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    • 21. 发明申请
    • SEMICONDUCTOR LIGHT EMITTING DEVICE
    • 半导体发光器件
    • US20120061713A1
    • 2012-03-15
    • US13222912
    • 2011-08-31
    • Koichi TachibanaShigeya KimuraToshiki HikosakaTaisuke SatoToshiyuki OkaShinya Nunoue
    • Koichi TachibanaShigeya KimuraToshiki HikosakaTaisuke SatoToshiyuki OkaShinya Nunoue
    • H01L33/42
    • H01L33/42
    • According to one embodiment, a semiconductor light emitting device includes: a stacked structure body, first and second electrodes, and a pad layer. The body includes first semiconductor layer of a first conductivity type, a light emitting layer, and a second semiconductor layer of second conductivity type. The first semiconductor layer has first and second portions. The light emitting layer is provided on the second portion. The second semiconductor layer is provided on the light emitting layer. The first electrode is provided on the first portion. The second electrode is provided on the second semiconductor layer and is transmittable to light emitted from the light emitting layer. The pad layer is connected to the second electrode. A transmittance of the pad layer is lower than that of the second electrode. A sheet resistance of the second electrode increases continuously along a direction from the pad layer toward the first electrode.
    • 根据一个实施例,半导体发光器件包括:堆叠结构体,第一和第二电极以及衬垫层。 主体包括第一导电类型的第一半导体层,发光层和第二导电类型的第二半导体层。 第一半导体层具有第一和第二部分。 发光层设置在第二部分上。 第二半导体层设置在发光层上。 第一电极设置在第一部分上。 第二电极设置在第二半导体层上,并且可透射到从发光层发射的光。 焊盘层连接到第二电极。 焊盘层的透射率低于第二电极的透射率。 第二电极的薄层电阻沿着从衬垫层向第一电极的方向连续地增加。
    • 22. 发明授权
    • Semiconductor light emitting device
    • 半导体发光器件
    • US08436395B2
    • 2013-05-07
    • US13405961
    • 2012-02-27
    • Takahiro SatoShigeya KimuraTaisuke SatoToshihide ItoKoichi TachibanaShinya Nunoue
    • Takahiro SatoShigeya KimuraTaisuke SatoToshihide ItoKoichi TachibanaShinya Nunoue
    • H01L33/36
    • H01L33/24H01L33/382H01L33/42
    • According to one embodiment, a semiconductor light emitting device includes a stacked structure unit, a transparent, p-side and n-side electrodes. The unit includes n-type semiconductor layer, a light emitting portion provided on a part of the n-type semiconductor layer and p-type semiconductor layer provided on the light emitting portion. The transparent electrode is provided on the p-type semiconductor layer. The p-side electrode is provided on the transparent electrode. The n-side electrode is provided on the n-type semiconductor layer. The transparent electrode has a hole provided between the n-side and p-side electrodes. A width of the hole along an axis perpendicular to an axis from the p-side electrode toward the n-side electrode is longer than widths of the n-side and p-side electrodes. A distance between the hole and the n-side electrode is not longer than a distance between the hole and the p-side electrode.
    • 根据一个实施例,半导体发光器件包括堆叠结构单元,透明的p侧和n侧电极。 该单元包括n型半导体层,设置在n型半导体层的一部分上的发光部分和设置在发光部分上的p型半导体层。 透明电极设置在p型半导体层上。 p侧电极设置在透明电极上。 n侧电极设置在n型半导体层上。 透明电极具有设置在n侧和p侧电极之间的孔。 沿着与p侧电极朝向n侧电极的轴垂直的轴的孔的宽度比n侧电极和p侧电极的宽度长。 孔和n侧电极之间的距离不大于孔和p侧电极之间的距离。
    • 23. 发明申请
    • SEMICONDUCTOR LIGHT EMITTING DEVICE
    • 半导体发光器件
    • US20130001584A1
    • 2013-01-03
    • US13405961
    • 2012-02-27
    • Takahiro SATOShigeya KimuraTaisuke SatoToshihide ItoKoichi TachibanaShinya Nunoue
    • Takahiro SATOShigeya KimuraTaisuke SatoToshihide ItoKoichi TachibanaShinya Nunoue
    • H01L33/32
    • H01L33/24H01L33/382H01L33/42
    • According to one embodiment, a semiconductor light emitting device includes a stacked structure unit, a transparent, p-side and n-side electrodes. The unit includes n-type semiconductor layer, a light emitting portion provided on a part of the n-type semiconductor layer and p-type semiconductor layer provided on the light emitting portion. The transparent electrode is provided on the p-type semiconductor layer. The p-side electrode is provided on the transparent electrode. The n-side electrode is provided on the n-type semiconductor layer. The transparent electrode has a hole provided between the n-side and p-side electrodes. A width of the hole along an axis perpendicular to an axis from the p-side electrode toward the n-side electrode is longer than widths of the n-side and p-side electrodes. A distance between the hole and the n-side electrode is not longer than a distance between the hole and the p-side electrode.
    • 根据一个实施例,半导体发光器件包括堆叠结构单元,透明的p侧和n侧电极。 该单元包括n型半导体层,设置在n型半导体层的一部分上的发光部分和设置在发光部分上的p型半导体层。 透明电极设置在p型半导体层上。 p侧电极设置在透明电极上。 n侧电极设置在n型半导体层上。 透明电极具有设置在n侧和p侧电极之间的孔。 沿着与p侧电极朝向n侧电极的轴垂直的轴的孔的宽度比n侧电极和p侧电极的宽度长。 孔和n侧电极之间的距离不大于孔和p侧电极之间的距离。
    • 25. 发明授权
    • Semiconductor light emitting device
    • 半导体发光器件
    • US08704268B2
    • 2014-04-22
    • US13404531
    • 2012-02-24
    • Shigeya KimuraKoichi TachibanaShinya Nunoue
    • Shigeya KimuraKoichi TachibanaShinya Nunoue
    • H01L33/30
    • H01L33/06H01L33/32
    • According to one embodiment, a semiconductor light emitting device includes an n-type semiconductor layer, a p-type semiconductor layer and a light emitting layer. The emitting layer is provided between the n-type layer and the p-type layer, and includes a plurality of barrier layers and a plurality of well layers, being alternately stacked. The p-side barrier layer being closest to the p-type layer among the plurality of barrier layer includes a first layer and a second layer, containing group III elements. An In composition ratio in the group III elements of the second layer is higher than an In composition ratio in the group III elements of the first layer. An average In composition ratio of the p-side layer is higher than an average In composition ratio of an n-side barrier layer that is closest to the n-type layer among the plurality of barrier layers.
    • 根据一个实施例,半导体发光器件包括n型半导体层,p型半导体层和发光层。 发光层设置在n型层和p型层之间,并且包括交替层叠的多个势垒层和多个阱层。 在多个阻挡层中最靠近p型层的p侧阻挡层包括含有III族元素的第一层和第二层。 第二层的III族元素中的In组成比高于第一层的III族元素中的In组成比。 p侧层的平均In组成比高于多个势垒层中最靠近n型层的n侧阻挡层的平均In组成比。