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21. 发明授权

US09694467B2 Polishing method of polishing a substrate 有权
公开(公告)号：US09694467B2
公开(公告)日：2017-07-04
申请号：US15386624
申请日：2016-12-21
申请人： EBARA CORPORATION
发明人： Masaya Seki , Tetsuji Togawa
IPC分类号： B24B21/00 , B24B9/06
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/18
摘要： A polishing method of polishing a substrate includes moving a stopper from a predetermined initial position by a distance corresponding to a target polishing amount of a substrate. The method further includes pressing a polishing tool against the substrate by a pressing member while rotating the substrate. The method further includes polishing the substrate until a positioning member which moves together with the pressing member is brought into contact with the stopper.

22. 发明授权

US09630289B2 Polishing method involving a polishing member polishing at angle tangent to the substrate rotational direction 有权
公开(公告)号：US09630289B2
公开(公告)日：2017-04-25
申请号：US14034468
申请日：2013-09-23
申请人： EBARA CORPORATION
发明人： Tetsuji Togawa , Atsushi Yoshida , Michiyoshi Yamashita
IPC分类号： B24B9/06 , B24B21/00 , B24B21/20 , B24B9/10
CPC分类号： B24B9/065 , B24B9/102 , B24B21/00 , B24B21/002 , B24B21/20
摘要： A polishing method includes rotating a substrate, performing a first polishing process of pressing a polishing tape against an edge portion of the substrate by a pressing member, with a portion of the polishing tape projecting from the pressing member inwardly in a radial direction of the substrate, to polish the edge portion of the substrate and bend the portion of the polishing tape along the pressing member, and performing a second polishing process of pressing the bent portion of the polishing tape inwardly in the radial direction of the substrate by the pressing member to further polish the edge portion of the substrate.

23. 发明授权

US09604336B2 Belt transmission device and grinding apparatus 有权
公开(公告)号：US09604336B2
公开(公告)日：2017-03-28
申请号：US14801756
申请日：2015-07-16
申请人： BOE TECHNOLOGY GROUP CO., LTD. , HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
发明人： Yinchu Zhao , Haibin Liu , Jinjun Wang , Xu Li , Zuoxiang He , Xinqing Zhu
IPC分类号： B24B21/20 , B24B21/00 , B24B49/10 , B24B49/00 , G02F1/13
CPC分类号： B24B21/20 , B24B21/006 , B24B49/006 , B24B49/105 , G02F1/1303
摘要： The present disclosure provides a belt transmission device and a grinding apparatus. The device comprises: a grinding stand; rotation wheels mounted on the grinding stand, including a driver wheel and driven wheels; a grinding belt supported by rotation wheels; a first sensor fixedly provided on the grinding stand and configured to detect a rotation speed of any one of the driven wheels; and a controller configured to control a rotation speed of the driver wheel and connected with a driving motor of the driver wheel, wherein the controller is further connected with the first sensor, receives rotation speed signals of the one driven wheel detected by the first sensor, calculates difference between the rotation speeds of the driver wheel and the one driven wheel, and compares the difference with a predetermined difference range in the controller; and when the difference is beyond the predetermined difference range, an alarm is provided.

24. 发明授权

US09604335B2 Wafer polishing apparatus 有权
公开(公告)号：US09604335B2
公开(公告)日：2017-03-28
申请号：US15188638
申请日：2016-06-21
申请人： EBARA CORPORATION
发明人： Tetsuji Togawa , Atsushi Yoshida , Toshifumi Watanabe
IPC分类号： B24B9/06 , H01L21/463 , B24B21/00 , H01L21/02
CPC分类号： B24B9/065 , B24B21/002 , B24B21/004 , B24B21/008 , B24B21/06 , B24B27/0076 , H01L21/02035 , H01L21/463
摘要： An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.

25. 发明申请

US20160297048A1 WAFER POLISHING APPARATUS 有权
标题翻译：抛光抛光装置
公开(公告)号：US20160297048A1
公开(公告)日：2016-10-13
申请号：US15188638
申请日：2016-06-21
申请人： EBARA CORPORATION
发明人： Tetsuji TOGAWA , Atsushi YOSHIDA , Toshifumi WATANABE
IPC分类号： B24B9/06 , H01L21/463 , H01L21/02 , B24B21/00
CPC分类号： B24B9/065 , B24B21/002 , B24B21/004 , B24B21/008 , B24B21/06 , B24B27/0076 , H01L21/02035 , H01L21/463
摘要： An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.
摘要翻译：描述了抛光衬底的装置和方法。抛光包括：旋转衬底; 将第一抛光工具压靠在基板的边缘部分上以抛光边缘部分; 并且将第二抛光工具压靠在基板的边缘部分上以抛光边缘部分。相对于基板的径向方向，第二抛光工具位于比第一抛光工具更向内的位置。第一抛光工具具有比第二抛光工具的抛光表面更粗糙的抛光表面。

26. 发明授权

US09457448B2 Polishing apparatus and polishing method 有权
公开(公告)号：US09457448B2
公开(公告)日：2016-10-04
申请号：US14745863
申请日：2015-06-22
申请人： EBARA CORPORATION
发明人： Masaya Seki , Tetsuji Togawa , Masayuki Nakanishi
IPC分类号： B24B21/00 , B24B21/20 , H01L21/68 , H01L21/306 , H01L21/67 , H01L21/84 , B24B9/06 , H01L21/66
CPC分类号： B24B21/002 , B24B9/065 , B24B21/20 , H01L21/30625 , H01L21/67092 , H01L21/67259 , H01L21/68 , H01L21/84 , H01L22/20
摘要： The polishing apparatus has a polishing unit capable of forming a right-angled cross section by polishing a peripheral portion of the substrate. The polishing unit includes a polishing head having a pressing member configured to press a polishing tape against the peripheral portion of the substrate from above, a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and to recover the polishing tape from the polishing head, a first moving mechanism configured to move the polishing head in a radial direction of the substrate, and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate.

27. 发明授权

US09452504B2 Digital panel of belt sander 有权
标题翻译：数码面板砂带机
公开(公告)号：US09452504B2
公开(公告)日：2016-09-27
申请号：US14622624
申请日：2015-02-13
申请人： Bor-Yann Chuang
发明人： Bor-Yann Chuang
IPC分类号： B24B49/12 , B24B49/10 , B24B21/00 , B24B55/00 , B24B49/00
CPC分类号： B24B21/00 , B24B49/006 , B24B55/00
摘要： A digital panel of a belt sander includes a control module. The control module is electrically connected with a conveyer motor and an abrasive belt wheel motor of the belt sander. The control module is connected with a detection module. The control module is further connected with a digital display module and an operation module. Thereby, the operation module controls the conveyer motor and the abrasive belt wheel motor of the belt sander, and detects the running state of the conveyer motor and the abrasive belt wheel motor through the detection module, and displays the running data of the conveyer motor and the abrasive belt wheel motor through the digital display module for the belt sander to be digitalized.
摘要翻译：皮带砂光机的数字面板包括控制模块。控制模块与输送机马达和皮带砂光机的砂带轮马达电连接。控制模块与检测模块连接。控制模块还与数字显示模块和操作模块连接。由此，操作模块控制皮带砂光机的传送马达和砂带轮马达，并通过检测模块检测输送马达和砂带轮马达的运行状态，并显示运送数据和运送数据; 磨带轮电机通过数字显示模块将皮带砂光机数字化。

28. 发明授权

US09446496B2 Abrasive belt polishing finisher 有权
标题翻译：砂带磨光抛光机
公开(公告)号：US09446496B2
公开(公告)日：2016-09-20
申请号：US14320623
申请日：2014-06-30
申请人： Qiyue Chen
发明人： Qiyue Chen
IPC分类号： B24B21/16 , B24B21/12 , B24B21/02 , B24B21/00
CPC分类号： B24B21/16 , B24B21/002 , B24B21/008 , B24B21/02 , B24B21/20
摘要： The invention discloses an abrasive belt polishing finisher in the field of mechanical technology, which addresses inconvenient operation of the existing polishing finishers. The abrasive belt polishing finisher includes a motor and a connection support. The central section of the connection support is fixedly connected with the output shaft of the motor. Several self-rotable connection support finishing wheels are provided around the connection support. The curve surface of the rim of each of the support finishing wheels has a different curvature. Each connection support finishing wheel is distributed on the same circle centered on the output shaft of the motor. The connection support is driven by the motor into rotation to press and position one of the connection support finishing wheels against the back of the abrasive belt in the polishing finisher. The abrasive belt polishing finisher could satisfy continuous polishing treatment for different curved surfaces.
摘要翻译：本发明公开了一种在机械技术领域的研磨带抛光抛光机，其解决了现有抛光抛光机的不方便的操作。研磨带抛光修整机包括马达和连接支架。连接支架的中心部分与电机的输出轴固定连接。连接支撑件周围设置有几个自转连接支撑整理轮。每个支撑精整轮的边缘的曲面具有不同的曲率。每个连接支撑整理轮分布在以电机输出轴为中心的同一圆上。连接支撑件由电动机驱动旋转以将连接支撑精整轮中的一个压靠在研磨抛光机中的砂带背面。砂带抛光抛光机可以满足不同曲面的连续抛光处理。

29. 发明申请

US20160260625A1 POLISHING DEVICE AND POLISHING METHOD 审中-公开
标题翻译：抛光装置和抛光方法
公开(公告)号：US20160260625A1
公开(公告)日：2016-09-08
申请号：US14844214
申请日：2015-09-03
申请人： Kabushiki Kaisha Toshiba
发明人： Masayoshi ADACHI , Jun TAKAYASU
IPC分类号： H01L21/67 , H01L21/02 , B24B49/00 , B24B21/00 , B24B49/12
CPC分类号： H01L21/67092 , B24B21/002 , B24B49/003 , B24B49/12 , H01L21/02035 , H01L21/02087 , H01L21/67219 , H01L22/12 , H01L22/26
摘要： According to one embodiment, a polishing device includes a stage holding a wafer, a polishing part polishing a film formed on a circumferential edge portion of the wafer, a detector detecting a residual portion of the film on the circumferential edge portion, a first movable part moving the detector along a surface of the circumferential edge portion; and a controller controlling the polishing part based on a state of the circumferential edge portion detected by the detector.
摘要翻译：根据一个实施例，抛光装置包括保持晶片的台，抛光形成在晶片的周缘部分上的膜的抛光部分，检测在周缘部分上的膜的残留部分的检测器，第一可移动部分沿着所述周缘部的表面移动所述检测器; 以及控制器，其基于由所述检测器检测到的所述周缘部的状态来控制所述研磨部。

30. 发明申请

US20150352682A1 POLISHING APPARATUS 审中-公开
标题翻译：抛光装置
公开(公告)号：US20150352682A1
公开(公告)日：2015-12-10
申请号：US14828972
申请日：2015-08-18
申请人： EBARA CORPORATION
发明人： Kazuaki MAEDA , Tamami TAKAHASHI , Masaya SEKI , Hiroaki KUSA
IPC分类号： B24B21/00 , B24B41/06 , B24B9/06
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/06 , B24B21/08 , B24B37/04 , B24B41/06
摘要： A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.
摘要翻译：抛光装置通过使抛光工具与基板滑动接触来抛光基板的周边。抛光装置包括：基板保持机构，其构造成保持基板并使基板旋转;抛光机构，其构造成将抛光工具抵靠基板的周边按压以周边抛光;以及周边支撑机构，其构造成支撑通过流体的衬底的周边。周边支撑机构构造成从基板的周边的相对侧或同一侧支撑基板的表面。

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