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1. 发明公开

US20230143088A1 PLANAR ANTENNA BOARD 审中-公开
公开(公告)号：US20230143088A1
公开(公告)日：2023-05-11
申请号：US17904951
申请日：2020-03-24
申请人： MEIKO ELECTRONICS CO., LTD.
发明人： Mitsuaki TODA , Kanemitsu NAGAI , Mitsuo IWAMOTO
IPC分类号： H01Q9/04 , H01Q1/48
CPC分类号： H01Q9/0407 , H01Q1/48
摘要： A planar antenna board (1) comprises a dielectric (2), an antenna layer (3) formed as a conductor for a signal line on one surface of the dielectric (2), and a ground layer (4) formed as a ground conductor on the other surface of the dielectric (2). The dielectric (2) has: a low-dielectric layer (2a) arranged on the antenna-layer (3) side; an intermediate layer (2b) for which the dielectric constant is higher than that of the low-dielectric layer (2a); and an adhesive layer (2c) for which the glass transition point is higher than that of the intermediate layer (2b), and the water absorption rate is higher than that of the low-dielectric layer (2a). The low-dielectric layer (2a) is arranged on the antenna-layer (3) side with respect to the intermediate layer (2b), and the adhesive layer (2c) is arranged on the ground-layer (4) side with respect to the intermediate layer (2b).

2. 发明授权

US10271432B2 Encapsulated circuit module, and production method therefor 有权
公开(公告)号：US10271432B2
公开(公告)日：2019-04-23
申请号：US15534401
申请日：2015-07-10
申请人： MEIKO ELECTRONICS CO., LTD.
发明人： Satoru Miwa
IPC分类号： H05K1/02 , H05K1/18 , H01L21/56 , H01L23/00 , H05K3/22 , H01L23/31 , H01L23/552 , H05K9/00
摘要： To reduce, when a single encapsulated circuit module has electronic components that are mutually influenced by their electromagnetic waves, the mutual influence, an embodiment provides an encapsulated circuit module M having a substrate 100 on which a number of electronic components 200 are mounted. An electronic component 200A is a high frequency oscillator. A metal side wall 320 of a partition member is provided on the substrate 100. One surface of the substrate 100 is entirely covered with a first resin 400 together with the electronic components 200 and the side wall 320. The first resin 400 is covered with a metal shield layer 600 for shielding electromagnetic waves. The electronic component 200A is surrounded by the side wall 320 and the shield layer 600.

3. 发明申请

US20180160528A1 THREE-DIMENSIONAL WIRING BOARD PRODUCTION METHOD, THREE-DIMENSIONAL WIRING BOARD, AND SUBSTRATE FOR THREE-DIMENSIONAL WIRING BOARD 审中-公开
公开(公告)号：US20180160528A1
公开(公告)日：2018-06-07
申请号：US15578484
申请日：2015-10-30
申请人： MEIKO ELECTRONICS CO., LTD.
发明人： Shigeru MICHIWAKI
IPC分类号： H05K1/02 , H05K1/03 , H05K1/09 , H05K3/14 , H05K3/00
CPC分类号： H05K1/0284 , H05K1/0326 , H05K1/09 , H05K3/0014 , H05K3/0023 , H05K3/14 , H05K3/181 , H05K3/389 , H05K3/426 , H05K2201/0129 , H05K2201/0338 , H05K2201/0341 , H05K2201/0347 , H05K2201/09118 , H05K2203/072 , H05K2203/124 , H05K2203/1461
摘要： A three-dimensional wiring board production method is provided that includes: a preparation step of preparing a resin film having a breaking elongation of 50% or more; a first metal film formation step of forming a first metal film on a surface of the resin film; a pattern formation step of performing patterning on the first metal film to form a desired pattern; a three-dimensional molding step of performing three-dimensional molding by heating and pressurizing the resin film; and a second metal film formation step of forming a second metal film on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited in a particle state to form the first metal film in a porous state.

4. 发明申请

US20170347462A1 Encapsulated Circuit Module, And Production Method Therefor 审中-公开
公开(公告)号：US20170347462A1
公开(公告)日：2017-11-30
申请号：US15534427
申请日：2015-11-20
申请人： MEIKO ELECTRONICS CO., LTD.
发明人： Satoru Miwa
IPC分类号： H05K3/28 , H05K1/18 , H05K9/00 , H05K3/00 , H05K3/12 , H05K3/18
CPC分类号： H05K3/284 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L23/66 , H01L24/97 , H01L2223/6677 , H01L2924/1815 , H01L2924/3025 , H05K1/181 , H05K3/0044 , H05K3/0052 , H05K3/12 , H05K3/181 , H05K9/0022 , H05K9/0024 , H05K9/0088 , H05K2201/10371 , H05K2201/10522 , H05K2203/1316 , H05K2203/1322 , H05K2203/1327
摘要： To improve, in an encapsulated circuit module having a metal shield layer covering a surface of a resin layer containing filler, a shielding property of the shield layer against electromagnetic waves.The encapsulated circuit module has a substrate 100 on which electronic components are mounted, covered with a first resin 400. A surface of the first resin 400 is covered with a shield layer 600 including a first metal covering layer 610 made of copper or iron and a second metal covering layer 620 made of nickel. Each of the first metal covering layer 610 and the second metal covering layer 620 is thicker than 5 μm.

5. 发明申请

US20160016318A1 SUCTION DEVICE 审中-公开
标题翻译：吸引装置
公开(公告)号：US20160016318A1
公开(公告)日：2016-01-21
申请号：US14760976
申请日：2013-01-15
申请人： MEIKO ELECTRONICS CO., LTD.
发明人： Shigeru Kawata , Noboru Shingai
IPC分类号： B25J15/06
CPC分类号： B25J15/0633 , B25J15/0616
摘要： The suction device (1) includes: an suction part (2) formed with a plurality of suction holes (8) and adapted to abut against an suction object (9); side walls (3) and a top wall (4) for forming a negative pressure chamber (10) in cooperation with the suction part (2); a pin-shaped valve body (13) extending from the negative pressure chamber (10) into a suction hole (8); and a closing part (16) adapted to close the suction hole (8) in such a way that the valve body (13) slides in the suction hole (8) causing a portion of the valve body (13) and a portion of the inner wall of the suction hole (8) to come into close contact, wherein the valve body (13) has a root part (13a), which is one end thereof located in the negative pressure chamber (10), the root part (13a) is fixed to a plate-shaped flexible body (17) having flexibility and being bridged between and fixed to the side walls (3) in the negative pressure chamber (10), and the flexible body (17) has a plurality of through-holes (19).
摘要翻译：抽吸装置（1）包括：形成有多个吸入孔（8）并适于抵靠抽吸物体（9）的吸入部分（2）; 侧壁（3）和用于与抽吸部分（2）协作形成负压室（10）的顶壁（4）; 从负压室（10）延伸到吸入孔（8）的销状阀体（13）; 以及闭合部分（16），其适于关闭所述吸入孔（8），使得所述阀体（13）在所述吸入孔（8）中滑动，从而导致所述阀体（13）的一部分和所述阀体所述吸入孔（8）的内壁紧密接触，其中所述阀体（13）具有根部（13a），所述根部位于所述负压室（10）的一端，所述根部（13a））固定在具有柔性的板状柔性体（17）上并桥接在负压室（10）中的侧壁（3）上并且固定到负压室（10）中的侧壁（3）之间，并且柔性体（17）具有多个通孔孔（19）。

6. 发明申请

US20150382478A1 DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF DEVICE EMBEDDED SUBSTRATE 审中-公开
标题翻译：器件嵌入式基板和器件嵌入式基板的制造方法
公开(公告)号：US20150382478A1
公开(公告)日：2015-12-31
申请号：US14767536
申请日：2013-02-12
申请人： MEIKO ELECTRONICS CO., LTD.
发明人： Hiroshi SHIMADA , Mitsuaki TODA , Tohru MATSUMOTO
IPC分类号： H05K3/20 , C23F1/00 , H05K3/22 , H05K3/46 , H05K1/18 , H05K1/02
CPC分类号： H05K3/20 , C23F1/00 , H05K1/0298 , H05K1/185 , H05K1/188 , H05K3/22 , H05K3/4611 , H05K2201/0195 , H05K2201/0355 , H05K2201/09009 , H05K2201/10636 , H05K2203/11 , Y02P70/611
摘要： A device embedded substrate includes an insulating layer including an insulating resin material, a device embedded in the insulating layer, a metal film coating at least one face of the device, and a roughened portion formed by roughening at least part of the surface of the metal film. Preferably, the device embedded substrate further includes: a conductive layer pattern-formed on a bottom face, the bottom face being one face of the insulating layer; and a bonding agent made of a material different from the insulating layer and joining the conductive layer (6) and a mounting face, the mounting face being one face of the device. The metal film is formed only on a face opposite to the mounting face, and the bonding agent has a thickness smaller than a thickness from the metal film to a top face, the top face being the other face of the insulating layer.
摘要翻译：一种器件嵌入式衬底包括绝缘层，该绝缘层包括绝缘树脂材料，嵌入绝缘层中的器件，涂覆该器件的至少一个面的金属膜以及通过使金属的至少一部分表面粗糙化而形成的粗糙部分电影。优选地，装置嵌入式基板还包括：导电层图案形成在底面上，底面是绝缘层的一个面; 以及由与所述绝缘层不同的材料制成的接合剂，并且将所述导电层（6）和安装面接合，所述安装面是所述装置的一个面。金属膜仅形成在与安装面相反的面上，粘合剂的厚度小于从金属膜到顶面的厚度，顶面是绝缘层的另一面。

7. 发明申请

US20150257284A1 METHOD OF BENDING BACK RIGID PRINTED WIRING BOARD WITH FLEXIBLE PORTION 审中-公开
标题翻译：用柔性部分弯曲背面刚性印刷接线板的方法
公开(公告)号：US20150257284A1
公开(公告)日：2015-09-10
申请号：US14378810
申请日：2014-03-07
申请人： MEIKO ELECTRONICS CO., LTD.
发明人： Mitsuaki Toda , Kazuo Shishime , Hisanori Yoshimizu
IPC分类号： H05K3/46 , H05K3/22 , H05K3/00
CPC分类号： H05K3/4691 , H05K1/028 , H05K1/148 , H05K3/225 , H05K3/227 , H05K2203/1105 , Y10T156/1082
摘要： A method for bending back a rigid printed wiring board with a flexible portion includes: forming a preparation substrate on a surface of a prepreg made of thermosetting resin, the preparation substrate including a conducting layer made of a conductive material; laminating the plurality of preparation substrates; thermally hardening the thermosetting resin so as to integrate the plurality of laminated preparation substrates as an intermediate substrate while heating and pressing together the plurality of preparation substrates; cutting an insulating layer formed by thermally hardening the thermosetting resin in a lamination direction of the preparation substrate so as to form a flexible portion, the flexible portion being thinly formed across opposed both edges of the intermediate substrate to form a complete substrate; bending the flexible portion; bending-back the flexible portion; and dehydrating by raising a temperature of the bent flexible portion before bending-back the flexible portion.
摘要翻译：一种用柔性部分弯曲刚性印刷线路板的方法包括：在由热固性树脂制成的预浸料的表面上形成准备基材，所述制备基材包括由导电材料制成的导电层; 层叠多个制备基板; 热固化热固性树脂，以便将多个层压制备基材作为中间基材一体化，同时加热并将多个制备基材压在一起; 切割通过在所述制备基板的层叠方向上热固化所述热固性树脂而形成的绝缘层，以便形成柔性部分，所述柔性部分在所述中间基板的相对的两个边缘上被薄地形成以形成完整的基板; 弯曲柔性部分; 弯曲柔性部分; 并且通过在弯曲柔性部分之前提高弯曲的柔性部分的温度来脱水。

8. 发明授权

US09363885B1 Method of fabricating heat dissipating board 有权
标题翻译：制造散热板的方法
公开(公告)号：US09363885B1
公开(公告)日：2016-06-07
申请号：US14371027
申请日：2013-06-12
申请人： MEIKO ELECTRONICS CO., LTD.
发明人： Noriaki Taneko , Tsuyoshi Takagi , Shukichi Takii
IPC分类号： H05K3/46 , H05K1/02 , H05K3/00
CPC分类号： H05K1/0204 , H01L2224/32225 , H05K3/0011 , H05K3/46 , H05K3/4614 , H05K2201/066 , H05K2201/10416 , H05K2203/0278 , H05K2203/0723 , H05K2203/1194
摘要： A method of fabricating a heat dissipating board according to the present invention, includes: a substrate intermediate forming step of forming a substrate intermediate with an insulating layer made of an insulating resin material and a conducting layer made of a conductive material formed on the insulating layer; a through hole forming step of forming a through hole having an approximately cylindrical shape, the through hole penetrating through the substrate intermediate; an inserting step of inserting a heat conducting member to be disposed in the through hole, the heat conducting member being made of a metal and having an approximately cylindrical shape; and a plastically deforming step of plastically deforming the heat conducting member to be secured in the through hole. Prior to the inserting step, an annealing step of annealing the heat conducting member is performed.
摘要翻译：根据本发明的制造散热板的方法包括：基板中间形成步骤，用绝缘层形成由绝缘树脂材料制成的绝缘层和由绝缘层形成的导电材料制成的导电层， ; 通孔形成步骤，形成具有近似圆筒形状的通孔，所述通孔贯穿所述基板中间体; 插入步骤，插入要设置在所述通孔中的导热构件，所述导热构件由金属制成并具有大致圆柱形形状; 以及使导热构件塑性变形以固定在通孔中的塑性变形步骤。在插入步骤之前，执行退火导热构件的退火步骤。

9. 发明申请

US20150327369A1 Device Embedded Substrate and Manufacturing Method of Device Embedded Substrate 有权
标题翻译：器件嵌入式基板和器件嵌入式基板的制造方法
公开(公告)号：US20150327369A1
公开(公告)日：2015-11-12
申请号：US14760982
申请日：2013-01-18
申请人： MEIKO ELECTRONICS CO., LTD.
发明人： Yasuaki Seki , Tomoyuki Nagata , Mitsuaki Toda
IPC分类号： H05K1/18 , H05K3/00 , H05K3/46 , H05K1/11 , H05K1/02
CPC分类号： H05K1/186 , H01L23/5226 , H01L24/19 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/19 , H01L2224/2518 , H01L2224/32245 , H01L2224/82005 , H01L2224/82039 , H01L2224/83005 , H01L2224/92144 , H05K1/0206 , H05K1/0222 , H05K1/0298 , H05K1/113 , H05K1/114 , H05K1/115 , H05K1/185 , H05K1/188 , H05K3/0017 , H05K3/0035 , H05K3/305 , H05K3/4602 , H05K3/4652 , H05K2201/09827 , H05K2201/10 , H05K2203/063 , H05K2203/1461 , Y10T156/10
摘要： A device embedded substrate (20), includes: an insulation layer (12) including an insulation resin material; an electric or electronic device (4) embedded in the insulation layer (12); a terminal (15) serving as an electrode included in the device (4); a conductor pattern (18) formed on the surface of the insulation layer (12); and a conducting via (21) for electrically connecting the conductor pattern (18) and the terminals (15) with each other. The conducting via (21) is made up of a large-diameter section (21a) having a large diameter and a small-diameter section (21b) having a smaller diameter than that of the large-diameter section (21a), in order starting from the conductor pattern (18) toward the terminal (15). A stepped section (17) is formed between the large-diameter section (21a) and the small-diameter section (21b). The large-diameter section (21a) is formed so as to penetrate a sheet-shaped glass cloth (11) disposed in the insulation layer (12).
摘要翻译：一种器件嵌入式衬底（20），包括：绝缘层（12），包括绝缘树脂材料; 嵌入所述绝缘层（12）中的电气或电子设备（4）; 用作包括在所述装置（4）中的电极的端子（15）; 形成在所述绝缘层（12）的表面上的导体图案（18）; 以及用于将导体图案（18）和端子（15）彼此电连接的导电通孔（21）。导电通孔（21）由大直径的大直径部分（21a）和直径小于大直径部分（21a）直径的小直径部分（21b）构成，以便顺序起动从导体图案（18）朝向端子（15）。在大直径部分（21a）和小直径部分（21b）之间形成有阶梯部分（17）。大直径部分21a形成为穿透设置在绝缘层12中的片状玻璃布11。

10. 发明公开

US20240138053A1 DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME 审中-公开
公开(公告)号：US20240138053A1
公开(公告)日：2024-04-25
申请号：US18279735
申请日：2021-03-05
申请人： Meiko Electronics Co., Ltd.
发明人： Tohru MATSUMOTO , Masakatsu ISHIHARA , Kazuhiro BENIYA , Kentaro AOKI
IPC分类号： H05K1/02 , H05K1/11 , H05K3/46
CPC分类号： H05K1/0209 , H05K1/115 , H05K3/4655 , H05K2201/096 , H05K2201/10416
摘要： A device embedded substrate provided with first and second connecting terminals on different surfaces, the substrate including: an electrically conductive metal block having one surface connected to the first connecting terminal, and having a dimension in a lateral direction larger than that of the electronic device; an intermediate connecting portion juxtaposed to the electronic device, including first insulation layer and wiring layers, whereby the first wiring layer is connected to the one surface of the metal block via a first conductive via; a second insulation layer which accommodates the metal block; and a third insulation layer stacked on the second insulation layer to embed the electronic device and whereon a second wiring layer is stacked, wherein the second wiring layer is connected to the first wiring layer via a second conductive via and connected to the second connecting terminal of the electronic device via a third conductive via.

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