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    • 22. 发明授权
    • Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus
    • 多层结构形成方法,布线基板的制造方法以及电子设备的制造方法
    • US07723243B2
    • 2010-05-25
    • US11707022
    • 2007-02-16
    • Tsuyoshi ShintateToshiaki MikoshibaKenji WadaKazuaki SakuradaJun Yamada
    • Tsuyoshi ShintateToshiaki MikoshibaKenji WadaKazuaki SakuradaJun Yamada
    • H01L21/31
    • H05K3/4664H05K3/125H05K2203/013Y10S257/921
    • There is provided a multi-layered structure forming method comprising: (A) forming a first insulating material layer containing a first photo-curing material on a substrate; (B) semi-hardening the first insulating material layer by radiating light having a first wavelength to the first insulating material layer; (C) forming a conductive material layer on the semi-hardened first insulating material layer by ejecting droplets of a conductive material to the semi-hardened first insulating material layer from a nozzle of a liquid droplet ejecting apparatus; (D) forming a second insulating material layer containing a second photo-curing material so as to cover the semi-hardened first insulating material layer and the conductive material layer; and (E) forming a first insulating layer, a conductive layer positioned on the first insulating material, and a second insulating layer covering the first insulating layer and the conductive layer by simultaneously heating the first insulating material layer, the conductive material layer, and the second insulating material layer.
    • 提供一种多层结构形成方法,包括:(A)在基板上形成含有第一光固化材料的第一绝缘材料层; (B)通过向第一绝缘材料层照射具有第一波长的光而使第一绝缘材料层半硬化; (C)通过从液滴喷射装置的喷嘴向半硬化的第一绝缘材料层喷射导电材料的液滴,在半硬化的第一绝缘材料层上形成导电材料层; (D)形成包含第二光固化材料的第二绝缘材料层以覆盖半硬化的第一绝缘材料层和导电材料层; 和(E)形成第一绝缘层,位于第一绝缘材料上的导电层和通过同时加热第一绝缘材料层,导电材料层和覆盖第一绝缘层和导电层的第二绝缘层 第二绝缘材料层。
    • 26. 发明申请
    • System and methods for manufacturing a liquid crystal device
    • 制造液晶装置的系统和方法
    • US20070204795A1
    • 2007-09-06
    • US11797334
    • 2007-05-02
    • Kazuaki Sakurada
    • Kazuaki Sakurada
    • B05B3/00B05C5/02
    • H01L21/6715Y10T428/10Y10T428/1023
    • The invention provides a thin-film forming device, a thin-film forming method, a device for manufacturing a liquid crystal display, a method for manufacturing a liquid crystal display, a device for manufacturing a thin-film structure, a method for a thin-film structure, a liquid crystal display, a thin-film structure, and an electronic apparatus, objects are to achieve easy control of thickness of a thin film without using rotation means, cost reduction, and miniaturization of the devices. The thin-film forming device for forming a thin film by applying a coating solution onto a substrate, there can be provided an ejection mechanism having a droplet ejection head for ejecting the coating solution onto the substrate, a moving mechanism capable of relatively moving the positions of the droplet ejection head and the substrate, and a control unit for controlling at least one of the ejection mechanism and the moving mechanism. As a result, the control unit described above can control the thickness of the thin film by changing the coating conditions of the coating solution L by controlling at least one of an ejection operation by the ejection mechanism and a moving operation by the moving mechanism.
    • 本发明提供一种薄膜形成装置,薄膜​​形成方法,液晶显示器的制造装置,液晶显示器的制造方法,薄膜结构的制造装置,薄的方法 膜结构,液晶显示器,薄膜结构和电子设备,目的是在不使用旋转装置的情况下实现薄膜厚度的容易控制,成本降低和设备的小型化。 通过将涂布溶液涂布在基材上形成薄膜的薄膜形成装置,可以提供一种具有用于将涂布液喷射到基材上的液滴喷射头的喷射机构,能够相对移动位置的移动机构 的液滴喷射头和基板,以及用于控制喷射机构和移动机构中的至少一个的控制单元。 结果,上述控制单元可以通过控制喷射机构的排出操作和移动机构的移动操作中的至少一个来改变涂布液L的涂覆条件来控制薄膜的厚度。