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    • 10. 发明授权
    • Electroless Ni-P plating method and substrate for electronic component
    • 无电镀Ni-P电镀方法及电子元器件基板
    • US08101867B2
    • 2012-01-24
    • US12305480
    • 2007-06-22
    • Masayuki YokotaKen AsadaFumiaki Kikui
    • Masayuki YokotaKen AsadaFumiaki Kikui
    • H05K1/09
    • H05K3/244C23C18/1603C23C18/1637C23C18/1664C23C18/32C23C18/36C23C18/54H05K2203/0195H05K2203/072
    • An electroless Ni—P plating method according to the present invention includes the steps of: providing a substrate including an insulating substrate and a copper alloy layer that has a predetermined pattern including a plurality of island portions that are isolated from each other; providing a plating solution to carry out electroless Ni—P plating; providing a solid piece including Ni, Ni—P, Co or Co—Ni on at least the surface thereof; and bringing the solid piece into contact with the surface of at least two of the island portions that are both in contact with the plating solution, thereby selectively forming an electroless Ni—P plated coating on the surface of the island portions. Thus, the present invention provides a Ni—P plating method that can subject the copper pattern on the insulating substrate to high-precision selective Ni—P plating on an industrial basis.
    • 根据本发明的无电解Ni-P镀覆方法包括以下步骤:提供包括绝缘基板和铜合金层的基板,所述铜合金层具有包括彼此隔离的多个岛部的预定图案; 提供镀液以进行无电镀Ni-P电镀; 在至少其表面上提供包括Ni,Ni-P,Co或Co-Ni的固体块; 并且使固体片与与电镀液接触的至少两个岛部的表面接触,从而在岛部的表面上选择性地形成无电镀Ni-P镀层。 因此,本发明提供一种Ni-P电镀方法,其可以将绝缘基板上的铜图案以工业上的高精度选择性Ni-P电镀作为对象。