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    • 22. 发明授权
    • Foreign material contamination detection
    • 异物污染检测
    • US08328950B2
    • 2012-12-11
    • US12783702
    • 2010-05-20
    • Robert J. BasemanTomasz J. Nowicki
    • Robert J. BasemanTomasz J. Nowicki
    • B08B7/04
    • B08B13/00H01L21/67288Y10T436/11
    • There are provided a system, method and computer program product for detecting foreign materials in a semiconductor manufacturing process. The manufacturing process uses a plurality of semiconductor manufacturing tools. The system categorizes at least one monitoring wafer according to one or more categories. The system supplies the categorized monitoring wafer to a semiconductor manufacturing tool. The system observes a level of contamination on the categorized monitoring wafer. The system compares the level of contamination to a threshold. The system cleans the tool in a response to determining that the level of contamination is larger than the threshold. The system determines which category of the wafer leaves a highest level of contamination on the tool. The system identifies a root cause of the highest level of contamination on the tool.
    • 提供了一种用于在半导体制造工艺中检测异物的系统,方法和计算机程序产品。 制造工艺使用多个半导体制造工具。 该系统根据一个或多个类别对至少一个监视晶片进行分类。 该系统将分类的监控晶片提供给半导体制造工具。 该系统观察到分类监控晶片的污染程度。 系统将污染水平与阈值进行比较。 系统在响应中清洁工具以确定污染物的水平大于阈值。 该系统确定哪个类别的晶片在工具上留下最高的污染水平。 系统识别工具上最高污染水平的根本原因。
    • 25. 发明授权
    • Vapor drain system
    • 蒸气排放系统
    • US5346518A
    • 1994-09-13
    • US35999
    • 1993-03-23
    • Robert J. BasemanCharles A. BrownBenjamin N. EldridgeLaura B. RothmanHerman R. WendtJames T. YehArthur R. Zingher
    • Robert J. BasemanCharles A. BrownBenjamin N. EldridgeLaura B. RothmanHerman R. WendtJames T. YehArthur R. Zingher
    • B65D85/86B65G1/00H01L21/673H01L21/677B65B5/00B65D81/26B65D85/62F17C11/00
    • H01L21/67366B65G1/00H01L21/67393
    • During wafer fabrication, a transportable enclosure, such as a Standard Manufacturing InterFace (SMIF) pod encloses a nascent product, such as a semiconductor wafer, to protect the wafer against contamination during manufacture, storage or transportation. However chemical vapors emitted inside the pod can accumulate in the air and degrade wafers during subsequent fabrication. In order to absorb the vapors inside a closed pod, a vapor removal element typically including an activated carbon absorber, covered by a particulate-filtering vapor-permeable barrier, and covered by a guard plate with holes is disposed within the enclosure. A vapor removal element is disposed closely adjacent to each respective wafer. Alternatively, a single vapor removal element is located inside the enclosure. In certain instances, a fan or thermo-buoyant circulation causes any vapors located inside the enclosure to a vapor removal element for removal. Alternatively a porous vapor removal element may be disposed for removing vapors from air entering the enclosure. In another embodiment a vapor removal element is integrated with the back face of each wafer.
    • 在晶片制造期间,诸如标准制造界面(SMIF)的可移动外壳包围新生产品,例如半导体晶片,以在制造,存储或运输期间保护晶片免受污染。 然而,发射在荚内的化学气体可能积聚在空气中,并在随后的制造过程中降解晶片。 为了吸收封闭的容器内的蒸气,通常包括活性炭吸收器的蒸气去除元件被覆盖有颗粒过滤蒸气可透过的屏障并被具有孔的保护板覆盖。 蒸汽去除元件被设置为紧邻每个相应的晶片。 或者,单个蒸气去除元件位于外壳内。 在某些情况下,风扇或热浮动循环使得位于外壳内部的任何蒸气成为除去蒸气的元件。 或者,可以设置多孔蒸气去除元件以从进入外壳的空气中除去蒸汽。 在另一个实施例中,蒸气去除元件与每个晶片的背面一体化。