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    • 25. 发明授权
    • Thin-film device
    • 薄膜装置
    • US08218287B2
    • 2012-07-10
    • US12727549
    • 2010-03-19
    • Akira ShibueYoshihiko YanoHitoshi SaitaKenji Horino
    • Akira ShibueYoshihiko YanoHitoshi SaitaKenji Horino
    • H01G4/06
    • H01G4/33H01G4/232H01G4/30H01L28/40
    • A thin-film device comprises a base electrode made of a metal, a first dielectric layer, a first inner electrode, a second dielectric layer, a second inner electrode, and a third dielectric layer. Letting T1 be the thickness of the lowermost first dielectric layer in contact with the base electrode in the plurality of dielectric layers, and Tmin be the thickness of the thinnest dielectric layer in the plurality of dielectric layers excluding the first dielectric layer, T1>Tmin. Making the first dielectric layer thicker than the thinnest, dielectric layer in the other dielectric layers can increase the distance between a metal part projecting from a metal surface because of the surface roughness of the base electrode and the inner electrode mounted on the lowermost dielectric layer, thereby reducing leakage currents.
    • 薄膜器件包括由金属制成的基极,第一介电层,第一内部电极,第二电介质层,第二内部电极和第三电介质层。 设T1为与多个电介质层中的基极接触的最低的第一电介质层的厚度,Tmin为除了第一电介质层之外的多个电介质层中最薄的电介质层的厚度,T1> Tmin。 由于基极的表面粗糙度和安装在最下层电介质层上的内电极的表面粗糙度,使得第一电介质层比其他电介质层中最薄的电介质层的电介质层增加了从金属表面突出的金属部分之间的距离, 从而减少漏电流。
    • 26. 发明申请
    • THIN-FILM CAPACITOR
    • 薄膜电容器
    • US20110075319A1
    • 2011-03-31
    • US12876611
    • 2010-09-07
    • Yasunobu OIKAWAYoshihiko Yano
    • Yasunobu OIKAWAYoshihiko Yano
    • H01G4/008H01G4/005
    • H01G4/005H01G4/008H01G4/33
    • To provide a thin-film capacitor capable of preventing the degradation of electrical characteristics caused by direct contact between an adhesion layer of a terminal electrode and a dielectric layer, to increase the reliability. The thin-film capacitor comprises: a dielectric layer deposited on a base electrode; an upper electrode layer deposited on the dielectric layer; a terminal electrode including an adhesion layer, a seed layer, and a plating layer; a resin layer for wiring provided between the upper electrode layer and the terminal electrode for isolating the upper electrode layer from the terminal electrode; and a wiring layer provided so as to extend through the resin layer for wiring in contact with the adhesion layer for electrically connecting the upper electrode layer and the terminal electrode, wherein a composition of the wiring layer differs from that of the adhesion layer of the terminal electrode, and wherein a reducing power of the wiring layer to the dielectric layer is smaller than that of the adhesion layer.
    • 提供能够防止由端子电极和电介质层的粘附层之间的直接接触引起的电特性劣化的薄膜电容器,以提高可靠性。 薄膜电容器包括:沉积在基极上的电介质层; 沉积在电介质层上的上电极层; 包括粘合层,种子层和镀层的端子电极; 用于在上电极层和端子电极之间设置用于将上电极层与端子电极隔离的布线用树脂层; 以及布线层,其设置成延伸穿过用于电连接上电极层和端子电极的粘合层接触的布线用树脂层,其中布线层的组成与端子的粘合层的组成不同 电极,并且其中所述布线层到所述电介质层的还原能力小于所述粘合层的还原能力。
    • 28. 发明授权
    • Multilayer thin film
    • 多层薄膜
    • US06258459B1
    • 2001-07-10
    • US09300452
    • 1999-04-28
    • Takao NoguchiYoshihiko Yano
    • Takao NoguchiYoshihiko Yano
    • B32B904
    • B32B15/04C30B23/02C30B29/32
    • The first object of the invention is to provide means that enables a perovskite oxide thin film having (100) orientation, (001) orientation or (111) orientation to be easily obtained, and the second object of the invention is to provide a multilayer thin film comprising a unidirectionally oriented metal thin film of good crystallinity. The multilayer thin film according to the first embodiment of the invention comprises a buffer layer and a perovskite oxide thin film present thereon. The interface between the buffer layer and the perovskite oxide thin film is made up of a {111} facet plane. Substantially parallel to the facet plane there is present a {110} face of a cubic, rhombohedral, tetragonal or orthorhombic crystal of the perovskite oxide thin film, a {101} face of the tetragonal or orthorhombic crystal or a {011} face of the orthorhombic crystal. The multilayer thin film according to the second embodiment of the invention comprises a metal thin film that is a cubic (100) unidirectionally oriented epitaxial film, and a buffer layer where a {111} facet plane is present on the interface of the buffer layer in contact with the metal thin film.
    • 本发明的第一个目的是提供能够容易地获得具有(100)取向(001)取向或(111)取向的钙钛矿氧化物薄膜的方法,本发明的第二个目的是提供一种多层薄膜 膜包含具有良好结晶度的单向取向金属薄膜。 根据本发明第一实施方案的多层薄膜包含缓冲层和存在于其上的钙钛矿氧化物薄膜。 缓冲层与钙钛矿氧化物薄膜的界面由{111}面平面构成。 基本平行于面平面,存在钙钛矿氧化物薄膜的立方晶体,菱方晶,四方晶或正交晶体的{110}面,正方晶或正交晶体的{101}面或 正交晶体。 根据本发明的第二实施方式的多层薄膜包括作为立方体(100)单向取向外延膜的金属薄膜和在缓冲层的界面上存在{111}面平面的缓冲层 与金属薄膜接触。
    • 30. 发明授权
    • Thin-film capacitor
    • 薄膜电容器
    • US08411411B2
    • 2013-04-02
    • US12876611
    • 2010-09-07
    • Yasunobu OikawaYoshihiko Yano
    • Yasunobu OikawaYoshihiko Yano
    • H01G4/228H01G4/008
    • H01G4/005H01G4/008H01G4/33
    • To provide a thin-film capacitor capable of preventing the degradation of electrical characteristics caused by direct contact between an adhesion layer of a terminal electrode and a dielectric layer, to increase the reliability. The thin-film capacitor comprises: a dielectric layer deposited on a base electrode; an upper electrode layer deposited on the dielectric layer; a terminal electrode including an adhesion layer, a seed layer, and a plating layer; a resin layer for wiring provided between the upper electrode layer and the terminal electrode for isolating the upper electrode layer from the terminal electrode; and a wiring layer provided so as to extend through the resin layer for wiring in contact with the adhesion layer for electrically connecting the upper electrode layer and the terminal electrode, wherein a composition of the wiring layer differs from that of the adhesion layer of the terminal electrode, and wherein a reducing power of the wiring layer to the dielectric layer is smaller than that of the adhesion layer.
    • 提供能够防止由端子电极和电介质层的粘附层之间的直接接触引起的电特性劣化的薄膜电容器,以提高可靠性。 薄膜电容器包括:沉积在基极上的电介质层; 沉积在电介质层上的上电极层; 包括粘合层,种子层和镀层的端子电极; 用于在上电极层和端子电极之间设置用于将上电极层与端子电极隔离的布线用树脂层; 以及布线层,其设置成延伸穿过用于电连接上电极层和端子电极的粘合层接触的布线用树脂层,其中布线层的组成与端子的粘合层的组成不同 电极,并且其中所述布线层到所述电介质层的还原能力小于所述粘合层的还原能力。