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    • 25. 发明授权
    • Semiconductor memory device and method of manufacturing the same
    • 半导体存储器件及其制造方法
    • US08530876B2
    • 2013-09-10
    • US12885038
    • 2010-09-17
    • Kensuke TakanoKatsuyuki SekineYoshio Ozawa
    • Kensuke TakanoKatsuyuki SekineYoshio Ozawa
    • H01L21/00
    • H01L45/1233H01L27/2409H01L27/2481H01L45/08H01L45/146H01L45/1633H01L45/1675
    • According to one embodiment, a semiconductor memory device comprises a substrate, a lower electrode, a variable resistance film, and an upper electrode. The lower electrode is on the substrate. The variable resistance film is on the lower electrode and stores data. The upper electrode is on the variable resistance film. The variable resistance film comprises a first film, and a second film. The first film is on a side of at least one of the upper electrode and the lower electrode and contains a metal. The second film is between the first film and the other electrode and contains the metal and oxygen. A composition ratio [O]/[Me] of oxygen to the metal in the second film is lower than a stoichiometric ratio and higher than the composition ratio [O]/[Me] in the first film. The composition ratio [0]/[Me] changes between the first film and the second film.
    • 根据一个实施例,半导体存储器件包括衬底,下电极,可变电阻膜和上电极。 下电极位于基板上。 可变电阻膜位于下电极上并存储数据。 上电极位于可变电阻膜上。 可变电阻膜包括第一膜和第二膜。 第一膜位于上电极和下电极中的至少一个的一侧并且包含金属。 第二膜位于第一膜和另一电极之间,并含有金属和氧。 第二膜中氧与金属的组成比[O] / [Me]低于化学计量比,高于第一膜中的组成比[O] / [Me]。 组成比[0] / [Me]在第一膜和第二膜之间变化。
    • 28. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
    • 非易失性半导体存储器件及其制造方法
    • US20110175157A1
    • 2011-07-21
    • US13008469
    • 2011-01-18
    • Katsuyuki SEKINETetsuya KaiYoshio Ozawa
    • Katsuyuki SEKINETetsuya KaiYoshio Ozawa
    • H01L29/792H01L21/336
    • H01L27/11578H01L27/11582H01L29/40117H01L29/66833H01L29/7926
    • According to one embodiment, a nonvolatile semiconductor memory device includes a semiconductor layer; first and second insulating layers; a functional layer; first and second gate electrodes. The first insulating layer opposes the semiconductor layer. The second insulating layer is provided between the semiconductor layer and the first insulating layer. The functional layer is provided between the first and second insulating layers. The second gate electrode is separated from the first gate electrode. The first insulating layer is disposed between the first gate electrode and the semiconductor layer and between the second gate electrode and the semiconductor layer. The charge storabilities in first and second regions of the functional layer are different from that of a third region of the functional layer. The first and second regions oppose the first and second gate electrodes, respectively. The third region is between the first and the second regions.
    • 根据一个实施例,非易失性半导体存储器件包括半导体层; 第一和第二绝缘层; 功能层; 第一和第二栅电极。 第一绝缘层与半导体层相对。 第二绝缘层设置在半导体层和第一绝缘层之间。 功能层设置在第一和第二绝缘层之间。 第二栅电极与第一栅电极分离。 第一绝缘层设置在第一栅电极和半导体层之间以及第二栅电极和半导体层之间。 功能层的第一和第二区域中的电荷存储能力与功能层的第三区域的电荷存储能力不同。 第一和第二区域分别与第一和第二栅电极相对。 第三区域在第一和第二区域之间。