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    • 26. 发明授权
    • Processing method for recovering iron oxide and hydrochloric acid
    • 回收氧化铁和盐酸的加工方法
    • US08628740B2
    • 2014-01-14
    • US13000216
    • 2009-06-18
    • Nobuyoshi TakahashiOsama TakiHerbert WeissenbaeckDieter Vogl
    • Nobuyoshi TakahashiOsama TakiHerbert WeissenbaeckDieter Vogl
    • B01D11/00B01D49/00
    • C01G49/06C01B7/0706C23G1/36
    • A method of processing waste iron chloride solution including ferrous chloride, ferric chloride or mixtures thereof and optionally free hydrochloric acid, includes concentrating waste iron chloride solution into concentrated liquid having iron chloride concentration of at least 30%-40% by weight; optionally oxidizing ferrous chloride in the concentrated liquid from the concentration step to ferric chloride providing liquid containing ferric chloride; hydrolyzing the liquid containing ferric chloride from the oxidation step at 155-350° C., maintaining the ferric chloride concentration at least at 65% by weight, generating steam containing hydrogen chloride and liquid containing ferric oxide; separating ferric oxide from the liquid containing ferric oxide in the hydrolysis step; condensing steam containing hydrogen chloride in the hydrolysis step, recovering hydrochloric acid at a concentration of at least 10%-15% by weight; and using condensation energy of the hydrogen chloride containing steam in the recovery step to heat the concentration step performed under reduced pressure.
    • 一种处理包括氯化亚铁,氯化铁或其混合物和任选的游离盐酸的废氯化铁溶液的方法包括将废铁水溶液浓缩至浓度为至少30%-40%(重量)的氯化铁浓缩液; 任选地将浓缩步骤中的浓缩液中的氯化亚铁氧化成三氯化铁提供含有氯化铁的液体; 在155-350℃下从氧化步骤水解含有氯化铁的液体,维持氯化铁浓度至少为65重量%,产生含有氯化氢的蒸汽和含有氧化铁的液体; 在水解步骤中从含有三氧化二铁的液体中分离出氧化铁; 在水解步骤中冷凝含有氯化氢的蒸汽,以至少10重量%-15重量%的浓度回收盐酸; 并且在回收步骤中使用含有氯化氢的蒸汽的冷凝能量来加热在减压下进行的浓缩步骤。
    • 27. 发明授权
    • Semiconductor device having diffusion layers as bit lines and method for manufacturing the same
    • 具有作为位线的扩散层的半导体器件及其制造方法
    • US07704803B2
    • 2010-04-27
    • US12337023
    • 2008-12-17
    • Nobuyoshi TakahashiFumihiko NoroKenji Sato
    • Nobuyoshi TakahashiFumihiko NoroKenji Sato
    • H01L21/8246
    • H01L27/11568H01L27/115
    • A semiconductor device includes: a semiconductor region; a plurality of bit line diffusion layers formed in an upper portion of the semiconductor region and each extending in a row direction; a plurality of bit line insulating films formed on the bit line diffusion layers; a plurality of gate insulting films formed between the respective adjacent bit line diffusion layers on the semiconductor region; and a plurality of word lines each formed on the semiconductor region in a column direction and each intersecting with the bit line insulating films and the gate insulating films. Memory cells are formed at intersections of the gate insulating films and the word lines. A plurality of connection diffusion layers including connection parts electrically connected to the bit line diffusion layers are formed in the upper portion of the semiconductor region, and a level of upper faces of the connection parts is lower than a level of upper faces of the connection diffusion layers in the semiconductor region.
    • 半导体器件包括:半导体区域; 多个位线扩散层,其形成在所述半导体区域的上部,并且各自沿行方向延伸; 形成在位线扩散层上的多个位线绝缘膜; 形成在所述半导体区域上的各个相邻位线扩散层之间的多个栅极绝缘膜; 以及多个字线,各自在列方向上形成在半导体区域上,并且与字线绝缘膜和栅极绝缘膜交叉。 存储单元形成在栅极绝缘膜和字线的交点处。 包括与位线扩散层电连接的连接部分的多个连接扩散层形成在半导体区域的上部,并且连接部分的上表面的电平低于连接扩散部的上表面的高度 半导体区域中的层。