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21. 发明授权

US09485857B2 Flat panel display apparatus and method for manufacturing the same 有权
标题翻译：平板显示装置及其制造方法
公开(公告)号：US09485857B2
公开(公告)日：2016-11-01
申请号：US14134467
申请日：2013-12-19
申请人： Samsung Display Co., Ltd.
发明人： Dae-Jin Park , Bum-Soo Kam , Ha-Young Park , Gil-Hwan Yeo
IPC分类号： G02F1/1345 , H05K1/02 , H01L27/12 , H05K3/40 , H05K3/00
CPC分类号： H05K1/028 , G02F1/13452 , H01L27/124 , H01L27/1262 , H05K3/0044 , H05K3/403 , H05K3/4092 , H05K2201/0397 , H05K2201/10136 , H05K2203/0228 , H05K2203/107
摘要： A flat panel display apparatus for reducing a bezel size and a method for manufacturing the same. The flat panel display apparatus includes a lower substrate having a display area and a peripheral area surrounding the display area, an upper substrate corresponding to the lower substrate, a sealing member disposed along the peripheral area of the lower substrate and bonding the lower substrate and the upper substrate, a first flexible layer disposed on a surface of the lower substrate in a direction facing the upper substrate, in the peripheral area of the lower substrate, the first flexible layer extending to an outside of the lower substrate, and a first wiring disposed between the lower substrate and the sealing member and extending to the outside of the lower substrate and along the first flexible layer.
摘要翻译：一种用于减小边框尺寸的平板显示装置及其制造方法。平板显示装置包括具有显示区域的周边区域和围绕显示区域的周边区域的下基板，与下基板对应的上基板，沿着下基板的周边区域配置的密封构件，上基板，在下基板的面向上基板的方向上设置在下基板的表面上的第一柔性层，在下基板的周边区域中，第一柔性层延伸到下基板的外侧，第一布线设置在下基板和密封构件之间并且延伸到下基板的外部并且沿着第一柔性层延伸。

22. 发明授权

US09357639B2 Circuit board having a plated through hole through a conductive pad 有权
标题翻译：电路板具有通过导电焊盘的电镀通孔
公开(公告)号：US09357639B2
公开(公告)日：2016-05-31
申请号：US14633726
申请日：2015-02-27
申请人： Metrospec Technology, LLC
发明人： Henry V. Holec , Wm. Todd Crandell
IPC分类号： H01R12/00 , H05K1/02 , H01R4/02 , H01R12/52 , H01R13/717 , H05K1/11 , H05K1/14 , H05K3/00 , H05K3/36 , F21Y101/02 , F21Y111/00
CPC分类号： H05K1/0293 , F21Y2107/30 , F21Y2115/10 , H01R4/02 , H01R9/096 , H01R12/523 , H01R13/717 , H05K1/0266 , H05K1/0269 , H05K1/0292 , H05K1/0298 , H05K1/11 , H05K1/113 , H05K1/118 , H05K1/14 , H05K1/144 , H05K1/147 , H05K3/0061 , H05K3/363 , H05K2201/041 , H05K2201/09481 , H05K2201/09918 , H05K2201/10106 , H05K2201/2027 , H05K2203/0228
摘要： In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.
摘要翻译：在一些实施例中，可互连电路板可以包括以下特征中的一个或多个：（a）位于电路板顶部的第一导电焊盘，（b）导电焊盘上的电镀通孔，电路板，（c）耦合到电镀通孔的第二导电焊盘; 第二导电焊盘能够电连接到附接到第二可互连电路板的顶部的第三导电焊盘，（d）切割标记，指示用于分离电路板的安全位置，以及（e）与第二导电焊盘相邻的第二切割标记可以利用第一和第二切割标记之间的区域来进行通过电路板的安全切割的第一切割标记。

23. 发明授权

US09313891B2 Slot-mounted printed circuit board having small insertion force 有权
标题翻译：具有小插入力的插槽式印刷电路板
公开(公告)号：US09313891B2
公开(公告)日：2016-04-12
申请号：US13759504
申请日：2013-02-05
申请人： Jin-San Jung , Joo-Han Lee , Hyun-Seok Choi
发明人： Jin-San Jung , Joo-Han Lee , Hyun-Seok Choi
IPC分类号： H05K1/14 , H05K3/02 , H05K3/22 , H05K1/11 , H05K3/00
CPC分类号： H05K1/141 , H05K1/117 , H05K3/0052 , H05K3/02 , H05K3/22 , H05K2201/09154 , H05K2201/09172 , H05K2201/10159 , H05K2203/0228 , Y10T29/49155 , Y10T29/49156
摘要： A printed circuit board (PCB) prevents damage to tabs of the PCB and pins of a slot by reducing insertion force when the PCB is inserted in the slot. The PCB includes a body portion including a first surface and a second surface and a metal interconnection layer formed on at least one of the first and second surfaces. The metal interconnecting layer includes tabs formed along a first edge of the body portion. An insertion force alleviation portion in which at least a portion of the body portion is removed is formed in the first edge to reduce the insertion force required to seat the PCB within the slot.
摘要翻译：印刷电路板（PCB）通过减少PCB插入插槽中时的插入力，防止PCB和插针的插针损坏。 PCB包括主体部分，其包括形成在第一表面和第二表面中的至少一个上的第一表面和第二表面以及金属互连层。金属互连层包括沿主体部分的第一边缘形成的突出部。在第一边缘中形成其中去除主体部分的至少一部分的插入力减轻部分，以减小将PCB安置在槽内所需的插入力。

24. 发明申请

US20160057872A1 DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME 审中-公开
标题翻译：显示装置及其制造方法
公开(公告)号：US20160057872A1
公开(公告)日：2016-02-25
申请号：US14731333
申请日：2015-06-04
申请人： SAMSUNG DISPLAY CO., LTD.
发明人： Sung Dong Park , Hyeok Tae Kwon , Sang Hwan Lee , Ki Seok Cha
IPC分类号： H05K5/00 , F21V8/00 , H05K1/03 , H05K1/02 , H05K3/22 , H05K13/00
CPC分类号： G02B6/0083 , G02B6/0086 , G02F1/13452 , H04N5/64 , H05K1/0278 , H05K1/189 , H05K3/0058 , H05K3/361 , H05K3/4691 , H05K2201/0909 , H05K2201/10136 , H05K2203/0228 , H05K2203/107
摘要： A display device may include a display panel having a curved shape, a first printed circuit board and a second printed circuit board, at least one first carrier tape configured to connect the first printed circuit board to the display panel, at least one second carrier tape configured to connect the second printed circuit board to the display panel, and a connection unit configured to connect the first and second printed circuit boards to each other. A part of a layer of the connection unit may be a portion of a layer included in at least one of the first and second printed circuit boards.
摘要翻译：显示装置可以包括具有弯曲形状的显示面板，第一印刷电路板和第二印刷电路板，构造成将第一印刷电路板连接到显示面板的至少一个第一载体带，至少一个第二载体带被配置为将第二印刷电路板连接到显示面板，以及连接单元，被配置为将第一和第二印刷电路板彼此连接。连接单元的层的一部分可以是包括在第一和第二印刷电路板中的至少一个中的层的一部分。

25. 发明授权

US09230467B2 Display module and assembly method thereof 有权
标题翻译：显示模块及其装配方法
公开(公告)号：US09230467B2
公开(公告)日：2016-01-05
申请号：US13105896
申请日：2011-05-12
申请人： Janglin Chen , Tzeng-Shii Tsai , Hwa-Nien Yu
发明人： Janglin Chen , Tzeng-Shii Tsai , Hwa-Nien Yu
IPC分类号： G02F1/1345 , G09G3/20 , H05K1/02 , H05K1/18 , G02F1/1333
CPC分类号： G09G3/20 , G02F1/133305 , G02F1/1345 , G09G2300/0426 , G09G2310/0281 , H05K1/028 , H05K1/189 , H05K2201/053 , H05K2201/055 , H05K2201/10128 , H05K2203/0228
摘要： A display module and an assembly method thereof are provided. The display module includes a display region, at least one connection terminal, and a plurality of connective lines. The display region, the connection terminal, and the connective lines are disposed on a same flexible substrate. A plurality of pixels is arranged within the display region. The connection terminal is arranged at an extension portion of a non-display region of the flexible substrate. The connective lines respectively connect the pixels in the display region to the connection terminal at the extension portion. The connection terminal is connected to an external circuit for receiving signals and transmitting the same to the display region.
摘要翻译：提供了显示模块及其组装方法。显示模块包括显示区域，至少一个连接终端和多条连接线。显示区域，连接端子和连接线设置在相同的柔性基板上。多个像素被布置在显示区域内。连接端子布置在柔性基板的非显示区域的延伸部分处。连接线分别将显示区域中的像素连接到延伸部分处的连接端子。连接端子连接到用于接收信号的外部电路，并将其发送到显示区域。

26. 发明申请

US20150373829A1 PRINTED WIRING BOARD 有权
标题翻译：印刷线路板
公开(公告)号：US20150373829A1
公开(公告)日：2015-12-24
申请号：US14649204
申请日：2014-01-14
申请人： MEIKO ELECTRONICS CO., LTD.
发明人： Akihiro Ishikawa , Toru Yamamoto , Kazuya Inokuchi
IPC分类号： H05K1/02
CPC分类号： H05K1/028 , H05K1/024 , H05K1/025 , H05K1/0278 , H05K1/0281 , H05K3/0044 , H05K3/282 , H05K3/4652 , H05K3/4691 , H05K2201/0187 , H05K2201/0191 , H05K2203/0207 , H05K2203/0228
摘要： A printed wiring board includes: an inner layer structure body containing at least an inner layer insulative base material composed of a glass cloth and resin which covers the glass cloth and not containing a resin insulative base material composed only of resin; outer layer wiring formed on a first face of the inner layer structure body; and a solder resist layer formed on a surface of the outer layer wiring, wherein in the inner layer structure body, an opening part is formed, and the solder resist layer is composed of a first ink part covering at least the outer layer wiring that is formed on a partial region of the first face which corresponds to the opening part and a second ink part interposing both ends of the first ink part and being lower in flexibility than the first ink part.
摘要翻译：印刷电路板包括：内层结构体，至少包含由玻璃布构成的内层绝缘基材和覆盖玻璃布的树脂，不含仅由树脂构成的树脂绝缘基材; 形成在所述内层结构体的第一面上的外层布线; 以及形成在所述外层布线的表面上的阻焊层，其中在所述内层结构体中形成有开口部，所述阻焊层由至少覆盖外层布线的第一墨部构成，形成在与开口部相对应的第一面的部分区域上，以及插入第一墨部的两端并且柔性比第一墨部低的第二墨部。

27. 发明申请

US20150257276A1 METHOD FOR MANUFACTURING WIRING BOARD 有权
标题翻译：制造接线板的方法
公开(公告)号：US20150257276A1
公开(公告)日：2015-09-10
申请号：US14633241
申请日：2015-02-27
申请人： IBIDEN CO., LTD.
发明人： Toshihide MAKINO
IPC分类号： H05K3/10 , H05K3/00
CPC分类号： H05K3/0052 , H05K3/0047 , H05K3/403 , H05K2203/0228 , Y10T29/49124
摘要： A method for manufacturing a wiring board includes preparing a large-sized wiring board having an effective region and a dummy region such that the board has a penetrating hole on a border of the effective and dummy regions and an inner-hole conductive layer covering an inner surface of the penetrating hole, moving a rotary tool having a tip blade along rotation axis at a peripheral portion of the penetrating hole such that the rotary tool drills a hole into the board at the peripheral portion and segments the conductive layer into portions in the effective and dummy regions, and moving a rotary tool having a side blade in a direction perpendicular to rotation axis such that the dummy region is cut off from the effective region after the rotary tool having tip blade makes the hole and a wiring board having the effective region of the board is formed.
摘要翻译：一种布线基板的制造方法，其特征在于，准备具有有效区域和虚设区域的大型布线基板，使得所述基板在有效区域和虚设区域的边界上具有贯通孔，以及覆盖内部所述贯通孔的表面在所述贯通孔的周缘部沿着旋转轴移动具有尖端刀片的旋转工具，使得所述旋转工具在所述周边部分向所述板钻一孔，并将所述导电层分割成有效的部分和虚拟区域，并且使具有侧叶片的旋转工具沿垂直于旋转轴线的方向移动，使得在具有尖端刀片的旋转工具形成该孔之后，虚拟区域与有效区域切断，并且具有有效区域的布线板的董事会成立。

28. 发明申请

US20150249059A1 VERSATILE AND RELIABLE INTELLIGENT PACKAGE 有权
标题翻译：多功能和可靠的智能包装
公开(公告)号：US20150249059A1
公开(公告)日：2015-09-03
申请号：US14430173
申请日：2013-09-23
申请人： STORA ENSO OYJ
发明人： Juha Maijala
IPC分类号： H01L23/66 , H01L23/58 , H01L23/00 , H01L23/64
CPC分类号： H01L23/66 , A61J1/035 , A61J2200/30 , A61J2205/60 , B65D25/00 , B65D2203/10 , H01L23/4985 , H01L23/564 , H01L23/585 , H01L23/642 , H01L23/645 , H01L2924/0002 , H05K1/0216 , H05K1/0239 , H05K1/0275 , H05K1/028 , H05K1/0292 , H05K1/111 , H05K1/165 , H05K3/0052 , H05K3/301 , H05K3/303 , H05K3/305 , H05K2201/053 , H05K2201/056 , H05K2201/09045 , H05K2201/0909 , H05K2201/09127 , H05K2201/09254 , H05K2201/09263 , H05K2201/09954 , H05K2201/0999 , H05K2201/2036 , H05K2203/0195 , H05K2203/0228 , H01L2924/00
摘要： A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.
摘要翻译：包装体包括主体和由所述主体支撑的导电图案。接口部分被配置为将模块接收到具有包装的可移除附件。所述导电图案至少部分地在所述接口部分内包括构成无线耦合装置的一半的无线耦合图案。

29. 发明授权

US09119335B2 Method for manufacturing rigid-flexible multilayer wiring board and collective board 有权
标题翻译：刚性柔性多层布线板和集体板的制造方法
公开(公告)号：US09119335B2
公开(公告)日：2015-08-25
申请号：US13474755
申请日：2012-05-18
申请人： Shunsuke Chisaka
发明人： Shunsuke Chisaka
IPC分类号： H05K1/03 , H05K3/46
CPC分类号： H05K3/4691 , H05K2201/0129 , H05K2201/09127 , H05K2203/0228 , Y10T29/49155 , Y10T156/1052
摘要： A method for manufacturing a rigid-flexible multilayer wiring board includes a step of forming a release layer such that the release layer covers a flexible portion forming region of a principal surface of a first thermoplastic resin sheet, a step of conducting surface modification on the principal surface of the first thermoplastic resin sheet while using the release layer as a mask, a step of laminating a second thermoplastic resin sheet such that the second thermoplastic resin sheet covers the release layer to form a laminate including the first and second thermoplastic resin sheets, a step of press-bonding the laminate, a step of forming a cut from at least either one of upper and lower surfaces of the laminate toward an outline of the release layer when seen in a plan view, and a step of removing a portion surrounded by the cut.
摘要翻译：制造刚性 - 柔性多层布线板的方法包括形成剥离层的步骤，使得剥离层覆盖第一热塑性树脂片的主表面的柔性部分形成区域，在主体上进行表面改性的步骤使用剥离层作为掩模的第一热塑性树脂片的表面，层叠第二热塑性树脂片以使第二热塑性树脂片覆盖剥离层以形成包含第一和第二热塑性树脂片的层压体的步骤，压接层压体的步骤，当从俯视图中观察时，从层叠体的上表面和下表面中的至少一个形成切割至剥离层的轮廓的步骤，以及除去由那个切口。

30. 发明申请

US20150173211A1 Method of Producing Laminated Body, and Laminated Body 审中-公开
标题翻译：生产层压体和层压体的方法
公开(公告)号：US20150173211A1
公开(公告)日：2015-06-18
申请号：US14629932
申请日：2015-02-24
申请人： JX Nippon Mining & Metals Corporation
发明人： Masayuki Takamori
IPC分类号： H05K3/46 , H05K3/00 , B32B38/00 , B32B37/12 , B32B37/20
CPC分类号： H05K3/4611 , B32B15/00 , B32B37/0007 , B32B37/003 , B32B37/0076 , B32B37/12 , B32B37/1284 , B32B37/1292 , B32B37/20 , B32B38/0004 , B32B38/0012 , B32B2307/54 , B32B2309/105 , B32B2311/12 , B32B2457/08 , B65H2301/4223 , B65H2601/211 , H05K3/00 , H05K3/025 , H05K2203/0143 , H05K2203/0228 , H05K2203/068 , H05K2203/1178 , Y10T156/1052 , Y10T428/24826 , Y10T428/24917
摘要： A method of producing a laminated body is provided in which, while a carrier A is wound off from a bobbin, an adhesive is applied to both facing ends thereof and a metal foil B is laid on and bonded to a side to which the adhesive was applied. The obtained laminated body is subsequently cut, a plurality of the cut laminated bodies are aligned in a stack, a roller is applied from the top of the stack when the elevation of the center of the stack becomes high to vent air existing between and within the laminated bodies. After the air vent process, the adhesive hardens to mutually bond the carrier to the metal foil of each laminated body. Accordingly, a carrier-attached copper foil that provides improvements in handling ability in the production process of a printed board and cost reduction based on improved production yield.
摘要翻译：提供了一种层叠体的制造方法，其中，当载体A从筒管上卷绕时，将粘合剂施加到其两个端部，并且将金属箔B放置并粘合到粘合剂的一侧应用。随后切割所获得的层叠体，多个切割的层叠体以堆叠方式排列，当堆叠的中心的高度变高时，从堆叠的顶部施加辊，以排出存在于堆叠内部和/ 层压体。在排气处理之后，粘合剂硬化以将载体相互粘合到每个层叠体的金属箔。因此，能够提高印刷电路板的制造工序的处理能力，提高生产成本，降低成本的载体附着铜箔。

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