专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09142542B2 Semiconductor device with protective diode 有权
标题翻译：具有保护二极管的半导体器件
公开(公告)号：US09142542B2
公开(公告)日：2015-09-22
申请号：US13824338
申请日：2011-09-13
申请人： Keiji Okumura
发明人： Keiji Okumura
IPC分类号： H01L27/02 , H01L29/66 , H01L29/739 , H01L29/78 , H01L29/861 , H01L27/06 , H01L29/06 , H01L29/16 , H01L29/45 , H01L29/49
CPC分类号： H01L27/0255 , H01L27/0629 , H01L29/0619 , H01L29/0696 , H01L29/1608 , H01L29/45 , H01L29/4916 , H01L29/66068 , H01L29/7395 , H01L29/7808 , H01L29/7811 , H01L29/861 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device (1) includes an n type epitaxial layer (8), body regions (12) formed in the surface layer part of the n type epitaxial layer (8), n type source regions (16) formed in the surface layer parts of the body regions (12), a gate insulating film (19) formed on the n type epitaxial layer (8), and a gate protection diode (30) and gate electrodes (20) formed on the gate insulating film (19). The gate protection diode (30) includes a first p type region (31), an n type region (32), and a second p type region (33). A first diode (30A) is formed of the first p type region (31) and the n type region (32). A second diode (30B) is formed of the n type region (32) and the second p type region (33). The first p type region (31) is connected to the gate electrode (20). The second p type region (33) is connected to a source electrode (27).
摘要翻译：半导体器件（1）包括n型外延层（8），形成在n型外延层（8）的表层部分中的体区（12），形成在表层部分中的n型源区形成在n型外延层（8）上的栅极绝缘膜（19）和形成在栅极绝缘膜（19）上的栅极保护二极管（30）和栅电极（20）。栅极保护二极管（30）包括第一p型区域（31），n型区域（32）和第二p型区域（33）。第一二极管（30A）由第一p型区域（31）和n型区域（32）形成。第二二极管（30B）由n型区域（32）和第二p型区域（33）形成。第一p型区域（31）连接到栅电极（20）。第二p型区域（33）连接到源电极（27）。

2. 发明授权

US09136378B2 Semiconductor device and manufacturing method for same 有权
标题翻译：半导体器件及其制造方法相同
公开(公告)号：US09136378B2
公开(公告)日：2015-09-15
申请号：US13824380
申请日：2011-09-15
申请人： Keiji Okumura , Mineo Miura , Katsuhisa Nagao , Shuhei Mitani
发明人： Keiji Okumura , Mineo Miura , Katsuhisa Nagao , Shuhei Mitani
IPC分类号： H01L29/66 , H01L29/78 , H01L29/423 , H01L21/04 , H01L29/04 , H01L29/06 , H01L29/16 , H01L29/45 , H01L29/51
CPC分类号： H01L29/7827 , H01L21/046 , H01L21/049 , H01L29/045 , H01L29/0619 , H01L29/0696 , H01L29/1608 , H01L29/42368 , H01L29/45 , H01L29/518 , H01L29/66068 , H01L29/66666 , H01L29/7802 , H01L29/7811
摘要： A semiconductor device includes a first conductive-type semiconductor layer, a second conductive-type body region formed in a surficial portion of the semiconductor layer, a first conductive-type source region formed in a surficial portion of the body region, a gate insulating film provided on the semiconductor layer and containing nitrogen atoms, the gate insulating film including a first portion in contact with the semiconductor layer outside the body region, a second portion in contact with the body region, and a third portion in contact with the source region, and a gate electrode provided on the gate insulating film in an area extending across the semiconductor layer outside the body region, the body region, and the source region. The third portion of the gate insulating film has a thickness greater than the thickness of the first portion and the thickness of the second portion.
摘要翻译：半导体器件包括第一导电类型半导体层，形成在半导体层的表面部分中的第二导电型体区域，形成在体区的表面部分中的第一导电型源极区域，栅极绝缘膜设置在所述半导体层上并且含有氮原子的栅极绝缘膜，所述栅极绝缘膜包括与所述体区域外部的所述半导体层接触的第一部分，与所述主体区域接触的第二部分和与所述源极区域接触的第三部分，以及栅极电极，设置在栅极绝缘膜上的延伸穿过体区，身体区域和源区域之外的半导体层的区域中。栅极绝缘膜的第三部分的厚度大于第一部分的厚度和第二部分的厚度。

3. 发明授权

US08971044B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08971044B2
公开(公告)日：2015-03-03
申请号：US13479032
申请日：2012-05-23
申请人： Keiji Okumura , Takukazu Otsuka , Masao Saito
发明人： Keiji Okumura , Takukazu Otsuka , Masao Saito
IPC分类号： H05K7/20 , H01L25/18 , H01L25/16 , H02M7/00 , H05K1/14
CPC分类号： H02M7/003 , H01L25/162 , H01L25/18 , H01L2224/45124 , H01L2224/48091 , H01L2924/01019 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H05K1/14 , H05K7/02 , H05K7/20509 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.
摘要翻译：半导体器件包括：第一输出单元，被配置为输出第一相位; 第二输出单元，被配置为输出与所述第一相不同的第二相，所述第二输出单元被布置为堆叠在所述第一输出单元上; 以及控制器，被配置为控制所述输出单元。

4. 发明授权

US08608150B2 Sheet post-processing apparatus with branched holding path 有权
标题翻译：具有分支保持路径的片材后处理装置
公开(公告)号：US08608150B2
公开(公告)日：2013-12-17
申请号：US13042236
申请日：2011-03-07
申请人： Keiji Okumura
发明人： Keiji Okumura
IPC分类号： B65H37/04 , B65H37/06
CPC分类号： B65H29/60 , B41J3/44 , B42B4/00 , B42C1/12 , B65H2301/314 , B65H2301/4213 , B65H2404/631 , B65H2404/632 , B65H2601/523 , B65H2801/27 , G03G15/6529 , G03G15/6538
摘要： A sheet post-processing apparatus is provided that includes a first delivery path that guides a sheet to a first post-processing portion, a delivery holding path having a first holding path which branches off from a branch point of the first delivery path and a second holding path which is formed to be continuous with the first holding path and joins together with the first delivery path; a second delivery path that branches off from a branch point of the first holding path and guides the sheet to the second post-processing portion; a first path switching portion that is provided at the branch point of the first delivery path; and a second path switching portion that is provided at the branch point of the first holding path.
摘要翻译：提供了一种片材后处理装置，其包括将片材引导到第一后处理部分的第一输送路径，具有从第一输送路径的分支点分支的第一保持路径的输送保持路径，保持路径，其形成为与第一保持路径连续并与第一输送路径连接; 第二传送路径，其从所述第一保持路径的分支点分支，并将所述片材引导到所述第二后处理部分; 第一路径切换部，其设置在所述第一输送路径的分支点处; 以及设置在第一保持路径的分支点处的第二路径切换部。

5. 发明申请

US20120112201A1 HIGH MELTING POINT SOLDERING LAYER AND FABRICATION METHOD FOR THE SAME, AND SEMICONDUCTOR DEVICE 有权
标题翻译：高熔点焊接层及其制造方法及其半导体器件
公开(公告)号：US20120112201A1
公开(公告)日：2012-05-10
申请号：US12942437
申请日：2010-11-09
申请人： Takukazu OTSUKA , Keiji OKUMURA , Brian LYNN ROWDEN
发明人： Takukazu OTSUKA , Keiji OKUMURA , Brian LYNN ROWDEN
IPC分类号： H01L23/498 , B32B15/01 , B23K1/20 , H01L29/02 , H01L23/492
CPC分类号： B32B15/018 , B23K1/0016 , B23K35/0238 , B23K35/262 , B23K35/3006 , B23K2101/40 , H01L23/053 , H01L23/3735 , H01L23/488 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/85 , H01L25/0655 , H01L2224/271 , H01L2224/2908 , H01L2224/29111 , H01L2224/29139 , H01L2224/29155 , H01L2224/32227 , H01L2224/32238 , H01L2224/48091 , H01L2224/48105 , H01L2224/48229 , H01L2224/73265 , H01L2224/83101 , H01L2224/83204 , H01L2224/83211 , H01L2224/83801 , H01L2224/83825 , H01L2224/85 , H01L2224/92147 , H01L2924/00014 , H01L2924/01322 , H01L2924/01327 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , H01L2924/3841 , Y10T428/12708 , H01L2924/01047 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A high melting point soldering layer includes a low melting point metal layer, a first high melting point metal layer disposed on a surface of the low melting point metal layer, and a second high melting point metal layer disposed at a back side of the low melting point metal layer. The low melting point metal layer, the first high melting point metal layer, and the second high melting point metal layer are mutually alloyed by transient liquid phase bonding, by annealing not less than a melting temperature of the low melting point metal layer, diffusing the metal of the low melting point metal layer into an alloy of the first high melting point metal layer and the second high melting point metal layer. The high melting point soldering layer has a higher melting point temperature than that of the low melting point metal layer. It is provided a binary based high melting point soldering layer having TLP bonding of a high melting point according to a low temperature processing, a fabrication method for the high melting point soldering layer and a semiconductor device to which the high melting point soldering layer is applied.
摘要翻译：高熔点焊接层包括低熔点金属层，设置在低熔点金属层的表面上的第一高熔点金属层和设置在低熔点金属层的背面的第二高熔点金属层点金属层。低熔点金属层，第一高熔点金属层和第二高熔点金属层通过瞬态液相结合相互合金化，通过退火不低于低熔点金属层的熔融温度，将低熔点金属层的金属成为第一高熔点金属层和第二高熔点金属层的合金。高熔点焊接层的熔点温度高于低熔点金属层。提供了一种基于低温处理的具有高熔点TLP键合的二元基高熔点焊接层，用于高熔点焊接层的制造方法和施加高熔点焊接层的半导体器件。

6. 发明授权

US08152159B2 Sheet feeding device and image forming apparatus including a controlled elevator mechanism 有权
标题翻译：片材进给装置和包括受控升降机构的图像形成装置
公开(公告)号：US08152159B2
公开(公告)日：2012-04-10
申请号：US12551726
申请日：2009-09-01
申请人： Keiji Okumura
发明人： Keiji Okumura
IPC分类号： B65H1/08
CPC分类号： B65H3/0607 , B65H1/14 , B65H3/48 , B65H3/60 , B65H2301/5143 , B65H2406/12 , B65H2511/20 , B65H2515/40 , B65H2515/805 , B65H2801/06 , B65H2220/02 , B65H2220/11 , B65H2220/01
摘要： A sheet feeding device has: a sheet accommodating portion that accommodates a sheet stack of a plurality of sheets; a sheet carrying plate that is provided within the sheet accommodating portion and stacks the sheet stack thereon; a pickup roller that contacts an upper face of the sheet stack and dispatches a sheet on an uppermost layer of the sheet stack, an elevator mechanism that displaces the sheet carrying plate between a sheet feeding position in which the upper face of the sheet stack contacts the pickup roller, and a separating position in which the upper face of the sheet stack separates from the pickup roller by a predetermined distance; and a controller that controls an operation of the elevator mechanism such that the sheet carrying plate is lowered to the separating position after a sheet feeding operation for feeding a sheet at the sheet feeding position is completed.
摘要翻译：片材进给装置具有：容纳多张片材的片材叠片的片材容纳部; 片材承载板，其设置在所述片材容纳部内并且堆叠所述片材堆叠; 拾取辊，其接触片材堆叠的上表面并且在片材堆叠的最上层上分配片材;升降机构，其将片材承载板移动到片材进给位置，在片材进给位置，片材堆叠的上表面接触片材拾取辊和分离位置，其中纸叠的上表面与拾取辊分离预定距离; 以及控制器，用于控制电梯机构的操作，使得在用于在片材进给位置馈送片材的供纸操作完成之后，片材承载板下降到分离位置。

7. 发明授权

US07938396B2 Sheet feeding device and image forming apparatus including sheet feeding device with a sheet feeding preparation period 有权
标题翻译：片材进给装置和图像形成装置，包括具有片材进给准备期的片材进给装置
公开(公告)号：US07938396B2
公开(公告)日：2011-05-10
申请号：US12536755
申请日：2009-08-06
申请人： Keiji Okumura , Yoshio Sugishima , Yoshihiro Yamaguchi
发明人： Keiji Okumura , Yoshio Sugishima , Yoshihiro Yamaguchi
IPC分类号： B65H1/08
CPC分类号： B65H3/0607 , B65H3/48 , B65H3/60 , B65H2301/5143 , B65H2601/273
摘要： A sheet feeding device has a sheet accommodating portion for accommodating a sheet stack, a sheet carrying plate for carrying the sheet stack and a pickup roller that dispatches the uppermost sheet of the stack. An elevator displaces the sheet carrying plate between a sheet feeding position where an upper face of the sheet stack contacts the pickup roller and a separating position where the upper face of the sheet stack is separated from the pickup roller. A first warm air mechanism blows warm air toward a side face of the sheet stack. A controller causes the first warm air mechanism to blow warm air to the side face of the sheet stack and causes the elevator to displace the sheet carrying plate between the sheet feeding position and the separating position.
摘要翻译：片材进给装置具有用于容纳片材堆叠的片材容纳部分，用于承载片材堆叠的片材承载板和分配堆叠的最上面的片材的拾取辊。升降机将片材承载板置于纸张堆叠的上表面接触拾取辊的送纸位置和纸张堆叠的上表面与拾取辊分离的分离位置之间移动。第一暖空气机构将热空气吹向片材堆叠的侧面。控制器使得第一暖空气机构将热空气吹送到片材堆叠的侧面，并使电梯在片材进给位置和分离位置之间移动片材承载板。

8. 发明授权

US07883084B2 Sheet feeding device and image forming apparatus with warm air unit for blowing air toward upper face of sheet stack 有权
标题翻译：纸张进给装置和图像形成装置，具有用于向空白纸张堆叠的上表面吹送空气的暖风单元
公开(公告)号：US07883084B2
公开(公告)日：2011-02-08
申请号：US12490576
申请日：2009-06-24
申请人： Keiji Okumura , Yoshihiro Yamaguchi , Yoshio Sugishima , Sachio Izumichi
发明人： Keiji Okumura , Yoshihiro Yamaguchi , Yoshio Sugishima , Sachio Izumichi
IPC分类号： B65H3/46
CPC分类号： B65H3/60 , B65H1/00 , B65H2301/5143 , B65H2406/10 , B65H2801/06 , G03G15/6511
摘要： A sheet feeding device for feeding a sheet-form recording medium includes: a sheet accommodating portion for accommodating a sheet stack constituted by a plurality of sheets of the sheet-form recording medium; and a first warm air unit having a first blowing port for blowing warm air toward an upper face of the sheet stack accommodated in the sheet accommodating portion. The sheet feeding device preferably further includes a second warm air unit having a second blowing port for blowing warm air onto a side face of the sheet stack that is parallel to a sheet feeding direction.
摘要翻译：用于供给片状记录介质的片材进给装置包括：片材容纳部分，用于容纳由多张片状记录介质构成的片材堆叠; 以及第一热空气单元，其具有朝向容纳在所述片材容纳部分中的片材堆叠的上表面吹送暖空气的第一吹出口。片材供给装置优选还包括第二暖气单元，其具有用于将热空气吹送到片材堆叠的平行于片材进给方向的侧面的第二吹出口。

9. 发明授权

US07434797B2 Recording media processing device and image forming device 有权
标题翻译：记录媒体处理装置和图像形成装置
公开(公告)号：US07434797B2
公开(公告)日：2008-10-14
申请号：US11258907
申请日：2005-10-27
申请人： Keiji Okumura
发明人： Keiji Okumura
IPC分类号： B65H37/04
CPC分类号： B65H29/58 , B65H29/12 , B65H29/51 , B65H2220/09 , B65H2301/4213 , B65H2404/1531 , B65H2404/632 , B65H2801/06
摘要： The present invention comprises a shunting roller 41, and when recording media P, which is output from an image forming device main body 11, is stacked as a stack of recording media and staple processing is performed thereon, the shunting roller 41 rotates so as to receive subsequent recording media P in the wrapping direction thereof, while the first stack of recording media undergoes staple processing. The present invention also comprises a first branching pawl 44, for switching the direction of transport of recording media P between a transport path 42 and a processing unit 40, and a second branching pawl 47, for switching it between an output tray 45 and the shunting roller 41. Furthermore, a transport roller 53 for transporting the recording media P, is provided in the direction of transport between the first and second branching pawls 44 and 47, and cutaways 57 and 58 are formed in the first and second branching pawls 44 and 47 so as not to interfere with this transport roller 53, the transport roller 53 and the first and second branching pawls 44 and 47 being disposed so as to overlap when seen from the side.
摘要翻译：本发明包括分流辊41，并且当记录从图像形成装置主体11输出的记录介质P作为堆叠的记录介质堆叠并进行装订处理时，分流辊41旋转，以便在第一堆记录介质经受订书处理时，在其包装方向上接收后续的记录介质P. 本发明还包括用于切换输送路径42和处理单元40之间的记录介质P的输送方向的第一分支爪44和第二分支爪47，用于在输出托盘45和分流器辊41。此外，在第一和第二分支爪44和47之间的输送方向上设置有用于输送记录介质P的传送辊53，并且在第一和第二分支爪44和47中形成有切口57和58，以便不干扰该输送辊53，输送辊53以及第一和第二分支爪44和47从侧面看时重叠。

10. 发明授权

US6089558A Sheet handling unit after image formation 失效
标题翻译：图像形成后的纸张处理单元
公开(公告)号：US6089558A
公开(公告)日：2000-07-18
申请号：US998899
申请日：1997-12-29
申请人： Keiji Okumura
发明人： Keiji Okumura
IPC分类号： B65H39/11 , B65H5/06 , B65H9/00 , B65H31/30 , B65H33/08 , B65H39/10 , G03G15/00 , B65H39/07
CPC分类号： G03G15/6538 , B65H33/08 , B65H39/10 , B65H5/062 , B65H9/00 , G03G15/60 , B65H2405/52 , B65H2408/1143 , B65H2408/116 , B65H2513/40 , B65H2513/50
摘要： This invention relates to a sheet handling unit. The sheet handing device has an intermediate tray which receives a copy sheet discharged through an outlet port of a transport guide member at a predetermined receiving position, and a hand unit which holds a portion of the sheet set on the intermediate tray to transfer the sheet set from the intermediate tray onto a sheet stacker. The intermediate tray carrying the sheet set thereon and the hand unit move toward a sheet releasing position in a state that the hand unit holds the portion of the sheet set to transfer the sheet set to the sheet releasing position. The hand unit pauses at the sheet releasing position while holding the portion of the sheet set. Meanwhile, the intermediate tray moves to a retract position away from the sheet stacker, and the hand unit releases the holding of the sheet set at the sheet releasing position. Thereby, the sheet set is transferred onto the sheet stacker from the intermediate tray.
摘要翻译：本发明涉及片材处理单元。纸张处理装置具有中间托盘，该中间托盘容纳在预定接收位置处通过输送引导构件的出口排出的复印纸，以及手单元，其保持设置在中间托盘上的片材的一部分以转印纸张组从中间托盘到片材堆垛机。携带其上设置的片材的中间托盘和手单元在手单元保持片材组的部分以将片材组转印到片材释放位置的状态下朝向片材释放位置移动。手持单元在保持片材组的一部分的同时在片材释放位置处暂停。同时，中间托盘移动到远离纸张堆放器的缩回位置，并且手单元释放纸张在纸张释放位置的保持。由此，片材组从中间托盘转移到片材堆垛机上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式