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1. 发明申请

US20160297048A1 WAFER POLISHING APPARATUS 有权
标题翻译：抛光抛光装置
公开(公告)号：US20160297048A1
公开(公告)日：2016-10-13
申请号：US15188638
申请日：2016-06-21
申请人： EBARA CORPORATION
发明人： Tetsuji TOGAWA , Atsushi YOSHIDA , Toshifumi WATANABE
IPC分类号： B24B9/06 , H01L21/463 , H01L21/02 , B24B21/00
CPC分类号： B24B9/065 , B24B21/002 , B24B21/004 , B24B21/008 , B24B21/06 , B24B27/0076 , H01L21/02035 , H01L21/463
摘要： An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.
摘要翻译：描述了抛光衬底的装置和方法。抛光包括：旋转衬底; 将第一抛光工具压靠在基板的边缘部分上以抛光边缘部分; 并且将第二抛光工具压靠在基板的边缘部分上以抛光边缘部分。相对于基板的径向方向，第二抛光工具位于比第一抛光工具更向内的位置。第一抛光工具具有比第二抛光工具的抛光表面更粗糙的抛光表面。

2. 发明申请

US20150151398A1 POLISHING APPARATUS AND POLISHING METHOD 审中-公开
标题翻译：抛光装置和抛光方法
公开(公告)号：US20150151398A1
公开(公告)日：2015-06-04
申请号：US14618426
申请日：2015-02-10
申请人： EBARA CORPORATION
发明人： Masaya SEKI , Tetsuji TOGAWA , Masayuki NAKANISHI , Naoki MATSUDA , Atsushi YOSHIDA
IPC分类号： B24B21/00 , B24B21/20
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/006 , B24B21/008 , B24B21/20
摘要： The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.
摘要翻译：抛光装置具有能够抛光基板的周边部分以形成直角横截面的抛光单元。抛光装置包括：保持和旋转衬底的衬底保持器; 支撑抛光带的导辊; 以及抛光头，其具有从上方将研磨带的边缘压靠在基板的周边部分的按压部件。引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。基板保持器包括：保持基板的保持台; 以及支撑台，其整体地支撑基板的周边部分的下表面。支撑台与保持台一致地旋转。

3. 发明申请

US20140213155A1 WAFER POLISHING APPARATUS AND METHOD 有权
标题翻译：抛光抛光装置和方法
公开(公告)号：US20140213155A1
公开(公告)日：2014-07-31
申请号：US14167898
申请日：2014-01-29
申请人： EBARA CORPORATION
发明人： Tetsuji TOGAWA , Atsushi YOSHIDA , Toshifumi WATANABE
IPC分类号： B24B9/06 , B24B21/00 , H01L21/463
CPC分类号： B24B9/065 , B24B21/002 , B24B21/004 , B24B21/008 , B24B21/06 , B24B27/0076 , H01L21/02035 , H01L21/463
摘要： An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.
摘要翻译：描述了抛光衬底的装置和方法。抛光包括：旋转衬底; 将第一抛光工具压靠在基板的边缘部分上以抛光边缘部分; 并且将第二抛光工具压靠在基板的边缘部分上以抛光边缘部分。相对于基板的径向方向，第二抛光工具位于比第一抛光工具更向内的位置。第一抛光工具具有比第二抛光工具的抛光表面更粗糙的抛光表面。

4. 发明申请

US20140094095A1 POLISHING METHOD 有权
标题翻译：抛光方法
公开(公告)号：US20140094095A1
公开(公告)日：2014-04-03
申请号：US14034468
申请日：2013-09-23
申请人： EBARA CORPORATION
发明人： Tetsuji TOGAWA , Atsushi YOSHIDA , Michiyoshi YAMASHITA
IPC分类号： B24B9/06
CPC分类号： B24B9/065 , B24B9/102 , B24B21/00 , B24B21/002 , B24B21/20
摘要： A polishing method includes rotating a substrate, performing a first polishing process of pressing a polishing tape against an edge portion of the substrate by a pressing member, with a portion of the polishing tape projecting from the pressing member inwardly in a radial direction of the substrate, to polish the edge portion of the substrate and bend the portion of the polishing tape along the pressing member, and performing a second polishing process of pressing the bent portion of the polishing tape inwardly in the radial direction of the substrate by the pressing member to further polish the edge portion of the substrate.
摘要翻译：抛光方法包括旋转基板，执行第一抛光工艺，其通过按压部件将研磨带压靠在基板的边缘部分，抛光带的一部分沿着基板的径向向内突出，抛光基板的边缘部分并沿着加压部件弯曲抛光带的一部分，并且进行第二抛光处理，该抛光工艺通过按压部件沿着基板的径向向内按压研磨带的弯曲部分，进一步抛光衬底的边缘部分。

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