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    • 22. 发明申请
    • PATTERN FORMING METHOD
    • 图案形成方法
    • US20100304568A1
    • 2010-12-02
    • US12752684
    • 2010-04-01
    • Seiro MIYOSHIYasunobu KaiKentaro MatsunagaKeisuke KikutaniEishi ShiobaraShinya Takahashi
    • Seiro MIYOSHIYasunobu KaiKentaro MatsunagaKeisuke KikutaniEishi ShiobaraShinya Takahashi
    • H01L21/302G03F7/20
    • G03F1/34G03F7/095H01L21/0274H01L21/31144
    • A pattern forming method includes forming a first photoresist on an underlying region, forming a second photoresist on the first photoresist, the second photoresist having an exposure sensitivity which is different from an exposure sensitivity of the first photoresist, radiating exposure light on the first and second photoresists via a photomask including a first transmissive region and a second transmissive region which cause a phase difference of 180° between transmissive light components passing therethrough, the first transmissive region and the second transmissive region being provided in a manner to neighbor in an irradiation region, and developing the first and second photoresists which have been irradiated with the exposure light, thereby forming a structure includes a first region where the underlying region is exposed, a second region where the first photoresist is exposed and a third region where the first photoresist and the second photoresist are left.
    • 图案形成方法包括在下面的区域上形成第一光致抗蚀剂,在第一光致抗蚀剂上形成第二光致抗蚀剂,第二光致抗蚀剂具有不同于第一光致抗蚀剂的曝光灵敏度的曝光灵敏度, 通过包括第一透射区域和第二透射区域的光掩模进行光刻,所述第一透射区域和第二透射区域在穿过其中的透射光分量之间产生180°的相位差,第一透射区域和第二透射区域以照射区域相邻的方式设置, 以及显影已经用曝光光照射的第一和第二光致抗蚀剂,由此形成结构,其包括下部区域被暴露的第一区域,第一光致抗蚀剂被曝光的第二区域和第一光致抗蚀剂 剩下第二光致抗蚀剂。
    • 27. 发明授权
    • Semiconductor device manufacturing method
    • 半导体器件制造方法
    • US08138059B2
    • 2012-03-20
    • US12564440
    • 2009-09-22
    • Kentaro MatsunagaHirokazu KatoTomoya Oori
    • Kentaro MatsunagaHirokazu KatoTomoya Oori
    • H01L21/76
    • H01L21/0273G03F7/40H01L21/0337H01L21/0338H01L21/31144
    • A semiconductor device manufacturing method includes: forming a core pattern on a foundation film, the core pattern containing a material generating acid by light exposure; selectively exposing part of the core pattern except an longitudinal end portion; supplying a mask material onto the foundation film so as to cover the core pattern, the mask material being crosslinkable upon supply acid from the core pattern; etching back the mask material to expose an upper surface of the core pattern and remove a portion of the mask material formed on the end portion of the core pattern, thereby leaving a mask material side wall portion formed on a side wall of the core pattern; and removing the core pattern and processing the foundation film by using the mask material sidewall portion left on the foundation film as a mask.
    • 半导体器件制造方法包括:在基底膜上形成芯图案,所述芯图案含有通过曝光产生酸的材料; 选择性地暴露除了纵向端部之外的芯图案的一部分; 将掩模材料供应到所述基底膜上以覆盖所述芯图案,所述掩模材料在从所述芯图案供给酸时可交联; 蚀刻掩模材料以露出芯图案的上表面并且去除形成在芯图案的端部上的掩模材料的一部分,从而留下形成在芯图案的侧壁上的掩模材料侧壁部分; 并且通过使用留在基底膜上的掩模材料侧壁部分作为掩模去除芯图案和处理基底膜。
    • 29. 发明申请
    • System and method for collecting carbon dioxide in exhaust gas
    • 废气中二氧化碳收集系统及方法
    • US20060185516A1
    • 2006-08-24
    • US10560979
    • 2004-06-18
    • Hideshige MoriyamaKentaro MatsunagaMasafumi Fukuda
    • Hideshige MoriyamaKentaro MatsunagaMasafumi Fukuda
    • B01D53/14
    • B01D53/62Y02C10/04Y02C10/06
    • A system and a method for recovery of carbon dioxide in exhaust gas, wherein a liquid absorbent (116) jetted from a liquid absorbent jetting part (101) comes into gas-liquid contact with exhaust gas (114) flowing through a packing (102) from the lower side to the upper side to absorb the carbon dioxide contained in the exhaust gas (114). The flow of the liquid absorbent (116) in a deposition vessel (11) conditioned to a specified pH value is stopped to deposit insoluble compounds as the reaction product of the liquid absorbent (116) against the carbon dioxide, and the carbon dioxide is collected as the insoluble compounds. Thus, the carbon dioxide can be removed from the liquid absorbent which absorbed the carbon dioxide without using steam from a power generating boiler.
    • 一种用于回收废气中二氧化碳的系统和方法,其中从液体吸收剂喷射部分(101)喷射的液体吸收剂(116)与流过填料(102)的废气(114)气液接触, 从下侧到上侧吸收废气(114)中所含的二氧化碳。 停止调节至特定pH值的沉积容器(11)中的液体吸收剂(116)的流动,以将液体吸收剂(116)与二氧化碳的反应产物沉积在不溶性化合物中,并收集二氧化碳 作为不溶性化合物。 因此,可以从吸收二氧化碳的液体吸收剂中除去二氧化碳,而不使用来自发电锅炉的蒸汽。
    • 30. 发明授权
    • Method of manufacturing semiconductor device
    • 制造半导体器件的方法
    • US6045981A
    • 2000-04-04
    • US19925
    • 1998-02-06
    • Kentaro MatsunagaAkiko MimotogiShoji MimotogiSoichi Inoue
    • Kentaro MatsunagaAkiko MimotogiShoji MimotogiSoichi Inoue
    • G03F7/26G03F7/38H01L21/027G03F7/00
    • G03F7/265G03F7/38
    • A method of manufacturing a semiconductor device, which comprises the steps of, selectively silylating a photosensitive resin film by exposing the photosensitive resin film according to an exposure pattern thereby to form a silylated portion having a glass transition temperature which is lower than that of the photosensitive resin film and at the same time exposing the photosensitive resin film to an intermediate temperature between the glass transition temperature of the silylated portion and the glass transition temperature of the photosensitive resin film thereby fluidizing the silylated portion so as to cover a portion of the photosensitive resin film neighboring the silylated portion with the fluidized silylated portion, and developing the photosensitive resin film by making use of the silylated portion and the portion of photosensitive resin film covered by the fluidized silylated portion as a mask.
    • 一种制造半导体器件的方法,其包括以下步骤:通过根据曝光图案曝光感光性树脂膜来选择性地使感光性树脂膜甲硅烷化,从而形成玻璃化转变温度低于光敏树脂膜的甲硅烷基化部分 同时使感光性树脂膜暴露于甲硅烷基化部分的玻璃化转变温度与感光性树脂膜的玻璃化转变温度之间的中间温度,由此使甲硅烷基化部分流化,从而覆盖一部分感光性树脂 膜与甲硅烷基化部分相邻,并且通过使用甲硅烷基化部分和被流化的甲硅烷基化部分覆盖的部分感光树脂膜作为掩模来显影感光树脂膜。