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21. 发明授权

US07156538B2 LED package for backlight unit 有权
标题翻译：背光单元的LED封装
公开(公告)号：US07156538B2
公开(公告)日：2007-01-02
申请号：US10953787
申请日：2004-09-30
申请人： Kyung Taeg Han , Chan Wang Park , Seon Goo Lee
发明人： Kyung Taeg Han , Chan Wang Park , Seon Goo Lee
IPC分类号： F21V21/00
CPC分类号： H01L25/0753 , H01L33/486 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014
摘要： Disclosed herein is an LED package for a backlight unit. The LED package includes a plurality of LEDs, a die bonding part, a wire bonding part and a body. The die bonding part, on which the plurality of LEDs is arranged, allows the first electrodes of the LEDs to be electrically connected to an external circuit. The wire bonding part is spaced apart from the die bonding part by a predetermined distance to be insulated from the die bonding part and allows the second electrodes of the LEDs to be electrically connected to the external circuit so that the LEDs are operated. The body has a molding cup which is used to fill a space above the LEDs with transparent resin and a base on which the die bonding part and the wire bonding part are arranged.
摘要翻译：这里公开了一种用于背光单元的LED封装。 LED封装包括多个LED，芯片接合部，引线接合部和主体。多个LED布置在其上的裸片接合部分允许LED的第一电极电连接到外部电路。引线接合部与芯片接合部隔开预定距离，以与芯片接合部绝缘，并且允许LED的第二电极电连接到外部电路，使得LED被操作。本体具有用于以透明树脂填充LED上方的空间的模制杯和芯片接合部分和引线接合部分布置在其上的基座。

22. 发明授权

US06982485B1 Stacking structure for semiconductor chips and a semiconductor package using it 失效
标题翻译：用于半导体芯片的堆叠结构和使用它的半导体封装
公开(公告)号：US06982485B1
公开(公告)日：2006-01-03
申请号：US10076701
申请日：2002-02-13
申请人： Seon Goo Lee , Young Ho Kim , Choon Heung Lee
发明人： Seon Goo Lee , Young Ho Kim , Choon Heung Lee
IPC分类号： H01L23/48 , H01L23/52 , H01L23/28 , H01L29/40
CPC分类号： H01L24/85 , H01L23/36 , H01L23/49805 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L25/0657 , H01L2224/32145 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/4945 , H01L2224/73265 , H01L2224/78301 , H01L2224/85001 , H01L2224/85051 , H01L2224/85191 , H01L2224/85815 , H01L2224/85986 , H01L2225/0651 , H01L2225/06541 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/181 , H01L2224/85186 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： A semiconductor package and method of producing the same has a substrate having a resin layer with first and second surfaces. A plurality of electrically conductive patterns are formed on the resin layer. An aperture is also formed at the center of the substrate. A first semiconductor chip has first and second surfaces. The second surface of the first semiconductor chip has a plurality of input/output pads formed thereon. The first semiconductor chip is placed in the aperture of the substrate. A plurality of first conductive wires connect the input/output pads of the first semiconductor chip to the electrically conductive patterns formed on the second surface of the resin layer. A second semiconductor chip having first and second surfaces is coupled to the first semiconductor chip. The second surface of the second semiconductor chip has a plurality of input/output pads formed thereon. A plurality of second conductive wires connect the input/output pads of the second semiconductor chip to the electrically conductive patterns formed on the second surface of the resin layer. An encapsulate is used to encapsulate the aperture of the substrate, the first and second semiconductor chips, and the first and second conductive wires. A plurality of conductive balls are coupled to the electrically conductive patterns formed on the second surface of the resin layer of the substrate.
摘要翻译：半导体封装及其制造方法具有具有第一和第二表面的树脂层的基板。在树脂层上形成多个导电图案。在基板的中心处还形成有孔。第一半导体芯片具有第一和第二表面。第一半导体芯片的第二表面具有形成在其上的多个输入/输出焊盘。第一半导体芯片被放置在基板的孔中。多个第一导线将第一半导体芯片的输入/输出焊盘连接到形成在树脂层的第二表面上的导电图案。具有第一和第二表面的第二半导体芯片被耦合到第一半导体芯片。第二半导体芯片的第二表面具有形成在其上的多个输入/输出焊盘。多个第二导线将第二半导体芯片的输入/输出焊盘连接到形成在树脂层的第二表面上的导电图案。封装用于封装基板，第一和第二半导体芯片以及第一和第二导线的孔径。多个导电球耦合到形成在基板的树脂层的第二表面上的导电图案。

23. 发明申请

US20050199884A1 High power LED package 审中-公开
标题翻译：大功率LED封装
公开(公告)号：US20050199884A1
公开(公告)日：2005-09-15
申请号：US10890178
申请日：2004-07-14
申请人： Seon Goo Lee , Seung Mo Park , Chan Wang Park , Jung Kyu Park
发明人： Seon Goo Lee , Seung Mo Park , Chan Wang Park , Jung Kyu Park
IPC分类号： H01L27/15 , H01L33/48 , H01L33/54 , H01L33/60 , H01L33/62
CPC分类号： H01L33/54 , H01L24/17 , H01L24/73 , H01L24/97 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/16245 , H01L2224/48247 , H01L2924/12041 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A high power LED package, in which substantially planar first and second lead frames made of high reflectivity metal are spaced from each other for a predetermined gap. An LED chip is seated on at least one of the lead frames, and having terminals electrically connected to the lead frames, respectively. A package body made of resin seals the LED chip therein while fixedly securing the lead frame in the bottom thereof. The encapsulant preferably fills up the gap between the first and second lead frames. The LED package is structured to raise thermal radiation efficiency thereby reducing the size and thickness thereof.
摘要翻译：大功率LED封装，其中由高反射率金属制成的大致平面的第一和第二引线框架彼此间隔开预定的间隙。 LED芯片位于至少一个引线框架上，并且具有分别电连接到引线框架的端子。由树脂制成的包装体将LED芯片密封在其中，同时将引线框固定在其底部。密封剂优选地填充第一和第二引线框架之间的间隙。 LED封装构造为提高热辐射效率，从而减小其尺寸和厚度。

24. 发明授权

US06936922B1 Semiconductor package structure reducing warpage and manufacturing method thereof 有权
标题翻译：半导体封装结构减少翘曲及其制造方法
公开(公告)号：US06936922B1
公开(公告)日：2005-08-30
申请号：US10672886
申请日：2003-09-26
申请人： Sung Soon Park , Sang Jae Jang , Choon Heung Lee , Seon Goo Lee , Eun Sook Sohn , Sung Su Park
发明人： Sung Soon Park , Sang Jae Jang , Choon Heung Lee , Seon Goo Lee , Eun Sook Sohn , Sung Su Park
IPC分类号： H01L23/16 , H01L23/48 , H01L23/498 , H01L25/10 , H05K1/11 , H05K3/34
CPC分类号： H05K3/3436 , H01L23/16 , H01L23/49816 , H01L24/48 , H01L25/105 , H01L2224/48091 , H01L2224/48227 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18165 , H01L2924/3511 , H05K1/111 , H05K2201/094 , H05K2201/09736 , Y02P70/613 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electrical substrate useful for semiconductor packages is disclosed. The electrical substrate includes a core insulative layer. A first surface of the insulative layer has circuit patterns thereon. Some of the circuit patterns are stepped in their heights from the first surface, in that a first subportion of the circuit pattern, including a ball land, extends further from the first surface than a second subportion of the same circuit pattern, and also extends further from the first surface than a ball land of other circuit patterns. Accordingly, solder balls fused to the ball lands of the stepped circuit patterns extend further from the first surface than same-size solder balls fused to the ball lands of the non-stepped circuit patterns, thereby circumventing electrical connectivity problems that may arise from warpage of the electrical substrate.
摘要翻译：公开了一种可用于半导体封装的电气基板。电气基板包括芯绝缘层。绝缘层的第一表面具有电路图案。电路图案中的一些从第一表面上升到它们的高度，因为电路图形的第一子部分（包括球形区域）比第一表面的第一子部分比相同电路图案的第二子部分进一步延伸，并且还进一步延伸从第一个表面比其他电路图案的球场。因此，熔融到阶梯式电路图案的球台的焊球比与非阶梯式电路图案的球面熔合的相同尺寸的焊球相比，从第一表面延伸出来，从而避免了由于翘曲引起的电连接问题电气基板。

25. 发明授权

US5986334A Semiconductor package having light, thin, simple and compact structure 失效
标题翻译：半导体封装具有光，薄，简单紧凑的结构
公开(公告)号：US5986334A
公开(公告)日：1999-11-16
申请号：US942784
申请日：1997-10-02
申请人： Seon Goo Lee
发明人： Seon Goo Lee
IPC分类号： H01L23/28 , H01L23/12 , H01L23/13 , H01L23/24 , H05K3/34 , H01L23/495 , H01L23/48
CPC分类号： H01L23/24 , H01L23/13 , H01L2224/05554 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H05K3/3426
摘要： A semiconductor package having a light, thin, simple and compact structure including outer leads having a minimum length and a resin encapsulate having a minimum volume. The semiconductor package includes a package body, a semiconductor chip mounted on a central portion of the body, inner and outer leads bonded to a peripheral portion of an upper surface of the body by an insulating layer in such a manner that the leads are supported on the body, conductive wires or bumps for electrically connecting the inner leads to the semiconductor chip, a resin encapsulate for encapsulating the semiconductor chip, the conductive wires or bumps and the inner leads. Each outer lead has an end positioned at a level higher than an upper surface of the semiconductor chip so that a boundary portion defined between the associated outer and inner leads serves as a barrier for the resin encapsulate. The end of each outer lead is exposed outside the resin encapsulate and extending to a peripheral edge of the body.
摘要翻译：一种具有轻，薄，简单且紧凑结构的半导体封装，包括具有最小长度的外引线和具有最小体积的树脂封装。半导体封装包括封装体，安装在主体的中心部分的半导体芯片，内引线和外引线通过绝缘层连接到主体的上表面的周边部分，使得引线被支撑在用于将内引线电连接到半导体芯片的本体，导线或凸块，用于封装半导体芯片的树脂封装，导线或凸块和内引线。每个外部引线的端部位于比半导体芯片的上表面高的高度，使得限定在相关联的外引线和内引线之间的边界部分用作树脂封装的阻挡层。每个外引线的端部暴露在树脂封装外部并延伸到主体的周边边缘。

26. 再颁专利

USRE44811E1 High power light emitting diode package 有权
标题翻译：大功率发光二极管封装
公开(公告)号：USRE44811E1
公开(公告)日：2014-03-18
申请号：US13330239
申请日：2011-12-19
申请人： Seon Goo Lee , Chang Wook Kim , Kyung Taeg Han
发明人： Seon Goo Lee , Chang Wook Kim , Kyung Taeg Han
IPC分类号： H01L21/00
CPC分类号： H01L33/62 , H01L33/60 , H01L2924/0002 , H01L2924/12041 , H01L2924/00
摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.
摘要翻译：本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。第一钣金构件与LED芯片电连接，在凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并且具有用于传送的传热部从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧金属构件。透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。

27. 发明授权

US08105854B2 LED package 有权
标题翻译： LED封装
公开(公告)号：US08105854B2
公开(公告)日：2012-01-31
申请号：US12612334
申请日：2009-11-04
申请人： Seon Goo Lee , Hun Joo Hahm , Dae Yeon Kim
发明人： Seon Goo Lee , Hun Joo Hahm , Dae Yeon Kim
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/62 , F21K9/00 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2924/01078 , H01L2924/01079 , H05K1/021 , H05K3/244 , H05K2201/09827 , H05K2201/09981 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014
摘要： A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source.
摘要翻译：通过使用通用PCB作为基板可以降低制造成本的芯片上（COB）封装，增加了来自光源的散热效果，从而以低成本实现高质量的光源及其制造方法。 COB封装包括具有印刷在其表面上的电路的板状衬底，该衬底具有通孔。封装还包括位于通孔中的光源，并且包括底座和由树脂制成的圆顶结构，将光源覆盖并固定到基板。本发明通过使用通用PCB作为基板来实现良好的散热效果，能够以低成本制造高质量的COB封装。这又提高了光源的发光效率，最终实现了高质量的光源。

28. 发明授权

US07846752B2 High power LED housing and fabrication method thereof 有权
标题翻译：大功率LED外壳及其制造方法
公开(公告)号：US07846752B2
公开(公告)日：2010-12-07
申请号：US12259696
申请日：2008-10-28
申请人： Chang Wook Kim , Seon Goo Lee
发明人： Chang Wook Kim , Seon Goo Lee
IPC分类号： H01L21/00
CPC分类号： H01L33/642 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/01019 , H01L2924/12041 , Y10S362/80 , H01L2924/00014
摘要： An LED housing, in which a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a neck between them. Fixing parts have first ends engaged with the neck. An electrical connecting part has a wire connecting area placed adjacent to the chip mounting area and an external power connecting area connected to the wire connecting area. A housing body of molding material integrally holds the heat conducting part, the fixing parts and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The LED housing fixes the neck of the heat conducting part at both sides, thereby stably coupling the heat conducting part to the housing body. The fixing parts can spread heat from the heat conducting part to lateral regions of the LED housing, thereby more efficiently spreading heat.
摘要翻译： LED壳体，其中导热部分具有芯片安装区域，与芯片安装区域相对的热连接区域和它们之间的颈部。固定部件具有与颈部接合的第一端。电连接部分具有与芯片安装区域相邻放置的导线连接区域和连接到电线连接区域的外部电源连接区域。成型材料的壳体整体地保持导热部分，固定部分和电连接部分，同时将电连接部分与导热部分隔离。 LED壳体在两侧固定导热部件的颈部，从而将导热部件稳定地连接到壳体主体。固定部件可以将热量从热传导部分扩散到LED壳体的横向区域，从而更有效地散热。

29. 发明授权

US07833811B2 Side-emitting LED package and method of manufacturing the same 有权
标题翻译：侧面发光LED封装及其制造方法
公开(公告)号：US07833811B2
公开(公告)日：2010-11-16
申请号：US12155961
申请日：2008-06-12
申请人： Kyung Taeg Han , Myoung Soo Choi , Seon Goo Lee , Hun Joo Hahm , Seong Yeon Han , Chang Ho Song , Young Sam Park
发明人： Kyung Taeg Han , Myoung Soo Choi , Seon Goo Lee , Hun Joo Hahm , Seong Yeon Han , Chang Ho Song , Young Sam Park
IPC分类号： H01L27/15 , H01L29/24
CPC分类号： H01L33/54 , H01L24/97 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2924/12035 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00014
摘要： The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.
摘要翻译：本发明涉及一种侧面发光LED封装及其制造方法。侧发光LED封装包括其上形成有电极的基板和设置在基板上并与电极电连接的光源。侧发光LED封装还包括具有上表面的模制部件，其中心凹陷地凹陷，覆盖和保护基板和光源，以及覆盖模制部件的整个上表面的反射层，以将光从侧向反射模制部件形成透光表面。封装不限制成型件的形状，不受LED芯片尺寸的影响，从而实现了紧凑的结构。本发明还可以通过PCB工艺处理衬底，从而实现批量生产。

30. 发明授权

US07795052B2 Chip coated light emitting diode package and manufacturing method thereof 有权
标题翻译：芯片涂层发光二极管封装及其制造方法
公开(公告)号：US07795052B2
公开(公告)日：2010-09-14
申请号：US12684578
申请日：2010-01-08
申请人： Seon Goo Lee , Kyung Taeg Han , Seong Yeon Han
发明人： Seon Goo Lee , Kyung Taeg Han , Seong Yeon Han
IPC分类号： H01L21/00
CPC分类号： H01L33/62 , H01L33/508 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.
摘要翻译：一种芯片涂覆的LED封装及其制造方法。芯片涂覆的LED封装包括由安装在基座上的芯片芯片组成的发光芯片和均匀地覆盖芯片裸片的外表面的树脂层。芯片涂覆的LED封装还包括通过金属线电连接的电极部分，其中至少一个凸块球通过树脂层的上表面暴露。芯片涂覆的LED封装还包括具有安装在其上的电极部分和发光芯片的封装体。本发明通过根据照射角度防止色温差异提高光效，提高成品率，使封装体小型化，适应批量生产。

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