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21. 发明申请

US20160297048A1 WAFER POLISHING APPARATUS 有权
标题翻译：抛光抛光装置
公开(公告)号：US20160297048A1
公开(公告)日：2016-10-13
申请号：US15188638
申请日：2016-06-21
申请人： EBARA CORPORATION
发明人： Tetsuji TOGAWA , Atsushi YOSHIDA , Toshifumi WATANABE
IPC分类号： B24B9/06 , H01L21/463 , H01L21/02 , B24B21/00
CPC分类号： B24B9/065 , B24B21/002 , B24B21/004 , B24B21/008 , B24B21/06 , B24B27/0076 , H01L21/02035 , H01L21/463
摘要： An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.
摘要翻译：描述了抛光衬底的装置和方法。抛光包括：旋转衬底; 将第一抛光工具压靠在基板的边缘部分上以抛光边缘部分; 并且将第二抛光工具压靠在基板的边缘部分上以抛光边缘部分。相对于基板的径向方向，第二抛光工具位于比第一抛光工具更向内的位置。第一抛光工具具有比第二抛光工具的抛光表面更粗糙的抛光表面。

22. 发明授权

US09457448B2 Polishing apparatus and polishing method 有权
公开(公告)号：US09457448B2
公开(公告)日：2016-10-04
申请号：US14745863
申请日：2015-06-22
申请人： EBARA CORPORATION
发明人： Masaya Seki , Tetsuji Togawa , Masayuki Nakanishi
IPC分类号： B24B21/00 , B24B21/20 , H01L21/68 , H01L21/306 , H01L21/67 , H01L21/84 , B24B9/06 , H01L21/66
CPC分类号： B24B21/002 , B24B9/065 , B24B21/20 , H01L21/30625 , H01L21/67092 , H01L21/67259 , H01L21/68 , H01L21/84 , H01L22/20
摘要： The polishing apparatus has a polishing unit capable of forming a right-angled cross section by polishing a peripheral portion of the substrate. The polishing unit includes a polishing head having a pressing member configured to press a polishing tape against the peripheral portion of the substrate from above, a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and to recover the polishing tape from the polishing head, a first moving mechanism configured to move the polishing head in a radial direction of the substrate, and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate.

23. 发明授权

US09452504B2 Digital panel of belt sander 有权
标题翻译：数码面板砂带机
公开(公告)号：US09452504B2
公开(公告)日：2016-09-27
申请号：US14622624
申请日：2015-02-13
申请人： Bor-Yann Chuang
发明人： Bor-Yann Chuang
IPC分类号： B24B49/12 , B24B49/10 , B24B21/00 , B24B55/00 , B24B49/00
CPC分类号： B24B21/00 , B24B49/006 , B24B55/00
摘要： A digital panel of a belt sander includes a control module. The control module is electrically connected with a conveyer motor and an abrasive belt wheel motor of the belt sander. The control module is connected with a detection module. The control module is further connected with a digital display module and an operation module. Thereby, the operation module controls the conveyer motor and the abrasive belt wheel motor of the belt sander, and detects the running state of the conveyer motor and the abrasive belt wheel motor through the detection module, and displays the running data of the conveyer motor and the abrasive belt wheel motor through the digital display module for the belt sander to be digitalized.
摘要翻译：皮带砂光机的数字面板包括控制模块。控制模块与输送机马达和皮带砂光机的砂带轮马达电连接。控制模块与检测模块连接。控制模块还与数字显示模块和操作模块连接。由此，操作模块控制皮带砂光机的传送马达和砂带轮马达，并通过检测模块检测输送马达和砂带轮马达的运行状态，并显示运送数据和运送数据; 磨带轮电机通过数字显示模块将皮带砂光机数字化。

24. 发明授权

US09446496B2 Abrasive belt polishing finisher 有权
标题翻译：砂带磨光抛光机
公开(公告)号：US09446496B2
公开(公告)日：2016-09-20
申请号：US14320623
申请日：2014-06-30
申请人： Qiyue Chen
发明人： Qiyue Chen
IPC分类号： B24B21/16 , B24B21/12 , B24B21/02 , B24B21/00
CPC分类号： B24B21/16 , B24B21/002 , B24B21/008 , B24B21/02 , B24B21/20
摘要： The invention discloses an abrasive belt polishing finisher in the field of mechanical technology, which addresses inconvenient operation of the existing polishing finishers. The abrasive belt polishing finisher includes a motor and a connection support. The central section of the connection support is fixedly connected with the output shaft of the motor. Several self-rotable connection support finishing wheels are provided around the connection support. The curve surface of the rim of each of the support finishing wheels has a different curvature. Each connection support finishing wheel is distributed on the same circle centered on the output shaft of the motor. The connection support is driven by the motor into rotation to press and position one of the connection support finishing wheels against the back of the abrasive belt in the polishing finisher. The abrasive belt polishing finisher could satisfy continuous polishing treatment for different curved surfaces.
摘要翻译：本发明公开了一种在机械技术领域的研磨带抛光抛光机，其解决了现有抛光抛光机的不方便的操作。研磨带抛光修整机包括马达和连接支架。连接支架的中心部分与电机的输出轴固定连接。连接支撑件周围设置有几个自转连接支撑整理轮。每个支撑精整轮的边缘的曲面具有不同的曲率。每个连接支撑整理轮分布在以电机输出轴为中心的同一圆上。连接支撑件由电动机驱动旋转以将连接支撑精整轮中的一个压靠在研磨抛光机中的砂带背面。砂带抛光抛光机可以满足不同曲面的连续抛光处理。

25. 发明申请

US20160260625A1 POLISHING DEVICE AND POLISHING METHOD 审中-公开
标题翻译：抛光装置和抛光方法
公开(公告)号：US20160260625A1
公开(公告)日：2016-09-08
申请号：US14844214
申请日：2015-09-03
申请人： Kabushiki Kaisha Toshiba
发明人： Masayoshi ADACHI , Jun TAKAYASU
IPC分类号： H01L21/67 , H01L21/02 , B24B49/00 , B24B21/00 , B24B49/12
CPC分类号： H01L21/67092 , B24B21/002 , B24B49/003 , B24B49/12 , H01L21/02035 , H01L21/02087 , H01L21/67219 , H01L22/12 , H01L22/26
摘要： According to one embodiment, a polishing device includes a stage holding a wafer, a polishing part polishing a film formed on a circumferential edge portion of the wafer, a detector detecting a residual portion of the film on the circumferential edge portion, a first movable part moving the detector along a surface of the circumferential edge portion; and a controller controlling the polishing part based on a state of the circumferential edge portion detected by the detector.
摘要翻译：根据一个实施例，抛光装置包括保持晶片的台，抛光形成在晶片的周缘部分上的膜的抛光部分，检测在周缘部分上的膜的残留部分的检测器，第一可移动部分沿着所述周缘部的表面移动所述检测器; 以及控制器，其基于由所述检测器检测到的所述周缘部的状态来控制所述研磨部。

26. 发明申请

US20150352682A1 POLISHING APPARATUS 审中-公开
标题翻译：抛光装置
公开(公告)号：US20150352682A1
公开(公告)日：2015-12-10
申请号：US14828972
申请日：2015-08-18
申请人： EBARA CORPORATION
发明人： Kazuaki MAEDA , Tamami TAKAHASHI , Masaya SEKI , Hiroaki KUSA
IPC分类号： B24B21/00 , B24B41/06 , B24B9/06
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/06 , B24B21/08 , B24B37/04 , B24B41/06
摘要： A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.
摘要翻译：抛光装置通过使抛光工具与基板滑动接触来抛光基板的周边。抛光装置包括：基板保持机构，其构造成保持基板并使基板旋转;抛光机构，其构造成将抛光工具抵靠基板的周边按压以周边抛光;以及周边支撑机构，其构造成支撑通过流体的衬底的周边。周边支撑机构构造成从基板的周边的相对侧或同一侧支撑基板的表面。

27. 发明授权

US09199352B2 Polishing apparatus, polishing method and pressing member for pressing a polishing tool 有权
标题翻译：抛光装置，抛光方法和用于按压抛光工具的按压构件
公开(公告)号：US09199352B2
公开(公告)日：2015-12-01
申请号：US12986481
申请日：2011-01-07
申请人： Masaya Seki , Kenya Ito , Masayuki Nakanishi
发明人： Masaya Seki , Kenya Ito , Masayuki Nakanishi
IPC分类号： B24B9/00 , B24B9/06 , B24B21/00 , B24B37/27
CPC分类号： B24B9/065 , B24B21/004 , B24B37/27
摘要： A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and to rotate the substrate and at least one polishing head disposed near the peripheral portion of the substrate. The polishing head has at least one protrusion extending along a circumferential direction of the substrate, and the polishing head is configured to press a polishing surface of a polishing tape by the protrusion against the peripheral portion of the substrate from above or below.
摘要翻译：抛光装置精确而均匀地抛光基板的顶边部分和/或底边部分。抛光装置包括旋转保持机构，其构造成水平地保持基板并旋转基板和设置在基板的周边部分附近的至少一个抛光头。抛光头具有沿着基板周向延伸的至少一个突出部，并且抛光头构造成通过突起抵靠基板的周边部分从上方或下方按压抛光带的抛光表面。

28. 发明授权

US09144877B2 Machining method and machining device of component 有权
标题翻译：组件的加工方法和加工装置
公开(公告)号：US09144877B2
公开(公告)日：2015-09-29
申请号：US14210133
申请日：2014-03-13
申请人： PANASONIC CORPORATION
发明人： Shoji Nakano
IPC分类号： B24B21/00 , B24B29/02
CPC分类号： B24B21/008 , B24B21/08 , B24B29/02
摘要： Machining of the present invention is machining of polishing work to be polished by movement of polishing sheet relative to work, in a state where polishing sheet is in contact with a surface of work to be polished. In the machining, work is arranged in contact with polishing sheet in a state where work is sandwiched between first simultaneous machining material with hardness lower than that of work, and second simultaneous machining material with hardness higher than that of work, and work is polished by relative movement of polishing sheet from first simultaneous machining material toward second simultaneous machining material.
摘要翻译：本发明的加工是在抛光片与待抛光工件的表面接触的状态下，通过抛光片相对于工件的移动来加工待抛光的抛光工件。在机械加工中，在硬度低于作业的第一同步加工材料夹持工件的状态下，与硬度比作业高的第二同时加工材料的状态下，与抛光片接触的工作，抛光片从第一同时加工材料到第二同时加工材料的相对移动。

29. 发明申请

US20150235858A1 WAFER BACK-SIDE POLISHING SYSTEM AND METHOD FOR INTEGRATED CIRCUIT DEVICE MANUFACTURING PROCESSES 有权
标题翻译： WAFER背面抛光系统及其集成电路设备制造工艺的方法
公开(公告)号：US20150235858A1
公开(公告)日：2015-08-20
申请号：US14181814
申请日：2014-02-17
申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
发明人： Shen-Nan Lee , Teng-Chun Tsai , Hsin-Hsien Lu , Chang-Sheng Lin , Kuo-Cheng Lien , Kuo-Yin Lin , Wen-Kuei Liu , Yu-Wei Chou
IPC分类号： H01L21/306 , H01L21/66 , B24B21/00 , H01L21/02 , B24B9/06 , B24B7/22
CPC分类号： H01L21/0209 , B24B7/228 , B24B9/065 , B24B21/002 , H01L21/02043 , H01L21/02057 , H01L21/02087 , H01L21/02096 , H01L21/30625 , H01L21/67092 , H01L21/67288 , H01L22/12 , H01L22/20
摘要： A wafer polishing process includes polishing a central area on the back side of a wafer, polishing a peripheral area on the back side of the wafer, buffing the central area, and buffing the peripheral area. The process can significantly reduce scratch-related wafer breakage, can correct focus spots on wafers, and can replace cleaning processes that use chemical etchants. Polishing and buffing can include polishing and buffing the bevel region. Further improvements include polishing with abrasive pads having a soft backing, polishing or buffing with pads having relatively soft abrasive particles, polishing or buffing with abrasive pads made from abrasive particles that have been sorted and selected for regularity of shape, irrigating the surface being polished or buffed with an aqueous solution that includes a friction-reducing agent, and buffing with abrasive pads having 20k or finer grit or non-abrasive pads.
摘要翻译：晶片抛光工艺包括抛光晶片背面的中心区域，抛光晶片背面的周边区域，抛光中心区域，以及抛光周边区域。该过程可以显着减少划痕相关的晶片断裂，可以校正晶片上的焦点，并可以替代使用化学蚀刻剂的清洗工艺。抛光和抛光可以包括抛光和抛光斜面区域。进一步的改进包括用具有柔软背衬的研磨垫，抛光或抛光，具有相对较软的磨料颗粒的垫，抛光或抛光，其中由磨料颗粒制成的研磨垫已被分选并选择成规则形状，冲洗正被抛光的表面用包含减摩剂的水溶液抛光，并用具有20k或更细砂粒或非研磨垫的研磨垫进行抛光。

30. 发明授权

US09102030B2 Edge finishing apparatus 有权
标题翻译：边缘整理设备
公开(公告)号：US09102030B2
公开(公告)日：2015-08-11
申请号：US13169499
申请日：2011-06-27
申请人： Charles Michael Darcangelo , Steven Edward DeMartino , Aric Bruce Shorey , Daniel Duane Strong , David Alan Tammaro , Butchi Reddy Vaddi
发明人： Charles Michael Darcangelo , Steven Edward DeMartino , Aric Bruce Shorey , Daniel Duane Strong , David Alan Tammaro , Butchi Reddy Vaddi
IPC分类号： B24B41/06 , B24B1/00 , B24B9/06 , B24B21/00 , B24B29/00 , B24B31/112 , B24B37/00
CPC分类号： B24B31/112 , B24B1/005 , B24B9/065 , B24B21/002 , B24B29/00 , B24B37/00
摘要： An edge finishing apparatus includes a surface, a fluid delivery device configured to deliver at least one magnetorheological polishing fluid (MPF) ribbon to the at least one well, at least one magnet placed adjacent to the surface to selectively apply a magnetic field in a vicinity of the surface, and at least one holder placed in opposing relation to the surface, the at least one holder being configured to support at least one article such that an edge of the at least one article can be selectively immersed in the MPF ribbon delivered to the at least one well.
摘要翻译：边缘整理装置包括表面，流体输送装置，其构造成将至少一个磁流变抛光流体（MPF）带输送到至少一个阱，至少一个磁体，其邻近表面放置，以选择性地在附近施加磁场的至少一个保持器，所述至少一个保持器被配置为支撑至少一个物品，使得所述至少一个物品的边缘可以选择性地浸入被输送到所述至少一个物品的所述MPF带中至少一口井。

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