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1. 发明授权

US08785029B2 Connection plate for battery terminals and method for manufacturing connection plate for battery terminals 有权
标题翻译：电池端子用连接板及电池端子用连接板的制造方法
公开(公告)号：US08785029B2
公开(公告)日：2014-07-22
申请号：US13996278
申请日：2011-12-07
申请人： Yoshimitsu Oda , Masaharu Yamamoto , Masaaki Ishio
发明人： Yoshimitsu Oda , Masaharu Yamamoto , Masaaki Ishio
IPC分类号： H01M2/20 , H01R43/02 , H01B1/02 , B21K23/04 , H01M10/0525
CPC分类号： H01M2/202 , B21K23/04 , H01B1/023 , H01B1/026 , H01M10/0525 , H01M2220/20 , H01R43/0221 , Y02E60/122 , Y02P70/54 , Y10T29/49204 , Y10T29/49213 , Y10T29/49224
摘要： A connection plate for battery terminals capable of inhibiting a base and a battery terminal connection portion from being detached from each other is provided. This connection plate for battery terminals (2) includes a battery terminal connection portion (4) fitted into a second hole (31) of a base (3) made of first metal, including a hole for connection (42) into which a second battery terminal (1b) is inserted and a flange portion (4b), while the battery terminal connection portion is constituted by at least a first layer (40) made of second metal, arranged on a side opposite to the base and a second layer (41) made of third metal, arranged between the base and the first layer.
摘要翻译：提供一种用于能够抑制基座和电池端子连接部分彼此分离的电池端子的连接板。该电池端子用连接板（2）具备嵌入第1金属制的基座（3）的第2孔（31）的电池端子连接部（4），该第2孔包括用于连接的孔（42），第2电池插入端子（1b）和凸缘部分（4b），而电池端子连接部分由至少由第二金属制成的第一层（40）构成，布置在与基座相对的一侧上，第二层（41 ）由第三金属制成，布置在基底和第一层之间。

2. 发明授权

US08029916B2 Brazing filler metal, brazing composite material and brazed structure brazed/bonded with the same 失效
标题翻译：钎焊金属，钎焊复合材料和钎焊结构钎焊/粘合
公开(公告)号：US08029916B2
公开(公告)日：2011-10-04
申请号：US11578511
申请日：2006-03-24
申请人： Tsuyoshi Hasegawa , Masaaki Ishio , Yoshimitsu Oda
发明人： Tsuyoshi Hasegawa , Masaaki Ishio , Yoshimitsu Oda
IPC分类号： B23K35/14
CPC分类号： B32B15/00 , B23K35/0238 , B23K35/3033 , B23K35/304 , B23K35/325 , B23K2101/14 , B32B3/28 , B32B15/043 , B32B15/18 , B32B2255/06 , B32B2255/205 , B32B2255/28 , B32B2307/714 , C22C14/00 , C22C19/05 , F28D9/0062 , F28F3/025 , F28F21/089 , Y10T428/12806 , Y10T428/12937 , Y10T428/12944 , Y10T428/12979
摘要： A brazing filler metal capable of improving both of oxidation resistance and corrosion resistance is obtained. This brazing filler metal (1, 1d, 51 and 51a) consists of at least a three-layer structure of an Ni—Cr brazing layer (2 and 2a) consisting of an Ni—Cr alloy layer, a Ti brazing layer (3, 3a, 3b, 3c and 3d) consisting of a Ti layer or a Ti alloy layer and an Ni brazing layer (4, 4a, 4b, 4c and 4d) consisting of an Ni layer or an N alloy layer arranged between the Ni—Cr brazing layer and the Ti brazing layer.
摘要翻译：得到能够提高耐氧化性和耐腐蚀性两者的钎料。该钎料金属（1,1d，51和51a）由至少三层结构的Ni-Cr钎焊层（2和2a）组成，Ni-Cr钎焊层由Ni-Cr合金层，Ti钎焊层（3， 3a，3b，3c和3d），由Ti层或Ti合金层和Ni钎料层（4,4a，4b，4c，4d）构成，Ni层或Ni合金层由Ni-Cr 钎焊层和Ti钎焊层。

3. 发明授权

US11955205B2 Thermosensitive deformation apparatus 有权
公开(公告)号：US11955205B2
公开(公告)日：2024-04-09
申请号：US13375167
申请日：2010-05-21
申请人： Yoshimitsu Oda , Masaaki Ishio
发明人： Yoshimitsu Oda , Masaaki Ishio
IPC分类号： G12B1/02 , B32B15/01 , C22C38/08 , C22C38/12 , C22C38/40
CPC分类号： G12B1/02 , B32B15/011 , C22C38/08 , C22C38/12 , C22C38/40 , Y10T428/12465
摘要： A high-temperature bimetal capable of being inhibited from considerably shifting from an original position when the temperature has fallen to an ordinary temperature is provided. This high-temperature bimetal (1) includes a high thermal expansion layer (2) made of austenitic stainless steel and a low thermal expansion layer (3) made of a thermosensitive magnetic metal having a Curie point and bonded to the high thermal expansion layer. The high-temperature bimetal is employed over both a high temperature range of not less than the Curie point and a low temperature range of less than the Curie point, while an upper limit of operating temperatures in the high temperature range of not less than the Curie point is at least 500° C.

4. 发明授权

US09017871B2 Negative-electrode terminal for cell 有权
标题翻译：电池用负极端子
公开(公告)号：US09017871B2
公开(公告)日：2015-04-28
申请号：US14236289
申请日：2012-08-01
申请人： Yoshimitsu Oda , Masaaki Ishio
发明人： Yoshimitsu Oda , Masaaki Ishio
IPC分类号： H01M2/30 , H01M2/02 , H01M2/06 , H01M2/20 , H01M2/26
CPC分类号： H01M2/30 , H01M2/024 , H01M2/06 , H01M2/206 , H01M2/263 , H01M2/305
摘要： A negative-electrode terminal for a cell in which separation between a first metal layer and a second metal layer hardly takes place is provided by suppressing excess formation of an intermetallic compound on a bond interface between the first metal layer and the second metal layer. This negative-electrode terminal for a cell includes a clad portion formed by bonding a first metal layer made of Al or an Al alloy and a second metal layer containing Ni and Cu and consisting of one or a plurality of layers to each other. The first metal layer includes a connected region connected with a cell terminal connecting plate and a stacked region adjacent to the connected region on the side of the same surface, while the second metal layer is bonded to the first metal layer in the stacked region and configured to be connectable to cell negative electrodes of cells.
摘要翻译：通过抑制金属间化合物在第一金属层和第二金属层之间的键合界面上的过量形成，提供了几乎不发生第一金属层和第二金属层之间的间隔的电池的负极端子。用于电池的负极端子包括通过将由Al或Al合金制成的第一金属层和包含Ni和Cu的第二金属层彼此结合并由一个或多个层组成的包层部分。第一金属层包括与电池端子连接板连接的连接区域和与相同表面侧的连接区域相邻的堆叠区域，而第二金属层在堆叠区域中接合到第一金属层并且被配置可连接到细胞的细胞负极。

5. 发明授权

US08802242B2 Clad plate 有权
标题翻译：包层板
公开(公告)号：US08802242B2
公开(公告)日：2014-08-12
申请号：US13266817
申请日：2010-01-08
申请人： Yoshimitsu Oda , Masaaki Ishio , Toshiaki Fujita
发明人： Yoshimitsu Oda , Masaaki Ishio , Toshiaki Fujita
IPC分类号： B23K20/02 , B23K35/30 , C22C21/06 , B32B15/01 , C22C9/00 , H01M2/30 , C22C21/12 , C22C21/02 , C22C21/00 , B23K33/00 , C22C9/04 , C22C19/00 , C22C9/06 , C22C38/00 , C22C21/16 , C22C19/03
CPC分类号： H01M2/305 , B23K20/02 , B23K33/004 , B23K35/3033 , B23K2103/10 , B23K2103/12 , B23K2103/18 , B32B15/012 , B32B15/015 , B32B15/017 , C22C9/00 , C22C9/04 , C22C9/06 , C22C19/002 , C22C19/03 , C22C21/00 , C22C21/02 , C22C21/06 , C22C21/12 , C22C21/16 , C22C38/00 , Y02E60/12 , Y10T428/12389 , Y10T428/12736 , Y10T428/12757
摘要： A clad plate includes an aluminum plate and a hard metal plate joined together at side end surfaces thereof. Side end surfaces of an aluminum plate and a hard metal plate are jointed together via a nickel layer by pressure welding. A ridge and a groove formed in the side end surface of the aluminum plate are respectively engaged and joined, via the nickel layer, to a groove and a ridge formed in the side end surface of the hard metal plate, and an end portion of the nickel layer extends beyond the rear end portion of the side end surface of the aluminum plate and is jointed to the plate surface of the aluminum plate with the end portion exposed thereon. The average width W of the exposed portion of the nickel layer exposed on the plate surface is preferably from about 0.2 mm to about 1.5 mm.
摘要翻译：复合板包括在其侧端面处接合在一起的铝板和硬金属板。铝板和硬金属板的侧端面经由镍层通过压焊接合在一起。形成在铝板的侧端面上的脊和沟槽分别通过镍层接合并接合到形成在硬金属板的侧端表面中的槽和脊，并且镍层延伸超过铝板的侧端面的后端部分，并且其端部暴露在铝板的板表面上。暴露在板表面上的镍层的暴露部分的平均宽度W优选为约0.2mm至约1.5mm。

6. 发明申请

US20130071686A1 ALUMINUM COPPER CLAD MATERIAL 有权
标题翻译：铝铜箔材料
公开(公告)号：US20130071686A1
公开(公告)日：2013-03-21
申请号：US13701677
申请日：2011-06-02
申请人： Yoshimitsu Oda , Masaaki Ishio , Akio Hashimoto , Kenji Ikeuchi
发明人： Yoshimitsu Oda , Masaaki Ishio , Akio Hashimoto , Kenji Ikeuchi
IPC分类号： B23K20/02 , B32B15/01
CPC分类号： C21D9/0068 , B23K20/02 , B32B15/017 , C21D1/26 , C22C9/00 , C22C9/04 , C22C21/00 , C22C21/08 , C22C21/10 , C22C21/14 , C22C21/16 , C22C21/18 , C22F1/04 , C22F1/047 , C22F1/053 , C22F1/057 , C22F1/08 , Y10T428/1275
摘要： An aluminum copper clad material has excellent bonding strength and includes an aluminum layer and a copper layer that are bonded without a nickel layer interposed therebetween.The aluminum layer and the copper layer that are diffusion-bonded via an Al—Cu intermetallic compound layer. The copper layer satisfies Dcs≦0.5×Dcc, where Dcc represents the average crystal grain size of crystal grains in a central portion in the thickness direction of the copper layer, and Dcs represents the average crystal grain size of an interface adjacent portion C2 in the copper layer that is about 0.5 μm apart from the interface between the copper layer and the intermetallic compound layer. The intermetallic compound layer has an average thickness of about 0.5 μm to about 10 μm.
摘要翻译：铝铜合金材料具有优异的接合强度，并且包括铝层和铜层，其间没有镍层接合。通过Al-Cu金属间化合物层扩散接合的铝层和铜层。铜层满足Dcs＆nlE; 0.5×Dcc，其中Dcc表示铜层的厚度方向的中心部分的晶粒的平均晶粒尺寸，Dcs表示铜层的相邻部分C2的界面的平均晶粒尺寸铜层与铜层和金属间化合物层之间的界面分开约0.5μm。金属间化合物层的平均厚度为约0.5μm〜约10μm。

7. 发明授权

US09266188B2 Aluminum copper clad material 有权
标题翻译：铝铜包材
公开(公告)号：US09266188B2
公开(公告)日：2016-02-23
申请号：US13701677
申请日：2011-06-02
申请人： Yoshimitsu Oda , Masaaki Ishio , Akio Hashimoto , Kenji Ikeuchi
发明人： Yoshimitsu Oda , Masaaki Ishio , Akio Hashimoto , Kenji Ikeuchi
IPC分类号： B32B15/20 , B23K20/02 , B32B15/01
CPC分类号： C21D9/0068 , B23K20/02 , B32B15/017 , C21D1/26 , C22C9/00 , C22C9/04 , C22C21/00 , C22C21/08 , C22C21/10 , C22C21/14 , C22C21/16 , C22C21/18 , C22F1/04 , C22F1/047 , C22F1/053 , C22F1/057 , C22F1/08 , Y10T428/1275
摘要： An aluminum copper clad material has excellent bonding strength and includes an aluminum layer and a copper layer that are bonded without a nickel layer interposed therebetween. The aluminum layer and the copper layer are diffusion-bonded via an Al—Cu intermetallic compound layer. The copper layer satisfies Dcs≦0.5×Dcc, where Dcc represents the average crystal grain size of crystal grains in a central portion in the thickness direction of the copper layer, and Dcs represents the average crystal grain size of an interface adjacent portion C2 in the copper layer that is about 0.5 μm apart from the interface between the copper layer and the intermetallic compound layer. The intermetallic compound layer has an average thickness of about 0.5 μm to about 10 μm.
摘要翻译：铝铜合金材料具有优异的接合强度，并且包括铝层和铜层，其间没有镍层接合。铝层和铜层通过Al-Cu金属间化合物层进行扩散接合。铜层满足Dcs＆nlE; 0.5×Dcc，其中Dcc表示铜层的厚度方向的中心部分的晶粒的平均晶粒尺寸，Dcs表示铜层的相邻部分C2的界面的平均晶粒尺寸铜层与铜层和金属间化合物层之间的界面分开约0.5μm。金属间化合物层的平均厚度为约0.5μm〜约10μm。

8. 发明申请

US20120077056A1 HIGH-TEMPERATURE BIMETAL 审中-公开
标题翻译：高温双金属
公开(公告)号：US20120077056A1
公开(公告)日：2012-03-29
申请号：US13375167
申请日：2010-05-21
申请人： Yoshimitsu Oda , Masaaki Ishio
发明人： Yoshimitsu Oda , Masaaki Ishio
IPC分类号： B32B15/01
CPC分类号： G12B1/02 , B32B15/011 , C22C38/08 , C22C38/12 , C22C38/40 , Y10T428/12465
摘要： A high-temperature bimetal capable of being inhibited from considerably shifting from an original position when the temperature has fallen to an ordinary temperature is provided. This high-temperature bimetal (1) includes a high thermal expansion layer (2) made of austenitic stainless steel and a low thermal expansion layer (3) made of a thermosensitive magnetic metal having a Curie point and bonded to the high thermal expansion layer. The high-temperature bimetal is employed over both a high temperature range of not less than the Curie point and a low temperature range of less than the Curie point, while an upper limit of operating temperatures in the high temperature range of not less than the Curie point is at least 500° C.
摘要翻译：提供了一种高温双金属，当温度降至常温时，可以抑制其从初始位置的显着偏移。该高温双金属（1）包括由奥氏体不锈钢制成的高热膨胀层（2）和具有居里点的热敏磁性金属制成的低热膨胀层（3），并与高热膨胀层接合。在不低于居里点的高温范围和小于居里点的低温范围内使用高温双金属，而在不低于居里的高温范围内的工作温度的上限点至少为500°C

9. 发明授权

US09350007B2 Connection plate for battery terminals and method for manufacturing connection plate for battery terminals 有权
标题翻译：电池端子用连接板及电池端子用连接板的制造方法
公开(公告)号：US09350007B2
公开(公告)日：2016-05-24
申请号：US13981768
申请日：2012-01-19
申请人： Yoshimitsu Oda , Masaharu Yamamoto , Masaaki Ishio
发明人： Yoshimitsu Oda , Masaharu Yamamoto , Masaaki Ishio
IPC分类号： H01M2/20 , H01R11/11 , H01M10/0525
CPC分类号： H01M2/202 , H01M2/206 , H01M10/0525 , H01R11/11 , Y02T10/7011 , Y10T29/49224
摘要： A connection plate for battery terminals capable of inhibiting a first member and a second member from being detached from each other is provided. This bus bar 2 (connection plate for battery terminals) includes a first member (3) including a first hole (30) and an embedding hole (31), made of first metal and a second member (4) having a second hole (42), including a base (40) made of second metal, embedded in the embedding hole of the first member, while an intermetallic compound layer (5) containing at least one of the first metal and the second metal is formed on an interface between the embedding hole of the first member and the second member.
摘要翻译：提供了能够抑制第一构件和第二构件彼此分离的用于电池端子的连接板。该汇流条2（电池端子用连接板）具备由第一金属构成的具备第一孔（30）和嵌入孔（31）的第一构件（3）和具有第二孔（42）的第二构件），包括嵌入在第一构件的嵌入孔中的由第二金属制成的基座（40），同时在第一金属和第二金属之间的界面上形成包含第一金属和第二金属中的至少一个的金属间化合物层（5）第一构件和第二构件的嵌入孔。

10. 发明申请

US20140099543A1 NEGATIVE ELECTRODE TERMINAL FOR BATTERY AND METHOD FOR PRODUCING NEGATIVE ELECTRODE TERMINAL FOR BATTERY 有权
标题翻译：用于电池的负极电极端子和用于生产用于电池的负极电极端子的方法
公开(公告)号：US20140099543A1
公开(公告)日：2014-04-10
申请号：US14119794
申请日：2012-05-31
申请人： Yoshimitsu Oda , Masaaki Ishio
发明人： Yoshimitsu Oda , Masaaki Ishio
IPC分类号： H01M2/30
CPC分类号： H01M2/30 , H01M2/06 , H01M2/202 , Y10T29/49108
摘要： A negative electrode terminal for a battery in which a first metal layer and a second metal layer hardly separate from each other is provided by inhibiting an intermetallic compound from being formed between the first metal layer and the second metal layer. This negative electrode terminal (8) for a battery is composed of a clad material formed by bonding a first metal layer (80), made of Al, including a first region connected with a battery terminal connecting plate and an adjacent second region on the same surface side as the first region and a second metal layer (81), made of Ni, connected with battery negative electrodes, while the second metal layer is arranged to be stacked on the first metal layer in the second region of the first metal layer.
摘要翻译：通过抑制在第一金属层和第二金属层之间形成金属间化合物，提供其中第一金属层和第二金属层几乎不彼此分离的电池用负极端子。该电池用负极端子（8）由将包含与电池端子连接板连接的第一区域和与其相邻的第二区域连接的由Al构成的第一金属层（80）表面侧为第一区域，第二金属层与镍电极连接，第二金属层被布置成层叠在第一金属层的第二区域中的第一金属层上。

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