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    • 23. 发明申请
    • METHOD FOR MANUFACTURING A GATE-CONTROL DIODE SEMICONDUCTOR MEMORY DEVICE
    • 制造门控二极管半导体存储器件的方法
    • US20130178014A1
    • 2013-07-11
    • US13535032
    • 2012-06-27
    • Pengfei WangXiaoyong LiuQingqing SunWei Zhang
    • Pengfei WangXiaoyong LiuQingqing SunWei Zhang
    • H01L21/441
    • H01L29/7391H01L29/8616
    • This invention belongs to semiconductor device manufacturing field and discloses a method for manufacturing a gate-control diode semiconductor storage device. When the floating gate voltage is relatively high, the channel under the floating gate is of n type and a simple gate-control pn junction structure is configured; by controlling effective n-type concentration of the ZnO film through back-gate control, inverting the n-type ZnO into p-type through a floating gate and using NiO as a p-type semiconductor, an n-p-n-p doping structure is formed while the quantity of charges in the floating gate determines the device threshold voltage, thus realizing memory functions. This invention features capacity of manufacturing gate-control diode memory devices able to reduce the chip power consumption through advantages of high driving current and small sub-threshold swing. This invention is applicable to semiconductor devices manufacturing based on flexible substrate and flat panel displays and floating gate memories, etc.
    • 本发明属于半导体器件制造领域,并且公开了一种用于制造栅极控制二极管半导体存储器件的方法。 当浮动栅极电压相对较高时,浮动栅极下的沟道为n型,并配置了简单的栅极控制pn结结构; 通过背栅控制来控制ZnO膜的有效n型浓度,通过浮栅将n型ZnO反向为p型,并使用NiO作为p型半导体,形成npnp掺杂结构, 浮动门中的电荷决定了器件的阈值电压,从而实现了存储器的功能。 本发明具有制造栅极控制二极管存储器件的能力,其能够通过高驱动电流和小的次级阈值摆动的优点来降低芯片功耗。 本发明适用于基于柔性基板和平板显示器和浮动栅极存储器等的半导体器件制造。
    • 24. 发明授权
    • Method for manufacturing a gate-control diode semiconductor memory device
    • 栅极控制二极管半导体存储器件的制造方法
    • US08426271B1
    • 2013-04-23
    • US13534998
    • 2012-06-27
    • Pengfei WangChengwei CaoQingqing SunWei Zhang
    • Pengfei WangChengwei CaoQingqing SunWei Zhang
    • H01L21/336
    • H01L29/7781H01L29/66825H01L29/788
    • This invention belongs to semiconductor device manufacturing field and discloses a method for manufacturing a gate-control diode semiconductor storage device. When the floating gate voltage is relatively high, the channel under the floating gate is of n type and the device is of a simple gate-control pn junction structure; by controlling effective n-type concentration of the ZnO film through back-gate control, inverting the n-type ZnO into p-type through the floating gate and using NiO as a p-type semiconductor, an n-p-n-p doping structure is formed. The quantity of charges in the floating gate determines the device threshold voltage, thus realizing the memory functions. This invention features capacity of manufacturing memory devices able to reduce the chip power consumption through advantages of high driving current and small sub threshold swing, is applicable to semiconductor memory devices manufacturing based on flexible substrates and flat panel displays and floating gate memories, etc.
    • 本发明属于半导体器件制造领域,并且公开了一种用于制造栅极控制二极管半导体存储器件的方法。 当浮动栅极电压相对较高时,浮动栅极下的沟道为n型,器件具有简单的栅极控制pn结结构; 通过背栅控制来控制ZnO膜的有效n型浓度,通过浮栅将n型ZnO反转为p型,并使用NiO作为p型半导体,形成n-p-n-p掺杂结构。 浮栅中的电荷量决定了器件的阈值电压,从而实现了存储器的功能。 本发明特征在于能够通过高驱动电流和小次阈值摆动的优点来制造能够降低芯片功耗的存储器件的能力,可应用于基于柔性基板和平板显示器以及浮动栅极存储器等的半导体存储器件制造。
    • 26. 发明申请
    • SEMICONDUCTOR MEMORY STRUCTURE AND CONTROL METHOD THEREOF
    • 半导体存储器结构及其控制方法
    • US20140003122A1
    • 2014-01-02
    • US13501833
    • 2011-08-15
    • Pengfei WangQingqing SunWei Zhang
    • Pengfei WangQingqing SunWei Zhang
    • G11C13/00
    • G11C13/0002G11C13/0004G11C13/0007G11C2213/79H01L27/2454H01L45/04
    • The present invention belongs to the technical field of non-volatile semiconductor memories, and relates to a semiconductor memory structure and a control method thereof. The semiconductor memory structure in the present invention comprises a memory unit for storing information and a tunneling field-effect transistor connected with the memory unit. The tunneling field-effect transistor is used for controlling the semiconductor memory's operations such as erasing, writing, and reading. A plurality of semiconductor memory structures compose a semiconductor memory array. The control method provided by the present invention comprises steps of resetting, setting, and reading. A vertical gate-controlled diode structure in a tunneling field-effect transistor is capable of providing a large current for writing a resistive random access memory and a phase change memory and improving the density of the memory array and therefore is very suitable for use in manufacturing of semiconductor memory chips; besides, the control method and the control circuit thereof are simple.
    • 本发明属于非易失性半导体存储器的技术领域,涉及一种半导体存储器结构及其控制方法。 本发明的半导体存储器结构包括用于存储信息的存储单元和与存储单元连接的隧道场效应晶体管。 隧道场效应晶体管用于控制半导体存储器的操作,例如擦除,写入和读取。 多个半导体存储器结构构成半导体存储器阵列。 本发明提供的控制方法包括复位,设定和读取的步骤。 隧道场效应晶体管中的垂直栅极控制二极管结构能够提供用于写入电阻随机存取存储器和相变存储器的大电流,并且提高存储器阵列的密度,因此非常适合用于制造 的半导体存储芯片; 此外,控制方法及其控制电路简单。
    • 28. 发明申请
    • METHOD FOR MANUFACTURING A GATE-CONTROL DIODE SEMICONDUCTOR DEVICE
    • 制造门控二极管半导体器件的方法
    • US20130178012A1
    • 2013-07-11
    • US13534973
    • 2012-06-27
    • Pengfei WangXiaoyong LiuQingqing SunWei Zhang
    • Pengfei WangXiaoyong LiuQingqing SunWei Zhang
    • H01L21/336
    • H01L29/7391H01L29/267H01L29/66356
    • This invention belongs to semiconductor device manufacturing field and discloses a method for manufacturing a gate-control diode semiconductor device. When the gate voltage is relatively high, the channel under the gate is of n-type and the device is of a simple gate-control pn junction structure; by way of controlling the effective n-type concentration of the ZnO film through back-gate control, inverting the n-type ZnO into p-type through the gate, and using NiO as a p-type semiconductor, an n-p-n-p doping structure is formed. The method features capacity of manufacturing gate-control diode devices able to reduce chip power consumption through the advantages of high driving current and small sub-threshold swing. The present invention using a low temperature process production is especially applicable to the manufacturing of semiconductor devices based on flexible substrates and reading & writing devices that have a flat panel display and phase change memory.
    • 本发明属于半导体器件制造领域,并且公开了一种用于制造栅极控制二极管半导体器件的方法。 当栅极电压相对较高时,栅极下的沟道为n型,器件具有简单的栅极控制pn结结构; 通过背栅控制来控制ZnO膜的有效n型浓度,通过栅极将n型ZnO转换为p型,并且使用NiO作为p型半导体,形成npnp掺杂结构 。 该方法具有制造栅极控制二极管器件的能力,能够通过高驱动电流和小次阈值摆幅的优点降低芯片功耗。 使用低温工艺生产的本发明特别适用于基于柔性基板和具有平板显示器和相变存储器的读写装置的半导体器件的制造。
    • 29. 发明申请
    • NiO-based Resistive Random Access Memory and the Preparation Method Thereof
    • 基于NiO的电阻随机存取存储器及其制备方法
    • US20120305882A1
    • 2012-12-06
    • US13498973
    • 2011-09-23
    • Jingjing GuQingqing SunPengfei WangPeng ZhouWei Zhang
    • Jingjing GuQingqing SunPengfei WangPeng ZhouWei Zhang
    • H01L45/00H01L21/02
    • H01L45/146G11C13/0007H01L45/06H01L45/16
    • The present invention belongs to the technical field of memory storage and specially relates to a NiO-based resistive random access memory system (RRAM) and a preparation method thereof. The RRAM is comprised of a substrate and a metal-insulator-metal (MIM) structure, wherein the electrodes are metal films, such as copper, aluminum, etc., capable of being applied to the interconnection process, and the resistive switching insulator is an Al2O3/NiO/Al2O3 laminated dielectric film. The MIM structure in the invention shows stable switching between the bi-stable resistance states as well as memory features; compared with the RRAM that only uses a single NiO-based dielectric film, the storage window is increased, and the resistance stability is improved. Therefore, the NiO-based RRAM has a good prospect in actual application. The present invention further provides a method for preparing the abovementioned memory storage system.
    • 本发明属于存储器的技术领域,特别涉及一种基于NiO的电阻随机存取存储器(RRAM)及其制备方法。 RRAM由衬底和金属 - 绝缘体 - 金属(MIM)结构构成,其中电极是可应用于互连工艺的金属膜,例如铜,铝等,并且电阻式开关绝缘子是 Al2O3 / NiO / Al2O3层压电介质膜。 本发明的MIM结构显示了稳定的电阻状态和存储特征之间的稳定切换; 与仅使用单个NiO基电介质膜的RRAM相比,存储窗口增加,并且电阻稳定性得到改善。 因此,基于NiO的RRAM在实际应用中具有良好的前景。 本发明还提供了一种用于制备上述存储器存储系统的方法。