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    • 22. 发明申请
    • Schottky device
    • 肖特基装置
    • US20050275055A1
    • 2005-12-15
    • US10856602
    • 2004-05-28
    • Vijay ParthasarathyVishnu KhemkaRonghua ZhuAmitava Bose
    • Vijay ParthasarathyVishnu KhemkaRonghua ZhuAmitava Bose
    • H01L27/06H01L27/07H03K19/00
    • H01L27/0727H01L27/0629
    • A regular Schottky diode or a device that has a Schottky diode characteristic and an MOS transistor are coupled in series to provide a significant improvement in leakage current and breakdown voltage with only a small degradation in forward current. In the reverse bias case, there is a small reverse bias current but the voltage across the Schottky diode remains small due the MOS transistor. Nearly all of the reverse bias voltage is across the MOS transistor until the MOS transistor breaks down. This transistor breakdown, however, is not initially destructive because the Schottky diode limits the current. As the reverse bias voltage continues to increase the Schottky diodes begins to absorb more of the voltage. This increases the leakage current but the breakdown voltage is a somewhat additive between the transistor and the Schottky diode.
    • 正交肖特基二极管或具有肖特基二极管特性和MOS晶体管的器件串联耦合以提供泄漏电流和击穿电压的显着改进,只有正​​向电流的降低很小。 在反向偏置情况下,存在小的反向偏置电流,但由于MOS晶体管,肖特基二极管两端的电压保持较小。 几乎所有的反向偏置电压都跨越MOS晶体管,直到MOS晶体管故障。 然而,该晶体管击穿不是最初的破坏性,因为肖特基二极管限制了电流。 随着反向偏压持续增加,肖特基二极管开始吸收更多的电压。 这增加了漏电流,但是在晶体管和肖特基二极管之间的击穿电压稍微相加。
    • 24. 发明授权
    • Electronic component and method of manufacturing same
    • 电子元件及其制造方法
    • US06734524B1
    • 2004-05-11
    • US10335030
    • 2002-12-31
    • Vijay ParthasarathyVishnu KhemkaRonghua ZhuAmitava BoseTodd RoggenbauerPaul Hui
    • Vijay ParthasarathyVishnu KhemkaRonghua ZhuAmitava BoseTodd RoggenbauerPaul Hui
    • H01L2900
    • H01L27/088H01L21/76232
    • An electronic component includes a semiconductor substrate (110), an epitaxial semiconductor layer (120, 221, 222) over the semiconductor substrate, and a semiconductor region (130, 230) in the epitaxial semiconductor layer. The epitaxial semiconductor layer has an upper surface (123). A first portion (121) of the epitaxial semiconductor layer is located below the semiconductor region, and a second portion (122) of the epitaxial semiconductor layer is located above the semiconductor region. The semiconductor substrate and the first portion of the epitaxial semiconductor layer have a first conductivity type, and the semiconductor region has a second conductivity type. At least one electrically insulating trench (140, 240) extends from the upper surface of the epitaxial semiconductor layer into at least a portion of the semiconductor region. The semiconductor substrate has a doping concentration higher than a doping concentration of the first portion of the epitaxial semiconductor layer.
    • 电子部件包括半导体衬底(110),半导体衬底上的外延半导体层(120,221,222)以及外延半导体层中的半导体区域(130,230)。 外延半导体层具有上表面(123)。 外延半导体层的第一部分(121)位于半导体区域的下方,并且外延半导体层的第二部分(122)位于半导体区域的上方。 半导体衬底和外延半导体层的第一部分具有第一导电类型,并且半导体区域具有第二导电类型。 至少一个电绝缘沟槽(140,240)从外延半导体层的上表面延伸到半导体区域的至少一部分。 半导体衬底的掺杂浓度高于外延半导体层的第一部分的掺杂浓度。
    • 27. 发明授权
    • High-voltage monolithic schottky device structure
    • 高压单片肖特基器件结构
    • US08653600B2
    • 2014-02-18
    • US13487025
    • 2012-06-01
    • Vijay Parthasarathy
    • Vijay Parthasarathy
    • H01L29/66
    • H01L29/8725H01L29/0619H01L29/0692H01L29/36H01L29/407
    • A semiconductor device includes a pillar formed on a substrate of the same conductivity type. The pillar has a vertical thickness that extends from a top surface down to the substrate. The pillar extends in first and second lateral directions in a loop shape. First and second dielectric regions are disposed on opposite lateral sides of the pillar, respectively. First and second conductive field plates are respectively disposed in the first and second dielectric regions. A metal layer is disposed on the top surface of the pillar, the metal layer forming a Schottky diode with respect to the pillar. When the substrate is raised to a high-voltage potential with respect to both the metal layer and the first and second field plates, the first and second field plates functioning capacitively to deplete the pillar of charge, thereby supporting the high-voltage potential along the vertical thickness of the pillar.
    • 半导体器件包括形成在相同导电类型的衬底上的柱。 该柱具有从顶部表面向下延伸到基底的垂直厚度。 支柱以第一和第二横向方向呈环形延伸。 第一和第二电介质区域分别设置在柱的相对侧面上。 第一和第二导电场板分别设置在第一和第二电介质区域中。 金属层设置在柱的顶表面上,金属层相对于柱形成肖特基二极管。 当基板相对于金属层和第一和第二场板两者升高到高压电位时,第一和第二场板电容地起作用以耗尽柱的电荷,从而支持沿着 柱的垂直厚度。
    • 28. 发明申请
    • High-Voltage Transistor Structure with Reduced Gate Capacitance
    • 具有降低栅极电容的高压晶体管结构
    • US20120273885A1
    • 2012-11-01
    • US13532583
    • 2012-06-25
    • Sujit BanerjeeVijay Parthasarathy
    • Sujit BanerjeeVijay Parthasarathy
    • H01L29/78
    • H01L29/7835H01L29/0634H01L29/0692H01L29/0882H01L29/42368
    • In one embodiment, a high voltage field-effect transistor (HVFET) includes a field oxide layer that covers a first well region, the field oxide layer having a first thickness and extending in a second lateral direction from a drain region to near a second well region. A gate oxide covers a channel region and has a second dimension in a first lateral direction. A gate extends in the second lateral direction from the source region to over a portion of the field oxide layer, the gate being insulated from the channel region by the gate oxide, the gate extending in the first lateral dimension over an inactive area of the HVFET beyond the second dimension of the gate oxide, the gate being insulated from the first and second well regions over the inactive area by the field oxide layer.
    • 在一个实施例中,高电压场效应晶体管(HVFET)包括覆盖第一阱区的场氧化物层,所述场氧化物层具有第一厚度并且在第二横向方向上从漏极区延伸到接近第二阱 地区。 栅极氧化物覆盖沟道区域并且具有在第一横向方向上的第二尺寸。 栅极在第二横向方向上从源极区域延伸到场氧化物层的一部分,栅极通过栅极氧化物与沟道区域绝缘,栅极在第一横向尺寸上延伸超过HVFET的非有效区域 超过栅极氧化物的第二维度,栅极通过场氧化物层与无源区域上的第一和第二阱区绝缘。
    • 29. 发明申请
    • High-voltage transistor device with integrated resistor
    • 具有集成电阻的高压晶体管器件
    • US20120146105A1
    • 2012-06-14
    • US13385264
    • 2012-02-10
    • Sujit BanerjeeVijay Parthasarathy
    • Sujit BanerjeeVijay Parthasarathy
    • H01L27/06
    • H01L29/808H01L27/0629H01L28/20H01L29/0634H01L29/1058H01L29/1066
    • A high-voltage device structure comprises a resistor coupled to a tap transistor that includes a JFET in a configuration wherein a voltage provided at a terminal of the JFET is substantially proportional to an external voltage when the external voltage is less than a pinch-off voltage of the JFET. The voltage provided at the terminal being substantially constant when the external voltage is greater than the pinch-off voltage. One end of the resistor is substantially at the external voltage when the external voltage is greater than the pinch-off voltage. When the external voltage is negative, the resistor limits current injected into the substrate. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure.
    • 高压器件结构包括耦合到抽头晶体管的电阻器,其包括JFET,其中当外部电压小于钳位电压时,在JFET的端子处提供的电压基本上与外部电压成比例 的JFET。 当外部电压大于夹断电压时,端子处提供的电压基本上恒定。 当外部电压大于夹断电压时,电阻器的一端基本上处于外部电压。 当外部电压为负时,电阻限制注入基板的电流。 要强调的是,该摘要被提供以符合要求抽象的规则,允许搜索者或其他读者快速确定技术公开的主题。