , Tatsuya Murakami
IPC分类号： H01L41047
CPC分类号： H03H9/0509 , H03H9/0519 , H03H9/131
摘要： A quartz oscillator device of the present invention comprises a quartz oscillating plate having two major surfaces, each of which is formed with an excitation electrode and lead electrodes drawn out of the excitation electrode, and electrode pads formed on a base, wherein the quartz oscillating plate and the electrode pads are electrically connected via a silicone-based conductive adhesive. Among the excitation electrode and the lead electrodes, at least each of the lead electrodes comprises a Cr film layer, a Au film layer, and a thin Cr film layer or a thin Ag film layer, which are laminated on the quartz oscillating plate in this order. In addition, each electrode pad comprises a metallized layer made of tungsten or molybdenum, a Ni film layer and a Au film layer, which are laminated on the base in this order; and Ni in the Ni film layer is diffused at least into a predetermined area of the Au film layer in each electrode pad where the silicone-based conductive adhesive is applied.
摘要翻译：本发明的石英振荡器包括具有两个主表面的石英振荡板，每个主表面形成有激励电极和从激励电极引出的引线电极，以及形成在基座上的电极焊盘，其中石英振荡板并且电极焊盘通过硅酮基导电粘合剂电连接。在激励电极和引线电极中，至少每个引线电极包括Cr膜层，Au膜层和薄Cr膜层或薄Ag膜层，这些层叠在石英振荡板上订购。此外，每个电极焊盘包括由钨或钼制成的金属化层，Ni膜层和Au膜层，其依次层压在基材上; 并且Ni膜层中的Ni至少扩散到施加有硅酮系导电性粘接剂的各电极焊盘中的Au膜层的规定区域。

4. 发明授权

US08796558B2 Base of surface-mount electronic component package, and surface-mount electronic component package 有权
标题翻译：表面贴装电子元件封装的基座和表面贴装电子元器件封装
公开(公告)号：US08796558B2
公开(公告)日：2014-08-05
申请号：US13497831
申请日：2011-03-24
申请人： Minoru Iizuka , Yuka Kojo
发明人： Minoru Iizuka , Yuka Kojo
IPC分类号： H05K5/00
CPC分类号： H05K5/0091 , H01L23/053 , H01L23/13 , H01L23/49805 , H01L23/49838 , H01L2924/0002 , H01L2924/15162 , H01L2924/16195 , H03H9/1021 , H05K3/3431 , H05K3/3442 , H05K5/0095 , H05K2201/09381 , H05K2201/10068 , H05K2201/10075 , Y02P70/613 , H01L2924/00
摘要： A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal is formed in the principal surface. The base includes a bump formed on the external connection terminal. The bump is smaller than the external connection terminal. The base has a distance d between an outer periphery end edge of the external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the external connection terminal The stress is generated in association of mounting of the base on the circuit board. The distance d is more than 0.00 mm and equal to or less than 0.45 mm.
摘要翻译：表面安装电子部件封装的基座保持电子元件，并且将被安装在具有导电接合材料的电路板上。基座具有主电路表面和与电路板电连接的外部连接端子。外部连接端子形成在主面上。底座包括形成在外部连接端子上的凸块。凸块小于外部连接端子。底座在外部连接端子的应力的衰减方向上具有外部连接端子的外周端边缘与突起的外周端边缘之间的距离d。电路板。距离d大于0.00mm且等于或小于0.45mm。

5. 发明授权

US08004157B2 Piezoelectric resonator plate and piezoelectric resonator device 有权
标题翻译：压电谐振板和压电谐振器装置
公开(公告)号：US08004157B2
公开(公告)日：2011-08-23
申请号：US11885260
申请日：2006-03-02
申请人： Minoru Iizuka , Tatsuya Murakami , Syunsuke Satoh , Takashi Shirai , Hiroyuki Ishihara , Tomo Fujii
发明人： Minoru Iizuka , Tatsuya Murakami , Syunsuke Satoh , Takashi Shirai , Hiroyuki Ishihara , Tomo Fujii
IPC分类号： H01L41/08
CPC分类号： H03H9/1021 , H03H9/215
摘要： An electrode forming region for providing lead electrodes (65a, 65b) is provided on a crystal resonator plate (2). Opposed side surfaces (67a, 67b) of a substrate (6) are formed and inclined in the same direction with respect to a front major surface (63). Also, an adhesion reinforcing portion (7) for reinforcing adhesion to a conductive adhesive (5) is provided in the electrode forming region for the lead electrodes (65a, 65b). For example, the adhesion reinforcing portion (7) is a notch portion which is cut and formed in the opposed side surfaces (67a, 67b). Thereby, an adhesion strength of the crystal resonator plate (2) and the conductive adhesive (5) is increased.
摘要翻译：在晶体谐振器板（2）上设置用于提供引线电极（65a，65b）的电极形成区域。形成基板（6）的相对的侧面（67a，67b）并相对于前主表面（63）沿相同的方向倾斜。此外，在用于引线电极（65a，65b）的电极形成区域中设置有用于增强与导电粘合剂（5）的粘附的粘合增强部分（7）。例如，粘合强化部（7）是在相对的侧面（67a，67b）上切断并形成的切口部。由此，增加了晶体谐振器板（2）和导电粘合剂（5）的粘附强度。

6. 发明申请

US20080265717A1 Piezoelectric Resonator Plate and Piezoelectric Resonator Device 有权
标题翻译：压电谐振器板和压电谐振器器件
公开(公告)号：US20080265717A1
公开(公告)日：2008-10-30
申请号：US11885260
申请日：2006-03-02
申请人： Minoru Iizuka , Tatsuya Murakami , Syunsuke Satoh , Takashi Shirai , Hiroyuki Ishihara , Tomo Fujii
发明人： Minoru Iizuka , Tatsuya Murakami , Syunsuke Satoh , Takashi Shirai , Hiroyuki Ishihara , Tomo Fujii
IPC分类号： H03H9/10
CPC分类号： H03H9/1021 , H03H9/215
摘要： An electrode forming region for providing lead electrodes (65a, 65b) is provided on a crystal resonator plate (2). Opposed side surfaces (67a, 67b) of a substrate (6) are formed and inclined in the same direction with respect to a front major surface (63). Also, an adhesion reinforcing portion (7) for reinforcing adhesion to a conductive adhesive (5) is provided in the electrode forming region for the lead electrodes (65a, 65b). For example, the adhesion reinforcing portion (7) is a notch portion which is cut and formed in the opposed side surfaces (67a, 67b). Thereby, an adhesion strength of the crystal resonator plate (2) and the conductive adhesive (5) is increased.
摘要翻译：在晶体谐振器板（2）上设置用于提供引线电极（65a，65b）的电极形成区域。形成基板（6）的相对的侧面（67a，67b）并相对于前主表面（63）沿相同的方向倾斜。此外，在用于引线电极（65a，65b）的电极形成区域中设置用于增强与导电粘合剂（5）的粘附的粘附强化部分（7）。例如，粘合强化部（7）是在相对的侧面（67a，67b）中被切割并形成的切口部。由此，增加了晶体谐振器板（2）和导电粘合剂（5）的粘附强度。

7. 发明授权

US08279610B2 Electronic component package, base of electronic component package, and junction structure of electronic component package and circuit substrate 有权
标题翻译：电子元件封装，电子元器件封装基座，电子元件封装和电路基板的结构
公开(公告)号：US08279610B2
公开(公告)日：2012-10-02
申请号：US12674505
申请日：2008-08-21
申请人： Minoru Iizuka , Koichi Kishimoto , Kozo Shibutani , Kentaro Nakanishi
发明人： Minoru Iizuka , Koichi Kishimoto , Kozo Shibutani , Kentaro Nakanishi
IPC分类号： H05K1/00 , H05K1/18
CPC分类号： H01L23/49838 , H01L23/053 , H01L23/49822 , H01L23/50 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/16195 , H03H9/1021 , H05K1/0243 , H05K3/3442 , H05K2201/09181 , H05K2201/10068 , H05K2201/10075 , H05K2201/10727 , Y02P70/613 , H01L2924/00
摘要： An electronic component package has a base in the shape of a rectangle as viewed from the top, and a metal lid. A terminal electrode on a base bottom surface and a circuit substrate are joined using a conductive adhesive material. In the electronic component package, a first terminal electrode group including two or more terminal electrodes formed in parallel is formed eccentrically to one corner position of the base bottom surface, and a single second terminal electrode, or a second terminal electrode group including two or more terminal electrodes formed in parallel, is formed eccentrically only to a first diagonal position diagonally opposite the one corner position. Also, no-electrode regions in which no terminal electrode is formed along a short side of the base are provided at another corner position facing the one corner position in a short side direction of the base, and a second diagonal position diagonally opposite the other corner position. At least one of the terminal electrodes is a ground terminal electrode connected to the metal lid.
摘要翻译：电子部件封装具有从顶部观察为矩形形状的基部和金属盖。使用导电性粘合剂材料将基底面上的端子电极和电路基板接合。在电子部件封装中，包括形成为平行的两个以上的端子电极的第一端子电极组偏心地形成在底部底面的一个拐角位置，单个第二端子电极或包括两个以上的第二端子电极组形成为平行的端子电极偏心地形成为与一个角位置对角地相对的第一对角线位置。此外，在基座的短边方向上的与一个角位置相对的另一个角位置处设置有沿着基座的短边没有形成端子电极的无电极区域，并且与另一个角部对角地相对的第二对角线位置位置。至少一个端子电极是连接到金属盖的接地端子电极。

8. 发明申请

US20140110643A1 ELECTRICAL INSULATING OIL COMPOSITION HAVING EXCELLENT LOW TEMPERATURE PROPERTIES 审中-公开
标题翻译：具有优异低温特性的电绝缘油组合物
公开(公告)号：US20140110643A1
公开(公告)日：2014-04-24
申请号：US14123970
申请日：2012-05-25
申请人： Nobuhiro Kimura , Hiroyuki Hoshino , Takahiro Kawaguchi , Mikihiro Takaki , Minoru Iizuka
发明人： Nobuhiro Kimura , Hiroyuki Hoshino , Takahiro Kawaguchi , Mikihiro Takaki , Minoru Iizuka
IPC分类号： H01B3/22
CPC分类号： H01B3/22 , C10M105/06 , C10M169/04 , C10M2203/06 , C10M2203/065 , C10M2207/046 , C10N2220/022 , C10N2230/02 , C10N2230/41 , C10N2240/20 , C10N2240/201 , H01G4/221 , H01G9/035
摘要： The present invention provides an electric insulating oil composition that has excellent low temperature properties, hydrogen gas absorbability and giving less adverse effect on living bodies and comprises [A] 1,1-diphenylethane in an amount of 30 to 70 percent by mass, [B] at least one or more component selected from 4 components that are (a) 1-phenyl-1-methylphenylethane, (b) 1-phenyl-1-xylylethane, (c) 1-phenyl-1-ethylphenylethane and (d) benzyltoluene in a total amount of 30 to 70 percent by mass, and [C] 1,2-diphenylethane in an amount of 0.1 to 2 percent by mass and/or diphenylmethane in an amount of 0.1 to 13 percent by mass.
摘要翻译：本发明提供一种具有优异的低温性，氢气吸收性，对生物体的不利影响较小的电绝缘油组合物，其含有30〜70质量％的[A] 1,1-二苯基乙烷[B ]（a）1-苯基-1-甲基苯基乙烷，（b）1-苯基-1-木糖醇，（c）1-苯基-1-乙基苯基乙烷和（d）苄基甲苯的4种组分中的至少一种或多种组分总量为30〜70质量％，[C] 1,2-二苯基乙烷为0.1〜2质量％，和/或二苯基甲烷为0.1〜13质量％。

9. 发明申请

US20130098654A1 BASE OF SURFACE-MOUNT ELECTRONIC COMPONENT PACKAGE, AND SURFACE-MOUNT ELECTRONIC COMPONENT PACKAGE 有权
标题翻译：表面安装电子元器件包装和表面安装电子元件包装
公开(公告)号：US20130098654A1
公开(公告)日：2013-04-25
申请号：US13497831
申请日：2011-03-24
申请人： Minoru Iizuka , Yuka Kojo
发明人： Minoru Iizuka , Yuka Kojo
IPC分类号： H05K5/00
CPC分类号： H05K5/0091 , H01L23/053 , H01L23/13 , H01L23/49805 , H01L23/49838 , H01L2924/0002 , H01L2924/15162 , H01L2924/16195 , H03H9/1021 , H05K3/3431 , H05K3/3442 , H05K5/0095 , H05K2201/09381 , H05K2201/10068 , H05K2201/10075 , Y02P70/613 , H01L2924/00
摘要： A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal is formed in the principal surface. The base includes a bump formed on the external connection terminal. The bump is smaller than the external connection terminal. The base has a distance d between an outer periphery end edge of the external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the external connection terminal The stress is generated in association of mounting of the base on the circuit board. The distance d is more than 0.00 mm and equal to or less than 0.45 mm.
摘要翻译：表面安装电子部件封装的基座保持电子元件，并且将被安装在具有导电接合材料的电路板上。基座具有主电路表面和与电路板电连接的外部连接端子。外部连接端子形成在主表面上。底座包括形成在外部连接端子上的凸块。凸块小于外部连接端子。底座在外部连接端子的应力的衰减方向上具有外部连接端子的外周端边缘与突起的外周端边缘之间的距离d。电路板。距离d大于0.00mm且等于或小于0.45mm。

10. 发明授权

US08076576B2 Electronic component package 有权
标题翻译：电子元件包装
公开(公告)号：US08076576B2
公开(公告)日：2011-12-13
申请号：US12445124
申请日：2007-10-19
申请人： Kazuhiko Kumatani , Yoshihisa Takano , Naotoshi Nakamura , Mototsugu Ogasa , Takashi Nakamura , Minoru Iizuka
发明人： Kazuhiko Kumatani , Yoshihisa Takano , Naotoshi Nakamura , Mototsugu Ogasa , Takashi Nakamura , Minoru Iizuka
IPC分类号： H01L23/02 , H05K5/06
CPC分类号： H03H9/1014 , H01L23/045 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H03H9/0528 , H01L2924/00
摘要： There is provided an electronic component package, in which electronic component element is mounted on a metal base, the electronic component element is covered by placing a metal cap over the metal base, and the metal base and the metal cap are joined by resistance welding to hermetically seal the electronic component element. With this electronic component package, a protrusion is provided to a portion of the metal base that comes into contact with the metal cap, and a projection tip of the protrusion has a flat face. Alternatively, the protrusion has a cross sectional shape that combines an arc member with the top side of an isosceles trapezoid.
摘要翻译：提供了一种电子部件封装，其中电子元件安装在金属基座上，通过在金属基座上放置金属盖来覆盖电子元件，并且金属基座和金属盖通过电阻焊接而接合密封电子元件。利用该电子部件封装，在与金属盖接触的金属基体的一部分上设置有突起，突起的突起的顶端具有平坦面。或者，突起具有将弧形构件与等腰梯形的顶侧组合的横截面形状。

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