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21. 发明授权

US06488985B1 Thin film, method and apparatus for forming the same, and electronic component incorporating the same 有权
标题翻译：薄膜，其形成方法和装置以及包含该薄膜的电子部件
公开(公告)号：US06488985B1
公开(公告)日：2002-12-03
申请号：US09605339
申请日：2000-06-28
申请人： Kazuyoshi Honda , Masaru Odagiri , Kiyoshi Takahashi , Noriyasu Echigo , Nobuki Sunagare
发明人： Kazuyoshi Honda , Masaru Odagiri , Kiyoshi Takahashi , Noriyasu Echigo , Nobuki Sunagare
IPC分类号： C23C16448
CPC分类号： B05D1/60 , B05B17/04 , C23C14/246 , C23C14/562 , G11B5/85
摘要： A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.
摘要翻译：一种形成薄膜的方法包括以下步骤：将液体形式的沉积材料供应到加热的表面上; 当沉积材料正在运动时，加热和蒸发加热表面上的沉积材料; 以及将沉积材料沉积到沉积表面上。将沉积材料供应到被蒸发的沉积材料未到达沉积表面的被加热表面的位置。

22. 发明授权

US06475571B1 Method of producing thin resin films 失效
标题翻译：薄树脂薄膜的制造方法
公开(公告)号：US06475571B1
公开(公告)日：2002-11-05
申请号：US09830538
申请日：2001-07-06
申请人： Noriyasu Echigo , Kazuyoshi Honda , Masaru Odagiri , Nobuki Sunagare , Toru Miyake , Tomonori Sato
发明人： Noriyasu Echigo , Kazuyoshi Honda , Masaru Odagiri , Nobuki Sunagare , Toru Miyake , Tomonori Sato
IPC分类号： B05D104
CPC分类号： B05D1/60 , B05B7/0012 , B05B13/0207 , B05B13/0228 , B05B17/0623 , B05B17/063 , B29C41/26 , G11B5/73 , H01G4/18
摘要： A method for manufacturing a resin thin film of the present invention includes supplying a liquid resin material and a gas to a two-fluid nozzle by pressure; ejecting the resin material in the form of atomized particles toward a heating member by the two-fluid nozzle, thereby adhering the resin material to the heating member; or mixing a liquid resin material with a gas; ejecting the resin material in form of atomized particles toward a heating member that is provided under reduced pressure, thereby adhering the resin material to the heating member; and evaporating the resin material on the heating member to obtain the evaporated resin material. Thus, the present invention can provide a resin thin film having a uniform thickness stably with simple means at a low cost. The resin thin film obtained by the present invention can be used in a wide range, for example a magnetic recording medium such as a magnetic tape, a wrapping material, and an electronic component.
摘要翻译：本发明的树脂薄膜的制造方法包括：通过压力将液体树脂材料和气体供给到双流体喷嘴; 通过双流体喷嘴将雾化颗粒形式的树脂材料喷射到加热构件，从而将树脂材料粘附到加热构件; 或将液体树脂材料与气体混合; 将以雾化颗粒的形式的树脂材料朝向减压设置的加热构件喷射，从而将树脂材料粘附到加热构件; 并蒸发加热部件上的树脂材料，得到蒸发的树脂材料。因此，本发明可以以简单的方式以低成本稳定地提供具有均匀厚度的树脂薄膜。通过本发明获得的树脂薄膜可以在宽范围内使用，例如磁记录介质，例如磁带，包装材料和电子部件。

23. 发明授权

US06388865B1 Laminate and capacitor 有权
标题翻译：层压板和电容器
公开(公告)号：US06388865B1
公开(公告)日：2002-05-14
申请号：US09554582
申请日：2000-05-16
申请人： Kazuyoshi Honda , Noriyasu Echigo , Masaru Odagiri , Nobuki Sunagare , Shinichi Suzawa
发明人： Kazuyoshi Honda , Noriyasu Echigo , Masaru Odagiri , Nobuki Sunagare , Shinichi Suzawa
IPC分类号： H01G406
CPC分类号： H01G4/30
摘要： A layered product including a plurality of deposition units, each having a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.
摘要翻译：包括多个沉积单元的分层产品，每个沉积单元具有薄树脂层和薄金属层，其中薄树脂层的表面粗糙度为0.1μm或更小，突起形成组分不添加到薄树脂层或薄金属层的表面粗糙度为0.1μm以下。无论层叠体的厚度如何，表面特性均有所提高，因层叠体不含异物，能够满足高性能薄膜的要求。层叠体适用于电子部件，例如电容器，特别是片状电容器。

24. 发明授权

US6153259A Thin film, method and apparatus for forming the same, and electronic component incorporating the same 失效
公开(公告)号：US6153259A
公开(公告)日：2000-11-28
申请号：US859504
申请日：1997-05-20
申请人： Kazuyoshi Honda , Masaru Odagiri , Kiyoshi Takahashi , Noriyasu Echigo , Nobuki Sunagare
发明人： Kazuyoshi Honda , Masaru Odagiri , Kiyoshi Takahashi , Noriyasu Echigo , Nobuki Sunagare
IPC分类号： B05B17/04 , B05D7/24 , C23C14/24 , C23C14/56 , G11B5/85
CPC分类号： B05D1/60 , B05B17/04 , C23C14/246 , C23C14/562 , G11B5/85
摘要： A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.

25. 发明授权

US07118984B2 Method for fabricating semiconductor component 有权
标题翻译：制造半导体元件的方法
公开(公告)号：US07118984B2
公开(公告)日：2006-10-10
申请号：US10368132
申请日：2003-02-14
申请人： Kazuyoshi Honda , Noriyasu Echigo , Masaru Odagiri , Takanori Sugimoto
发明人： Kazuyoshi Honda , Noriyasu Echigo , Masaru Odagiri , Takanori Sugimoto
IPC分类号： H01L21/20
CPC分类号： H01G4/33 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L2224/16 , H01L2924/15311 , H01L2924/3011 , H05K1/0231 , H05K1/0289 , H05K1/141 , H05K1/162 , H05K3/0026 , H05K3/403 , H05K3/467 , H05K2201/0179 , H05K2201/049 , H05K2201/09236 , H05K2201/10734
摘要： Electrode layers (1, 2) are arranged on both sides of a dielectric layer (3) facing each other so as to configure a capacitor. Lead electrodes (4, 5) are formed in the electrode layers (1, 2). A penetrating electrode (6) that is insulated from the electrode layers (1, 2) is formed. An electronic component (10) configured in this manner is mounted on a wiring board, and a semiconductor chip can be mounted thereon. Along with connecting the semiconductor chip to the wiring board via the penetrating electrode (6), the semiconductor chip or the wiring board is connected to the lead electrodes (4, 5). In this manner, while suppressing the size increase of a mounted area, the capacitor or the like can be arranged near the semiconductor chip. Thus, the semiconductor chip is driven with high frequency more easily.
摘要翻译：电极层（1,2）布置在相互面对的介质层（3）的两侧，以构成电容器。在电极层（1,2）中形成引线电极（4,5）。形成与电极层（1,2）绝缘的穿透电极（6）。以这种方式配置的电子部件（10）安装在布线板上，并且可以在其上安装半导体芯片。通过穿透电极（6）将半导体芯片与布线板连接，半导体芯片或布线基板与引线电极（4,5）连接。以这种方式，在抑制安装区域的尺寸增加的同时，电容器等可以布置在半导体芯片附近。因此，更容易地以高频率驱动半导体芯片。

26. 发明申请

US20060292813A1 Electronic component and method for manufacturing the same 审中-公开
标题翻译：电子元件及其制造方法
公开(公告)号：US20060292813A1
公开(公告)日：2006-12-28
申请号：US11494327
申请日：2006-07-27
申请人： Kazuyoshi Honda , Noriyasu Echigo , Masaru Odagiri , Takanori Sugimoto
发明人： Kazuyoshi Honda , Noriyasu Echigo , Masaru Odagiri , Takanori Sugimoto
IPC分类号： H01L21/20
CPC分类号： H01G4/33 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L2224/16 , H01L2924/15311 , H01L2924/3011 , H05K1/0231 , H05K1/0289 , H05K1/141 , H05K1/162 , H05K3/0026 , H05K3/403 , H05K3/467 , H05K2201/0179 , H05K2201/049 , H05K2201/09236 , H05K2201/10734
摘要： Electrode layers (1, 2) are arranged on both sides of a dielectric layer (3) facing each other so as to configure a capacitor. Lead electrodes (4, 5) are formed in the electrode layers (1, 2). A penetrating electrode (6) that is insulated from the electrode layers (1, 2) is formed. An electronic component (10) configured in this manner is mounted on a wiring board, and a semiconductor chip can be mounted thereon. Along with connecting the semiconductor chip to the wiring board via the penetrating electrode (6), the semiconductor chip or the wiring board is connected to the lead electrodes (4, 5). In this manner, while suppressing the size increase of a mounted area, the capacitor or the like can be arranged near the semiconductor chip. Thus, the semiconductor chip is driven with high frequency more easily.
摘要翻译：电极层（1,2）布置在相互面对的介质层（3）的两侧，以构成电容器。在电极层（1,2）中形成引线电极（4,5）。形成与电极层（1,2）绝缘的穿透电极（6）。以这种方式配置的电子部件（10）安装在布线板上，并且可以在其上安装半导体芯片。通过穿透电极（6）将半导体芯片与布线板连接，半导体芯片或布线基板与引线电极（4,5）连接。以这种方式，在抑制安装区域的尺寸增加的同时，电容器等可以布置在半导体芯片附近。因此，更容易地以高频率驱动半导体芯片。

27. 发明授权

US06574087B1 Electronic device and manufacture thereof 有权
标题翻译：电子设备及其制造
公开(公告)号：US06574087B1
公开(公告)日：2003-06-03
申请号：US09720279
申请日：2000-12-21
申请人： Kazuyoshi Honda , Noriyasu Echigo , Masaru Odagiri , Takanori Sugimoto
发明人： Kazuyoshi Honda , Noriyasu Echigo , Masaru Odagiri , Takanori Sugimoto
IPC分类号： H01G4005
CPC分类号： H01G4/33 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L2224/16 , H01L2924/15311 , H01L2924/3011 , H05K1/0231 , H05K1/0289 , H05K1/141 , H05K1/162 , H05K3/0026 , H05K3/403 , H05K3/467 , H05K2201/0179 , H05K2201/049 , H05K2201/09236 , H05K2201/10734
摘要： Electrode layers (1, 2) are arranged on both sides of a dielectric layer (3) facing each other so as to configure a capacitor. Lead electrodes (4, 5) are formed in the electrode layers (1, 2). A penetrating electrode (6) that is insulated from the electrode layers (1, 2) is formed. An electronic component (10) configured in this manner is mounted on a wiring board, and a semiconductor chip can be mounted thereon. Along with connecting the semiconductor chip to the wiring board via the penetrating electrode (6), the semiconductor chip or the wiring board is connected to the lead electrodes (4, 5). In this manner, while suppressing the size increase of a mounted area, the capacitor or the like can be arranged near the semiconductor chip. Thus, the semiconductor chip is driven with high frequency more easily.
摘要翻译：电极层（1,2）布置在相互面对的介质层（3）的两侧，以构成电容器。在电极层（1,2）中形成引线电极（4,5）。形成与电极层（1,2）绝缘的穿透电极（6）。以这种方式配置的电子部件（10）安装在布线板上，并且可以在其上安装半导体芯片。通过穿透电极（6）将半导体芯片与布线板连接，半导体芯片或布线基板与引线电极（4,5）连接。以这种方式，在抑制安装区域的尺寸增加的同时，电容器等可以布置在半导体芯片附近。因此，更容易地以高频率驱动半导体芯片。

28. 发明申请

US20050129860A1 Method and apparatus for preparing thin resin film 审中-公开
标题翻译：制备薄树脂膜的方法和设备
公开(公告)号：US20050129860A1
公开(公告)日：2005-06-16
申请号：US10480347
申请日：2003-04-02
申请人： Noriyasu Echigo , Hiroshi Satani , Hideki Okumura , Hisaaki Tachihara
发明人： Noriyasu Echigo , Hiroshi Satani , Hideki Okumura , Hisaaki Tachihara
IPC分类号： B05D7/24 , C23C14/12 , C23C14/24 , H01G4/14 , H01L51/52 , B05D3/02 , B05C5/00 , B05D1/02 , B67B7/00
CPC分类号： H01G4/145 , B05D1/60 , C23C14/12 , C23C14/246 , H01L51/5256
摘要： A liquid resin material stored in a resin material cup is sent to a supply tank under pressure through a primary side supply pipe by increasing the pressure in a pressure tank. The supply tank is provided with a piston that is displaced in accordance with the amount of the resin material in the supply tank, and the resin material is quantified by the stroke of the piston. The quantified resin material is sent to a heating member through an evaporation side supply pipe, is evaporated by heating, and condenses on a substrate. The resin material is quantified by filling the supply tank with the resin material temporarily, and only the filling resin material is sent to the heating member. Therefore, an evaporation amount becomes constant, and as a result, the thickness of a resin thin film is stabilized.
摘要翻译：通过增加压力罐中的压力，将储存在树脂材料杯中的液态树脂材料通过初级侧供给管在压力下送入供给箱。供应罐设有根据供应罐中的树脂材料量移动的活塞，并且树脂材料由活塞的行程量化。定量树脂材料通过蒸发侧供应管送到加热件，通过加热蒸发，并在基材上冷凝。树脂材料通过临时填充供给槽与树脂材料进行定量，仅将填充树脂材料送至加热部件。因此，蒸发量变得恒定，结果树脂薄膜的厚度稳定。

29. 发明授权

US5670107A Method for producing magnetic recording medium 失效
标题翻译：磁记录介质的制造方法
公开(公告)号：US5670107A
公开(公告)日：1997-09-23
申请号：US554243
申请日：1995-11-08
申请人： Kenji Kuwahara , Kiyosi Takahasi , Hideyuki Ueda , Noriyasu Echigo , Mikio Murai , Masaru Odagiri
发明人： Kenji Kuwahara , Kiyosi Takahasi , Hideyuki Ueda , Noriyasu Echigo , Mikio Murai , Masaru Odagiri
IPC分类号： G11B5/84 , B29C71/02
CPC分类号： G11B5/84 , G11B5/8404
摘要： A magnetic recording medium produced by treating a magnetic recording medium which comprises a non-magnetic substrate and a magnetic layer formed on said substrate in an atmosphere kept at a temperature of at least 50.degree. C., with applying a tension of 1 gf. or less per 10 mm width to said magnetic recording medium in a treating time which is in a range on or above a line having a slope of at least 5000 in terms of .DELTA.ln(L)/.DELTA.(1/T) and passing a point of 0.5 second at 100.degree. C., when ln(L) is Arrhenius plotted against an inverse of an absolute temperature T (1/T), which medium has suppressed change of magnetic properties with time and improved corrosion resistance.
摘要翻译：通过在保持在至少50℃的温度的气氛中，施加1gf的张力处理包括非磁性基底和形成在所述基底上的磁性层的磁记录介质而制备的磁记录介质。处理时间在DELTA ln（L）/ DELTA（1 / T）的斜率至少为5000的线上或上方的范围内的处理时间内，通过点在100℃为0.5秒，当ln（L）是Arrhenius相对于绝对温度T（1 / T）的倒数绘制时，该介质已经抑制磁性随时间的变化和改善的耐腐蚀性。

30. 发明申请

US20080211408A1 Plasma Display Panel and Method for Manufacturing Same 审中-公开
标题翻译：等离子显示面板及其制造方法
公开(公告)号：US20080211408A1
公开(公告)日：2008-09-04
申请号：US11572902
申请日：2005-08-11
申请人： Hiroyuki Yamakita , Masatoshi Kitagawa , Mikihiko Nishitani , Noriyasu Echigo , Tomohiro Okumura , Hiroaki Ishio , Hikaru Nishitani
发明人： Hiroyuki Yamakita , Masatoshi Kitagawa , Mikihiko Nishitani , Noriyasu Echigo , Tomohiro Okumura , Hiroaki Ishio , Hikaru Nishitani
IPC分类号： H01J17/49 , H01J9/02
CPC分类号： H01J11/12 , H01J9/261 , H01J11/48
摘要： An object of the present invention is to provide a plasma display panel and a manufacturing method thereof that can prevent a dielectric layer and a protective layer from being deteriorated and give excellent image display performance, by performing a sealing process effectively. The object can be realized by a plasma display panel including a front panel 10 and a back panel 11 arranged in opposing to each other at a certain gap, the front panel and the back panel being sealed by a sealing layer 17 that is provided on entire peripheral portions of main surfaces of the front panel and the back panel, and the sealing layer is composed of at least one material selected from the group consisting of an organic resin material, an inorganic material, and a metal material (more specifically, a silica material as a main component and an epoxy resin material).
摘要翻译：本发明的目的在于提供一种通过有效地进行密封处理，可以防止电介质层和保护层劣化并且具有优异的图像显示性能的等离子体显示面板及其制造方法。该目的可以通过等离子体显示面板来实现，该等离子体显示面板包括以一定间隙彼此相对布置的前面板10和后面板11，前面板和背面面板被设置在整体上的密封层17密封前面板和后面板的主表面的周边部分和密封层由选自有机树脂材料，无机材料和金属材料（更具体地，二氧化硅）中的至少一种材料组成材料作为主要成分和环氧树脂材料）。

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