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21. 发明授权

US07786579B2 Apparatus for crack prevention in integrated circuit packages 失效
标题翻译：集成电路封装中的防裂装置
公开(公告)号：US07786579B2
公开(公告)日：2010-08-31
申请号：US11752449
申请日：2007-05-23
申请人： Jean Audet , Anson J. Call , Steven P. Ostrander , Douglas O. Powell , Roger D. Weekly
发明人： Jean Audet , Anson J. Call , Steven P. Ostrander , Douglas O. Powell , Roger D. Weekly
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H05K1/116 , H01L23/49811 , H01L23/49838 , H01L23/562 , H01L23/66 , H01L2223/6616 , H01L2924/0002 , H01L2924/19051 , H01L2924/3011 , H05K1/0271 , H05K1/113 , H05K2201/09454 , H05K2201/09718 , H01L2924/00
摘要： A microelectronic package having integrated circuits is provided. The microelectronic package includes multiple dielectric laminate layers, copper circuitry between the dielectric laminate layers where the copper circuitry includes circuit traces, and ball grid arrays/land grid arrays operatively connected to the copper circuitry such that conduction occurs. Further, proximate to the connection of the copper circuitry and the ball grid arrays/land grid arrays, a protective copper tongue is below an extension of the circuit traces, such that the protective copper tongue prevents the circuit traces from being affected by cracking propagated in the dielectric laminate layers or the ball grid arrays/land grid arrays.
摘要翻译：提供具有集成电路的微电子封装。微电子封装包括多个电介质层压层，铜电路在介电层压层之间，其中铜电路包括电路迹线，以及球栅阵列/焊盘电极阵列，可操作地连接到铜电路，从而导通发生。此外，靠近铜电路和球栅阵列/接地栅阵列的连接，保护铜舌低于电路迹线的延伸线，使得保护铜舌防止电路迹线受到在电介质层压层或球栅阵列/焊盘阵列。

22. 发明申请

US20080290510A1 APPARATUS FOR CRACK PREVENTION IN INTEGRATED CIRCUIT PACKAGES 失效
标题翻译：集成电路封装中的防裂装置
公开(公告)号：US20080290510A1
公开(公告)日：2008-11-27
申请号：US11752449
申请日：2007-05-23
申请人： Jean Audet , Anson J. Call , Steven P. Ostrander , Douglas O. Powell , Roger D. Weekly
发明人： Jean Audet , Anson J. Call , Steven P. Ostrander , Douglas O. Powell , Roger D. Weekly
IPC分类号： H01L23/485
CPC分类号： H05K1/116 , H01L23/49811 , H01L23/49838 , H01L23/562 , H01L23/66 , H01L2223/6616 , H01L2924/0002 , H01L2924/19051 , H01L2924/3011 , H05K1/0271 , H05K1/113 , H05K2201/09454 , H05K2201/09718 , H01L2924/00
摘要： A microelectronic package having integrated circuits is provided. The microelectronic package includes multiple dielectric laminate layers, copper circuitry between the dielectric laminate layers where the copper circuitry includes circuit traces, and ball grid arrays/land grid arrays operatively connected to the copper circuitry such that conduction occurs. Further, proximate to the connection of the copper circuitry and the ball grid arrays/land grid arrays, a protective copper tongue is below an extension of the circuit traces, such that the protective copper tongue prevents the circuit traces from being affected by cracking propagated in the dielectric laminate layers or the ball grid arrays/land grid arrays.
摘要翻译：提供具有集成电路的微电子封装。微电子封装包括多个电介质层压层，铜电路在介电层压层之间，其中铜电路包括电路迹线，以及球栅阵列/焊盘电极阵列，可操作地连接到铜电路，从而导通发生。此外，靠近铜电路和球栅阵列/接地栅阵列的连接，保护铜舌低于电路迹线的延伸线，使得保护铜舌防止电路迹线受到在电介质层压层或球栅阵列/焊盘阵列。

23. 发明授权

US06908025B2 Preparing MCM hat for removal 失效
标题翻译：准备MCM帽子去除
公开(公告)号：US06908025B2
公开(公告)日：2005-06-21
申请号：US10604111
申请日：2003-06-26
申请人： Patrick A. Coico , Steven P. Ostrander , Sudipta K. Ray
发明人： Patrick A. Coico , Steven P. Ostrander , Sudipta K. Ray
IPC分类号： B23K1/018 , B23K31/02 , B23K31/00
CPC分类号： B23K1/018 , Y10T29/4973 , Y10T29/4975 , Y10T29/49824
摘要： A process and apparatus for preparing an MCM for hat removal where the hat includes a piston thermally coupled to a corresponding chip. The apparatus includes a heater positioned to reflow a joint between the piston and a base of the hat; and a retractor for biasing the piston away from the corresponding chip. Implementation of the apparatus and process prevent a piston, as it moves across the top of a corresponding chip during mechanical shear to remove the hat, to impact chip(s) and surrounding components. In addition, since piston(s) are retracted, the likelihood of piston impact with or cracking of a chip is reduced. In addition, cutting into a corresponding chip having a tilted back surface is prevented. The need to replace chips and other electronic components when making other repairs may, therefore, be greatly reduced.
摘要翻译：一种制备用于帽子去除的MCM的方法和装置，其中帽子包括热耦合到相应芯片的活塞。该装置包括加热器，该加热器定位成回流活塞和帽子的基座之间的接头; 以及用于将活塞偏压离开相应芯片的牵开器。该设备和过程的实施防止活塞在机械剪切过程中跨过相应芯片的顶部移动以去除帽子，以冲击芯片和周围部件。此外，由于活塞缩回，因此减少了活塞撞击或碎裂的可能性。此外，防止切入具有倾斜背面的相应芯片。因此，在进行其他维修时需要更换芯片和其他电子部件可能会大大降低。

24. 发明授权

US06821026B2 Redundant configurable VCSEL laser array optical light source 有权
公开(公告)号：US06821026B2
公开(公告)日：2004-11-23
申请号：US10235435
申请日：2002-09-04
申请人： William T. Devine , Jeffrey A. Kash , John U. Knickerbocker , Steven P. Ostrander , Jeannine M. Trewhella , Ronald P. Luijten
发明人： William T. Devine , Jeffrey A. Kash , John U. Knickerbocker , Steven P. Ostrander , Jeannine M. Trewhella , Ronald P. Luijten
IPC分类号： G02B636
CPC分类号： H01S5/423 , H01S5/02248 , H01S5/02284
摘要： A redundant configurable VCSEL laser array optical light source which provides for integrating optical communications capabilities into manufacturing processes for a substrate or submount such as a silicon or ceramic substrate, a multi-chip module, a package board, backplane or similar component. Multiple, spatially proximate lasers and photodetectors are provided as part of an optical transmitter or receiver module to simplify assembly of the module, particularly alignment of a laser or photodetector to an optical fiber or waveguide. A feedback loop and control logic select those laser(s) or photodiodes(s) which are most strongly coupled to the transmission medium to produce the best signals. This approach greatly simplifies optical alignment, to improve yield and relax mechanical tolerances, leading to lower assembly costs and higher manufacturing yields.

25. 发明授权

US5468427A Process for making ultra-fine ceramic particles 失效
标题翻译：制造超细陶瓷颗粒的方法
公开(公告)号：US5468427A
公开(公告)日：1995-11-21
申请号：US127637
申请日：1993-09-27
申请人： Gregory C. Stangle , Koththavasal R. Venkatachari , Steven P. Ostrander , Walter A. Schulze
发明人： Gregory C. Stangle , Koththavasal R. Venkatachari , Steven P. Ostrander , Walter A. Schulze
IPC分类号： C01B13/32 , C01B13/34 , C01G3/00 , C01G23/00 , C01G23/047 , C01G25/02 , C01G49/00 , C04B35/45 , H01L39/24 , C01F1/00 , C01G1/00
CPC分类号： B82Y30/00 , C01B13/324 , C01B13/34 , C01G23/006 , C01G23/047 , C01G25/02 , C01G3/006 , C01G49/0036 , C01G49/0054 , C04B35/4508 , H01L39/2419 , C01P2004/64 , C01P2006/10 , C01P2006/12 , C01P2006/40
摘要： A process for producing ultra-fine ceramic particles in which droplets are formed from a ceramic precursor mixture containing a metal cation, a nitrogen-containing fuel, a solvent, and an anion capable of participating in an anionic oxidation-reduction reaction with the nitrogen containing fuel. The nitrogen-containing fuel contains at least three nitrogen atoms, at least one oxygen atom, and at least one carbon atom. The ceramic precursor mixture is dried to remove at least 85 weight percent of the solvent, and the dried mixture is then ignited to form a combusted powder.
摘要翻译：一种制造超细陶瓷颗粒的方法，其中由含有金属阳离子，含氮燃料，溶剂和能够参与与含氮的阴离子氧化还原反应的阴离子的陶瓷前体混合物形成液滴汽油。含氮燃料含有至少三个氮原子，至少一个氧原子和至少一个碳原子。将陶瓷前体混合物干燥以除去至少85重量％的溶剂，然后将干燥的混合物点燃以形成燃烧的粉末。

26. 发明授权

US08906809B2 Multichip electronic packages and methods of manufacture 有权
标题翻译： Multichip电子封装和制造方法
公开(公告)号：US08906809B2
公开(公告)日：2014-12-09
申请号：US13491174
申请日：2012-06-07
申请人： Martin M. Beaumier , Steven P. Ostrander , Kamal K. Sikka , Hilton T. Toy , Jeffrey A. Zitz
发明人： Martin M. Beaumier , Steven P. Ostrander , Kamal K. Sikka , Hilton T. Toy , Jeffrey A. Zitz
IPC分类号： H01L21/302 , H01L21/461 , H01L23/42 , H01L23/10 , H01L23/433
CPC分类号： H01L23/4338 , H01L23/10 , H01L23/42 , H01L2924/0002 , Y10T29/49826 , H01L2924/00
摘要： A multi-chip electronic package and methods of manufacture are provided. The structure includes a lid encapsulating at least one chip mounted on a chip carrier; at least one seal shim fixed between the lid and the chip carrier, the at least one seal shim forming a gap between pistons of the lid and respective ones of the chips; and thermal interface material within the gap and contacting the pistons of the lid and respective ones of the chips.
摘要翻译：提供了一种多芯片电子封装及其制造方法。该结构包括封装安装在芯片载体上的至少一个芯片的盖子; 固定在所述盖和所述芯片载体之间的至少一个密封垫片，所述至少一个密封垫片在所述盖子的活塞和所述芯片的相应的芯片之间形成间隙; 和间隙内的热界面材料，并与盖子的活塞和各个芯片接触。

27. 发明授权

US08900927B2 Multichip electronic packages and methods of manufacture 有权
标题翻译： Multichip电子封装和制造方法
公开(公告)号：US08900927B2
公开(公告)日：2014-12-02
申请号：US12856699
申请日：2010-08-16
申请人： Martin M. Beaumier , Steven P. Ostrander , Kamal K. Sikka , Hilton T. Toy , Jeffrey A. Zitz
发明人： Martin M. Beaumier , Steven P. Ostrander , Kamal K. Sikka , Hilton T. Toy , Jeffrey A. Zitz
IPC分类号： H01L21/00 , H05K7/20 , F28F7/00 , H01L23/42 , H01L23/10 , H01L23/433
CPC分类号： H01L23/4338 , H01L23/10 , H01L23/42 , H01L2924/0002 , Y10T29/49826 , H01L2924/00
摘要： A multi-chip electronic package and methods of manufacture are provided. The method includes contacting pistons of a lid with respective ones of chips on a chip carrier. The method further includes separating the lid and the chip carrier and placing at least one seal shim on one of the lid and chip carrier. The at least one seal shim has a thickness that results in a gap between the pistons with the respective ones of the chips on the chip carrier. The method further includes dispensing thermal interface material within the gap and in contact with the chips. The method further includes sealing the lid to the chip carrier with the at least one seal shim between the lid and the chip carrier.
摘要翻译：提供了一种多芯片电子封装及其制造方法。该方法包括将盖的活塞与芯片载体上的各个芯片接触。该方法还包括分离盖子和芯片载体并将至少一个密封垫片放置在盖子和芯片载体之一上。至少一个密封垫片具有导致活塞与芯片载体上的相应芯片之间的间隙的厚度。该方法还包括在间隙内分配热界面材料并与芯片接触。该方法还包括将盖子密封到芯片载体上，其中至少一个密封垫片位于盖子和芯片载体之间。

28. 发明授权

US08492199B2 Reworkable underfills for ceramic MCM C4 protection 有权
标题翻译：用于陶瓷MCM C4保护的可重修的底漆
公开(公告)号：US08492199B2
公开(公告)日：2013-07-23
申请号：US13252424
申请日：2011-10-04
申请人： Jeffrey T. Coffin , Steven P. Ostrander , Frank L. Pompeo , Jiali Wu
发明人： Jeffrey T. Coffin , Steven P. Ostrander , Frank L. Pompeo , Jiali Wu
IPC分类号： H01L21/56
CPC分类号： H01L23/293 , H01L21/563 , H01L23/3157 , H01L24/32 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/27013 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01029 , H01L2924/01078 , H01L2924/09701 , H01L2924/14 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： The present invention provides chip containing electronic devices such as Multichip Ceramic Modules (MCM's) containing a plurality of chips on a substrate which chips are underfilled with a reworkable composition which allows one or more chips to be removed from the device and replaced. The reworkable compositions contain a base resin which is not cross-linkable and which forms a matrix with a linear curable component or preferably a combination of linear curable components which curable components are cross-linkable and when cured form a cross-linked domain in the base resin matrix. A suitable cross-linking catalyst such as Pt is used and optionally a filler preferably silane surface treated silica. The preferred base resin is linear polydimethylsiloxane and the preferred curable components are vinyl terminated linear poly dimethyl siloxane and hydrogen terminated linear poly dimethyl siloxane.
摘要翻译：本发明提供了包含电子器件的芯片，例如在衬底上包含多个芯片的多芯片陶瓷模块（MCM），其中芯片底部填充有可重复组合，其允许从器件中移除一个或多个芯片并被替换。可再加工组合物含有不可交联的基础树脂，并且其形成具有线性可固化组分或优选可固化组分可交联的线性可固化组分的组合的基质，并且当固化形成基底中的交联结构域时树脂基体。使用合适的交联催化剂如Pt，任选的填料优选是硅烷表面处理的二氧化硅。优选的基础树脂是直链聚二甲基硅氧烷，优选的可固化组分是乙烯基封端的直链聚二甲基硅氧烷和氢封端的直链聚二甲基硅氧烷。

29. 发明申请

US20130112006A1 DETERMINING MAGNITUDE OF COMPRESSIVE LOADING 有权
标题翻译：确定压缩载荷的大小
公开(公告)号：US20130112006A1
公开(公告)日：2013-05-09
申请号：US13289121
申请日：2011-11-04
申请人： PAUL F. BODENWEBER , Virendra R. Jadhav , Steven P. Ostrander , Kamal Sikka , Jiantao Zheng , Jeffrey A. Zitz
发明人： PAUL F. BODENWEBER , Virendra R. Jadhav , Steven P. Ostrander , Kamal Sikka , Jiantao Zheng , Jeffrey A. Zitz
IPC分类号： G01N3/08
CPC分类号： G01L5/0038 , G01L5/0057 , G01L5/0076 , G01N3/08 , G01N27/22 , G01N2203/0617 , G01N2203/0629 , G01N2203/0682
摘要： An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied.
摘要翻译：提供一种用于确定施加到包括设置在第一和第二元件之间的柔性膜的活塞的压缩载荷的大小的装置。该装置包括第一部分，该第一部分沿着移动方向可移动地沿着移动方向移动，沿该运动方向确定压缩载荷的大小，第二部分，可沿着运动方向与第二部件移动;以及传感器，用于测量第一和运动方向上的第二部分，所测量的距离与施加压缩载荷时柔顺膜的变形有关。

30. 发明申请

US20120276375A1 PRECAST THERMAL INTERFACE ADHESIVE FOR EASY AND REPEATED, SEPARATION AND REMATING 有权
标题翻译：预热接口粘合剂用于轻松和重复，分离和除尘
公开(公告)号：US20120276375A1
公开(公告)日：2012-11-01
申请号：US13546151
申请日：2012-07-11
申请人： Evan George Colgan , Paul W. Coteus , Michael Anthony Gaynes , Kenneth Charles Marston , Steven P. Ostrander
发明人： Evan George Colgan , Paul W. Coteus , Michael Anthony Gaynes , Kenneth Charles Marston , Steven P. Ostrander
IPC分类号： B32B7/12 , B32B15/08
CPC分类号： B32B37/1207 , B32B37/26 , B32B2037/243 , B32B2037/268 , B32B2309/02 , B32B2311/12 , B32B2311/24 , B32B2457/08 , Y10T156/11 , Y10T156/1195 , Y10T428/2804 , Y10T428/2813 , Y10T428/2861
摘要： Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.
摘要翻译：预制的可固化热界面粘合剂便于在其热界面处容易且可重复地分离和保留电子部件，以及用于通过使用这种粘合剂在组件的热界面处实现上述可重复分离和重新化的方法。

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