会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 23. 发明授权
    • Method of manufacturing semiconductor device having conductive thin films
    • 制造具有导电薄膜的半导体器件的方法
    • US07442593B2
    • 2008-10-28
    • US11480912
    • 2006-07-06
    • Takashi NakajimaHideo MiuraHiroyuki OhtaNoriaki Okamoto
    • Takashi NakajimaHideo MiuraHiroyuki OhtaNoriaki Okamoto
    • H01L21/00H01L21/84
    • H01L21/28097H01L21/28035H01L21/28518H01L21/28525H01L21/32053H01L21/76838H01L21/76877H01L21/823437H01L23/485H01L23/53257H01L23/53271H01L28/40H01L29/4925H01L29/4975H01L2924/0002Y10T117/10Y10T117/1004H01L2924/00
    • In forming an electrode 2 on a silicon oxide film 5 on a semiconductor substrate 4 through a silicon oxide film 5, for example, the gate electrode 2 is structured in a laminated structure of a plurality of polycrystalline silicon layers 6. The portion of the gate electrode 2 is formed by a method of manufacturing a thin film having a process of depositing amorphous layers and a process of crystallizing (recrystallizing) this amorphous material. In this case, depositing of the amorphous layers is carried out dividedly by a plurality of times so that the thickness of an amorphous layer to be deposited at one time is not larger than a thickness to be prescribed by a critical stress value determined according to a fail event, the amorphous material is crystallized after each process of depositing each amorphous layer has been finished, and the process of depositing amorphous layers and the process of crystallizing the amorphous material are repeated, whereby a laminated structure of the polycrystalline layer 6 having a necessary film thickness is obtained. With the above-described arrangement, it is possible to prevent a deterioration of electric characteristics of a semiconductor device and an occurrence of a defect, such as a peeling off between layers, cracks in a layer, etc., and it is possible to obtain a polycrystalline layer of small grain size in a desired film thickness by a lamination of polycrystalline materials.
    • 在半导体衬底4上的氧化硅膜5上通过氧化硅膜5形成电极2时,例如,栅电极2被构成为多个多晶硅层6的叠层结构。 栅电极2的部分通过制造具有沉积非晶层的工艺的薄膜的方法和使该非晶材料结晶(再结晶)的方法形成。 在这种情况下,非晶层的沉积被分开多次进行,使得一次沉积的非晶层的厚度不大于根据根据下式确定的临界应力值规定的厚度 在每个非晶层的沉积过程完成之后,非晶材料结晶,重复沉积非晶层的过程和结晶非晶材料的过程,由此多晶层6的层压结构具有必要的 获得膜厚度。 利用上述结构,可以防止半导体器件的电特性的恶化和层之间的剥离等缺陷的发生,层中的裂纹等,并且可以获得 通过多晶材料的层叠,具有所需膜厚度的小晶粒尺寸的多晶层。
    • 24. 发明授权
    • Method of manufacturing semiconductor device having conductive thin films
    • 制造具有导电薄膜的半导体器件的方法
    • US07091520B2
    • 2006-08-15
    • US10265105
    • 2002-10-07
    • Takashi NakajimaHideo MiuraHiroyuki OhtaNoriaki Okamoto
    • Takashi NakajimaHideo MiuraHiroyuki OhtaNoriaki Okamoto
    • H01L29/10
    • H01L21/28097H01L21/28035H01L21/28518H01L21/28525H01L21/32053H01L21/76838H01L21/76877H01L21/823437H01L23/485H01L23/53257H01L23/53271H01L28/40H01L29/4925H01L29/4975H01L2924/0002Y10T117/10Y10T117/1004H01L2924/00
    • In forming an electrode 2 on a silicon oxide film 5 on a semiconductor substrate 4 through a silicon oxide film 5, for example, the gate electrode 2 is structured in a laminated structure of a plurality of polycrystalline silicon layers 6. The portion of the gate electrode 2 is formed by a method of manufacturing a thin film having a process of depositing amorphous layers and a process of crystallizing (recrystallizing) this amorphous material. In this case, depositing of the amorphous layers is carried out dividedly by a plurality of times so that the thickness of an amorphous layer to be deposited at one time is not larger than a thickness to be prescribed by a critical stress value determined according to a fail event, the amorphous material is crystallized after each process of depositing each amorphous layer has been finished, and the process of depositing amorphous layers and the process of crystallizing the amorphous material are repeated, whereby a laminated structure of the polycrystalline layer 6 having a necessary film thickness is obtained. With the above-described arrangement, it is possible to prevent a deterioration of electric characteristics of a semiconductor device and an occurrence of a defect, such as a peeling off between layers, cracks in a layer, etc., and it is possible to obtain a polycrystalline layer of small grain size in a desired film thickness by a lamination of polycrystalline materials.
    • 在半导体衬底4上的氧化硅膜5上通过氧化硅膜5形成电极2时,例如,栅电极2被构成为多个多晶硅层6的叠层结构。 栅电极2的部分通过制造具有沉积非晶层的工艺的薄膜的方法和使该非晶材料结晶(再结晶)的方法形成。 在这种情况下,非晶层的沉积被分开多次进行,使得一次沉积的非晶层的厚度不大于根据根据下式确定的临界应力值规定的厚度 在每个非晶层的沉积过程完成之后,非晶材料结晶,重复沉积非晶层的过程和结晶非晶材料的过程,由此多晶层6的层压结构具有必要的 获得膜厚度。 利用上述结构,可以防止半导体器件的电特性的恶化和层之间的剥离等缺陷的发生,层中的裂纹等,并且可以获得 通过多晶材料的层叠,具有所需膜厚度的小晶粒尺寸的多晶层。
    • 25. 发明授权
    • Semiconductor apparatus having conductive thin films
    • 具有导电薄膜的半导体装置
    • US06346731B1
    • 2002-02-12
    • US09499898
    • 2000-02-08
    • Takashi NakajimaHideo MiuraHiroyuki OhtaNoriaki Okamoto
    • Takashi NakajimaHideo MiuraHiroyuki OhtaNoriaki Okamoto
    • H02L2976
    • H01L21/28097H01L21/28035H01L21/28518H01L21/28525H01L21/32053H01L21/76838H01L21/76877H01L21/823437H01L23/485H01L23/53257H01L23/53271H01L28/40H01L29/4925H01L29/4975H01L2924/0002Y10T117/10Y10T117/1004H01L2924/00
    • In forming an electrode 2 on a silicon oxide film 5 on a semiconductor substrate 4 through a silicon oxide film 5, for example, the gate electrode 2 is structured in a laminated structure of a plurality of polycrystalline silicon layers 6. The portion of the gate electrode 2 is formed by a method of manufacturing a thin film having a process of depositing amorphous layers and a process of crystallizing (recrystallizing) this amorphous material. In this case, depositing of the amorphous layers is carried out dividedly by a plurality of times so that the thickness of an amorphous layer to be deposited at one time is not larger than a thickness to be prescribed by a critical stress value determined according to a fail event, the amorphous material is crystallized after each process of depositing each amorphous layer has been finished, and the process of depositing amorphous layers and the process of crystallizing the amorphous material are repeated, whereby a laminated structure of the polycrystalline layer 6 having a necessary film thickness is obtained. With the above-described arrangement, it is possible to prevent a deterioration of electric characteristics of a semiconductor device and an occurrence of a defect, such as a peeling off between layers, cracks in a layer, etc., and it is possible to obtain a polycrystalline layer of small grain size in a desired film thickness by a lamination of polycrystalline materials.
    • 例如,通过氧化硅膜5在半导体衬底4上的氧化硅膜5上形成电极2时,栅电极2被构成为多个多晶硅层6的层叠结构。栅极部分 通过制造具有沉积非晶层的工艺的薄膜的方法和使该非晶材料结晶(再结晶)的方法形成电极2。 在这种情况下,非晶层的沉积被分开多次进行,使得一次沉积的非晶层的厚度不大于根据根据下式确定的临界应力值规定的厚度 在每个非晶层的沉积过程完成之后,非晶材料结晶,重复沉积非晶层的过程和结晶非晶材料的过程,由此多晶层6的层压结构具有必要的 获得膜厚度。 利用上述结构,可以防止半导体器件的电特性的恶化和层之间的剥离等缺陷的发生,层中的裂纹等,并且可以获得 通过多晶材料的层叠,具有所需膜厚度的小晶粒尺寸的多晶层。
    • 26. 发明授权
    • Semiconductor apparatus having conductive thin films
    • 具有导电薄膜的半导体装置
    • US6118140A
    • 2000-09-12
    • US749324
    • 1996-11-14
    • Takashi NakajimaHideo MiuraHiroyuki OhtaNoriaki Okamoto
    • Takashi NakajimaHideo MiuraHiroyuki OhtaNoriaki Okamoto
    • H01L21/02H01L23/532H01L29/49H01L29/04H01L31/036
    • H01L21/28097H01L21/28035H01L21/28518H01L21/28525H01L21/32053H01L21/76838H01L21/76877H01L21/823437H01L23/485H01L23/53257H01L23/53271H01L28/40H01L29/4925H01L29/4975H01L2924/0002Y10T117/10Y10T117/1004
    • In forming an electrode on a silicon oxide film on a semiconductor substrate through a silicon oxide film, for example, the gate electrode 2 is structured in a laminated structure of a plurality of polycrystalline silicon layers. The portion of the gate electrode is formed by a method of manufacturing a thin film having a process of depositing amorphous layers and of crystallizing (recrystallizing) this amorphous material. Depositing of the amorphous layers is carried out a plurality of times so that the thickness of an amorphous layer to be deposited at one time is not larger than a thickness to be prescribed by a critical stress value determined according to a fail event, the amorphous material is crystallized after each process of depositing each amorphous layer has been finished, and the process of depositing amorphous layers and crystallizing the amorphous material are repeated, whereby a laminated structure of polycrystalline layers having a necessary film thickness is obtained. It is possible to prevent deterioration of electric characteristics of a semiconductor device and an occurrence of a defect, such as a peeling off between layers, cracks in a layer, etc., and it is possible to obtain a polycrystalline layer of small grain size in a desired film thickness by a lamination of polycrystalline materials.
    • 在通过氧化硅膜在半导体衬底上形成氧化硅膜上的电极时,例如,栅电极2被构造成多个多晶硅层的叠层结构。 栅电极的部分通过制造具有沉积非晶层并使(非晶态)结晶(再结晶))的方法的薄膜的制造方法形成。 非晶层的沉积进行多次,使得一次沉积的非晶层的厚度不大于根据失败事件确定的临界应力值规定的厚度,非晶材料 在沉积每个非晶层的每个工艺完成后结晶,并且重复沉积非晶层并使无定形材料结晶的过程,从而获得具有所需膜厚度的多晶层的层叠结构。 可以防止半导体器件的电特性的劣化和层之间的剥离等缺陷的发生,层中的裂纹等的发生,并且可以获得小晶粒尺寸的多晶层 通过层压多晶材料制成所需的膜厚度。
    • 28. 发明授权
    • Apparatus for manufacturing a semiconductor device having conductive
then films
    • 用于制造具有导电膜的半导体器件的装置
    • US5683515A
    • 1997-11-04
    • US534118
    • 1995-09-26
    • Takashi NakajimaHideo MiuraHiroyuki OhtaNoriaki Okamoto
    • Takashi NakajimaHideo MiuraHiroyuki OhtaNoriaki Okamoto
    • H01L21/02H01L23/532H01L29/49C23C16/00
    • H01L21/28097H01L21/28035H01L21/28518H01L21/28525H01L21/32053H01L21/76838H01L21/76877H01L21/823437H01L23/485H01L23/53257H01L23/53271H01L28/40H01L29/4925H01L29/4975H01L2924/0002Y10T117/10Y10T117/1004
    • In forming an electrode 2 on a silicon oxide film 5 on a semiconductor substrate 4 through a silicon oxide film 5, for example, the gate electrode 2 is structured in a laminated structure of a plurality of polycrystalline silicon layers 6. The portion of the gate electrode 2 is formed by a method of manufacturing a thin film having a process of depositing amorphous layers and a process of crystallizing (recrystallizing) this amorphous material. In this case, depositing of the amorphous layers is carried out dividedly by a plurality of times so that the thickness of an amorphous layer to be deposited at one time is not larger than a thickness to be prescribed by a critical stress value determined according to a fail event, the amorphous material is crystallized after each process of depositing each amorphous layer has been finished, and the process of depositing amorphous layers and the process of crystallizing the amorphous material are repeated, whereby a laminated structure of the polycrystalline layer 6 having a necessary film thickness is obtained. With the above-described arrangement, it is possible to prevent a deterioration of electric characteristics of a semiconductor device and an occurrence of a defect, such as a peeling off between layers, cracks in a layer, etc., and it is possible to obtain a polycrystalline layer of small grain size in a desired film thickness by a lamination of polycrystalline materials.
    • 例如,通过氧化硅膜5在半导体衬底4上的氧化硅膜5上形成电极2时,栅电极2被构成为多个多晶硅层6的层叠结构。栅极部分 通过制造具有沉积非晶层的工艺的薄膜的方法和使该非晶材料结晶(再结晶)的方法形成电极2。 在这种情况下,非晶层的沉积被分开多次进行,使得一次沉积的非晶层的厚度不大于根据根据下式确定的临界应力值规定的厚度 在每个非晶层的沉积过程完成之后,非晶材料结晶,重复沉积非晶层的过程和结晶非晶材料的过程,由此多晶层6的层压结构具有必要的 获得膜厚度。 利用上述结构,可以防止半导体器件的电特性的恶化和层之间的剥离等缺陷的发生,层中的裂纹等,并且可以获得 通过多晶材料的层叠,具有所需膜厚度的小晶粒尺寸的多晶层。
    • 29. 发明授权
    • Sheet finish-processing unit in image forming apparatus
    • 图像形成装置中的片材整理处理单元
    • US5407186A
    • 1995-04-18
    • US053952
    • 1993-04-28
    • Satoru HayamaKeiichi TaguchiNoriaki OkamotoKeiji OkumuraJun Miyoshi
    • Satoru HayamaKeiichi TaguchiNoriaki OkamotoKeiji OkumuraJun Miyoshi
    • B42C1/12B31B1/68B65H39/02
    • B42C1/125B65H2403/511B65H2408/113B65H2408/1142
    • Image forming apparatus including a sheet finish-processing unit for finish-processing sheets discharged from a copying machine to which the unit is laterally positioned and stored thereby into a plurality of stacks. A sheet stack finish-processing mechanism of the unit, incorporating a stapler, is shiftable by an associated drive mechanism in the widthwise direction along the adjacent end of a positioned stack in storage. A sheet stack handling mechanism therein draws the end of the positioned stack into a finishing locale of the finish-processing mechanism, and subsequent to a finishing (stapling) operation, returns the finished sheet stack into storage. Thereupon, the stack is transversely discharged frontward of the image forming apparatus from storage, during which operation a subsequent finishing operation is concurrently executable; by such discharge a number of copy stacks greater than the number of stacking storages can be processed. The stacks are linearly inserted into and withdrawn from the finish-processing mechanism, eliminating the need for complex movements thereof, and allowing the finish-processing mechanism to be functional at a number of linear positions along the stack end margin. Furthermore, the sheet stacks are discharged to the apparatus front, wherein they are readily accessible for removal by an operator.
    • 图像形成设备包括一个用于对从单元横向定位并由其存储的复印机排出的纸张进行精加工的多个堆叠的纸张处理单元。 包括订书机的单元的纸叠完成处理机构可以通过相关联的驱动机构沿着沿着定位的堆叠的存储中的相邻端沿宽度方向移动。 纸张堆栈处理机构在其中将定位的堆叠的端部拉到精加工机构的精加工区域中,并且在精加工(装订)操作之后,将成品纸堆叠返回到存储器中。 于是,堆叠从存储器横向地从图像形成装置向前排出,在该操作期间,随后的整理操作可同时执行; 通过这种放电,可以处理大于堆叠存储器数量的多个复制堆叠。 堆叠线材插入并从精加工机构中取出,消除了对其复杂运动的需要,并且允许精加工机构在沿着堆叠端边缘的多个线性位置处起作用。 此外,片材堆叠被排放到设备前部,其中它们容易接近以便操作者去除。