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    • 21. 发明授权
    • Hard disk drive having a damper for reducing vibrations
    • 具有用于减少振动的阻尼器的硬盘驱动器
    • US07286320B2
    • 2007-10-23
    • US11270591
    • 2005-11-10
    • Jin-seung SohnSung-hoon Choa
    • Jin-seung SohnSung-hoon Choa
    • G11B17/02
    • G11B25/043G11B33/08
    • A hard disk drive having a vibration reducing damper is disclosed. The hard disk drive is provided with a damper which is interposed between a through hole provided at a cover plate and a screw joined to the upper end of the shaft of a spindle motor, and includes at least one viscoelastic material layer. It is preferable that the damper has a multi-layered structure in which at least one high stiffness layer has relatively higher stiffness and at least one low stiffness layer made of a viscoelastic material has relatively lower stiffness. With the above configuration, the damper restrains vibrations generated by the spindle from being transferred to the cover plate, noises generated by the hard disk drive are reduced, and, in addition, since vibrations generated by the spindle motor are damped, disk fluttering is reduced.
    • 公开了一种具有减振阻尼器的硬盘驱动器。 硬盘驱动器设置有阻尼器,其设置在设置在盖板上的通孔和与主轴电机的轴的上端接合的螺钉之间,并且包括至少一个粘弹性材料层。 优选地,阻尼器具有多层结构,其中至少一个高刚度层具有相对较高的刚度,并且由粘弹性材料制成的至少一个低刚度层具有相对较低的刚度。 通过上述结构,阻尼器抑制由主轴产生的振动传递到盖板,由硬盘驱动器产生的噪声减小,此外,由于主轴电动机产生的振动被阻尼,所以盘振动减小 。
    • 22. 发明授权
    • Method for manufacturing micro electro-mechanical systems using solder balls
    • 使用焊球制造微机电系统的方法
    • US07008817B2
    • 2006-03-07
    • US10784144
    • 2004-02-23
    • Woon-bae KimSung-hoon ChoaMin-seog Choi
    • Woon-bae KimSung-hoon ChoaMin-seog Choi
    • H01L21/44H01L21/48H01L21/50
    • B81B7/0006H01L2924/0002H01L2924/00
    • A method for manufacturing micro electro-mechanical systems includes forming an insulation layer on an upper surface of a semiconductor substrate, forming a structure layer on an upper surface of the insulation layer and etching the structure layer, forming an under bump metal on a predetermined position of an upper surface of the structure layer, forming a via hole in a glass substrate corresponding to the position of the under bump metal and in a shape such that the via hole is larger in diameter at an upper surface of the glass substrate than at a lower surface of the glass substrate, wherein the glass substrate is bonded to the upper surface of the structure layer and creates a vacuum chamber that protects a structure of the structure layer, and arranging a solder ball in the via hole and bonding the solder ball to the under bump metal.
    • 一种制造微电子机械系统的方法,包括在半导体衬底的上表面上形成绝缘层,在绝缘层的上表面上形成结构层并蚀刻结构层,在预定位置上形成凹凸金属 所述结构层的上表面在对应于所述凸块下金属的位置的玻璃基板中形成通孔,并且所述通孔在所述玻璃基板的上表面处的直径比在 玻璃基板的下表面,其中玻璃基板结合到结构层的上表面,并且形成保护结构层的结构的真空室,并且在通孔中布置焊球并将焊球接合到 下凸块金属。
    • 30. 发明授权
    • Method and apparatus for calibrating position of image sensor, and method of detecting position of image sensor
    • 用于校准图像传感器位置的方法和装置,以及检测图像传感器位置的方法
    • US07490016B2
    • 2009-02-10
    • US11828516
    • 2007-07-26
    • Dong-ki MinSung-hoon ChoaSeung-bum Hong
    • Dong-ki MinSung-hoon ChoaSeung-bum Hong
    • G01C25/00
    • H04N5/349
    • A method and apparatus for calibrating a position of an image sensor, and a method of detecting the position of an image sensor are provided. The method of calibrating the position of an image sensor includes: obtaining first image information corresponding to a first position of the image sensor and obtaining second image information corresponding to a second position of the image sensor, calculating cross-correlation values between the obtained first image information and second image information; determining whether or not the calculated cross-correlation values are symmetrical; setting a driving power value of the image sensor for moving the image sensor the distance between the first position to the second position as a reference driving power value for moving the image sensor one-pixel distance, if it is determined that the cross-correlation values are not symmetrical; and calibrating the position of the image sensor by using the set driving power value.
    • 提供了用于校准图像传感器的位置的方法和装置以及检测图像传感器的位置的方法。 校准图像传感器的位置的方法包括:获得与图像传感器的第一位置相对应的第一图像信息,并获得与图像传感器的第二位置对应的第二图像信息,计算所获得的第一图像之间的互相关值 信息和第二图像信息; 确定所计算的互相关值是否对称; 设置图像传感器的驱动功率值,用于将图像传感器的距离移动到第一位置与第二位置之间,作为用于使图像传感器移动一像素距离的基准驱动功率值,如果确定互相关值 不对称 并使用设定的驱动功率值来校准图像传感器的位置。