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21. 发明申请

US20050135066A1 Method of attaching non-adhesive thermal interface materials 失效
标题翻译：安装非粘合热界面材料的方法
公开(公告)号：US20050135066A1
公开(公告)日：2005-06-23
申请号：US10740956
申请日：2003-12-17
申请人： Seri Lee , Seung You , Jae Chang
发明人： Seri Lee , Seung You , Jae Chang
IPC分类号： H01L23/31 , H01L23/36 , H01L23/42 , H05K7/20
CPC分类号： H01L23/36 , H01L23/3128 , H01L23/42 , H01L2224/16 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011
摘要： Securing a heat sink to an electronic device, such as an integrated circuit package, includes applying an adhesive layer to only a periphery of a surface on a thermal interface material. The thermal interface material is applied to the heat sink and/or integrated circuit package using the adhesive layer. The heat sink is in thermal contact with the integrated circuit package to extract heat during operation.
摘要翻译：将散热器固定到诸如集成电路封装的电子设备上，包括仅将粘合剂层施加到热界面材料上的表面的周边。使用粘合剂层将热界面材料施加到散热器和/或集成电路封装。散热器与集成电路封装件热接触，以在操作过程中提取热量。

22. 发明授权

US06757170B2 Heat sink and package surface design 有权
标题翻译：散热片和包装表面设计
公开(公告)号：US06757170B2
公开(公告)日：2004-06-29
申请号：US10205842
申请日：2002-07-26
申请人： Seri Lee , Phillip H. Chen
发明人： Seri Lee , Phillip H. Chen
IPC分类号： H05K720
CPC分类号： H01L23/42 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011 , H01L2224/0401
摘要： An electronic assembly that includes a heat sink, a thermal interface material, integrated circuit, and a package connected to the integrated circuit. The thermal interface material is positioned between a first surface on the package and a second surface on the heat sink to improve thermal conductivity between the package and heat sink. At least one of the first and second surfaces includes either a cavity that traps excess thermal interface material when the heat sink is compressed against the package, or a protrusion that maintains bond line thickness between the heat sink and package.
摘要翻译：一种电子组件，其包括散热器，热界面材料，集成电路和连接到集成电路的封装。热界面材料位于包装上的第一表面和散热器上的第二表面之间，以改善包装和散热器之间的导热性。第一表面和第二表面中的至少一个包括当散热器压靠封装时捕获多余热界面材料的空腔，或者在散热器和封装之间保持结合线厚度的突起。

23. 发明申请

US20100149719A1 Thermal device with ionized air flow 审中-公开
标题翻译：具有电离气流的热装置
公开(公告)号：US20100149719A1
公开(公告)日：2010-06-17
申请号：US12655584
申请日：2009-12-31
申请人： Johan F. Ploeg , Seri Lee
发明人： Johan F. Ploeg , Seri Lee
IPC分类号： H05F3/00 , H05K7/20
CPC分类号： H01L23/467 , F28F13/16 , F28F2250/08 , H01L2924/0002 , H01L2924/00
摘要： In some embodiments a thermal device such as a heat sink cools an electronic device. An electrokinetic airflow generating device uses a positively charged source and also uses at least a portion of the thermal device as a negatively charged or grounded probe to provide electrokinetically driven airflow. Other embodiments are described and claimed.
摘要翻译：在一些实施例中，诸如散热器的热装置冷却电子装置。电动气流产生装置使用带正电荷的源并且还使用热装置的至少一部分作为带负电或接地的探针来提供电动驱动气流。描述和要求保护其他实施例。

24. 发明申请

US20100032150A1 MICROSCALE COOLING APPARATUS AND METHOD 有权
标题翻译：微型冷却装置和方法
公开(公告)号：US20100032150A1
公开(公告)日：2010-02-11
申请号：US12511945
申请日：2009-07-29
申请人： Matthew Determan , Scott W.C.H. Lee , Abel Manuel Siu Ho , Seri Lee
发明人： Matthew Determan , Scott W.C.H. Lee , Abel Manuel Siu Ho , Seri Lee
IPC分类号： F28F27/00 , F28D15/02 , F28F7/00
CPC分类号： F28D15/0266 , F28D2021/0029 , F28D2021/0031 , F28F3/12 , F28F9/02 , F28F2250/04 , F28F2260/02 , F28F2270/00 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A method and system for providing a heat sink assembly are described. The assembly includes a two-phase heat sink, a condenser, and a pump. The two-phase heat sink may include flow micro-channels that accommodate the flow of boiling coolant and cross-connect channel(s) that at least partially equilibrate a pressure field for the boiling coolant. The condenser receives coolant from the heat sink and removes heat. The pump drives coolant through the assembly. In one aspect, the assembly is a closed system for the coolant. In another aspect, the condenser includes first and second plates and a heat exchange surface there between. Coolant flows from the heat sink and through the plates. The gaseous coolant passes the heat exchange surface. In one aspect the gaseous coolant flows opposite to the direction coolant flows. In one aspect, at least one of the plates includes dummy channel(s) for insulating part of the plate(s).
摘要翻译：描述了一种用于提供散热器组件的方法和系统。组件包括两相散热器，冷凝器和泵。两相散热器可以包括容纳沸腾冷却剂流和交联连接通道的流动微通道，其至少部分平衡沸腾冷却剂的压力场。冷凝器从散热器接收冷却液并除去热量。泵通过组件驱动冷却剂。在一个方面，组件是用于冷却剂的封闭系统。在另一方面，冷凝器包括第一和第二板以及它们之间的热交换面。冷却液从散热片流过板。气态冷却剂通过热交换表面。在一个方面，气态冷却剂与冷却剂流动的方向相反。在一个方面，至少一个板包括用于绝缘板的一部分的虚拟通道。

25. 发明授权

US07535708B2 Fan integrated thermal management device 有权
标题翻译：风机集成热管理装置
公开(公告)号：US07535708B2
公开(公告)日：2009-05-19
申请号：US11532978
申请日：2006-09-19
申请人： Seri Lee
发明人： Seri Lee
IPC分类号： H05K5/00
CPC分类号： G06F1/20
摘要： A fan integrated thermal management device, such as a heat sink, may include an integrated fan to facilitate air flow through the device. One embodiment of the thermal management device may include a heat-conductive base and a plurality of heat-conductive extensions extending from the base and defining one or more fan blade regions. One or more fans may be mounted relative to the heat-conductive extensions such that at least one fan blade is located in the fan blade region and is configured to rotate through the fan blade region. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
摘要翻译：诸如散热器的风扇集成热管理装置可以包括集成式风扇，以促进空气流过装置。热管理装置的一个实施例可以包括导热基座和从基座延伸并限定一个或多个风扇叶片区域的多个导热延伸件。可以相对于导热延伸部安装一个或多个风扇，使得至少一个风扇叶片位于风扇叶片区域中并且构造成旋转穿过风扇叶片区域。当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

26. 发明申请

US20080218972A1 Cooling device, system containing same, and cooling method 审中-公开
标题翻译：冷却装置，含有其的系统和冷却方法
公开(公告)号：US20080218972A1
公开(公告)日：2008-09-11
申请号：US11714333
申请日：2007-03-06
申请人： Ioan Sauciuc , Seri Lee , Alin Ila , Steven Girouard , Javier Leija , Behre Mulugeta
发明人： Ioan Sauciuc , Seri Lee , Alin Ila , Steven Girouard , Javier Leija , Behre Mulugeta
IPC分类号： H05K7/20 , F28F13/00
CPC分类号： F04D33/00 , F04D29/582 , F28F3/02 , F28F13/10 , H01L23/467 , H01L2924/0002 , H05K7/20172 , H01L2924/00
摘要： A cooling device includes a heat sink (110) having a plurality of fins (111) and a piezoelectric assembly (120) having an actuator (121) and a plurality of blades (122) coupled to the actuator. The actuator includes a plurality of metal electrodes (227) and a plurality of piezoelectric layers (228). The fins of the heat sink are intertwined with the blades of the piezoelectric assembly.
摘要翻译：冷却装置包括具有多个翅片（111）和具有致动器（121）的压电组件（120）和耦合到致动器的多个叶片（122）的散热器（110）。致动器包括多个金属电极（227）和多个压电层（228）。散热片的翅片与压电组件的叶片相互缠绕。

27. 发明申请

US20070037506A1 Rake shaped fan 有权
标题翻译：耙式风扇
公开(公告)号：US20070037506A1
公开(公告)日：2007-02-15
申请号：US11200675
申请日：2005-08-09
申请人： Seri Lee , Ioan Sauciuc
发明人： Seri Lee , Ioan Sauciuc
IPC分类号： H05K5/00
CPC分类号： F04D33/00 , H05K7/20172
摘要： In some embodiments, a piezoelectric actuator is coupled to a blade having a rake shape. The blade may include a base with two or more prongs extending therefrom. At least a portion of one or more prongs may be positioned between the fins of a heat sink. Other embodiments are disclosed and claimed.
摘要翻译：在一些实施例中，压电致动器联接到具有耙形的刀片。叶片可以包括具有从其延伸的两个或更多个插脚的基部。一个或多个插脚的至少一部分可以位于散热器的散热片之间。公开和要求保护其他实施例。

28. 发明授权

US06845010B2 High performance heat sink configurations for use in high density packaging applications 失效
标题翻译：用于高密度封装应用的高性能散热器配置
公开(公告)号：US06845010B2
公开(公告)日：2005-01-18
申请号：US10388856
申请日：2003-03-14
申请人： Seri Lee
发明人： Seri Lee
IPC分类号： H05K7/20 , H01L23/36 , H01L23/367 , H01L23/467
CPC分类号： H01L23/3672 , H01L23/3677 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An enhanced heat dissipation device to extract heat from an integrated circuit device includes a thermally conductive core having upper and lower outer surface areas. The device further includes a first array of radially extending pin fin structures. The first array is thermally coupled to the upper surface area such that a cooling medium introduced around the core and the first array creates an omni-directional flow around the first array and the core to enhance heat dissipation from the integrated circuit device. The core including the first array and the lower surface area are of sufficient size to allow components on a motherboard to encroach onto the integrated circuit device when the heat dissipation device is mounted onto the integrated circuit device.
摘要翻译：用于从集成电路装置提取热量的增强散热装置包括具有上外表面区域和下外表面区域的导热芯体。该装置还包括径向延伸的销鳍结构的第一阵列。第一阵列热耦合到上表面区域，使得围绕芯部和第一阵列引入的冷却介质围绕第一阵列和芯部产生全向流动，以增强集成电路器件的散热。包括第一阵列和下表面区域的核心具有足够的尺寸，以便当散热装置安装在集成电路装置上时，允许主板上的部件侵入集成电路装置。

29. 发明授权

US06535385B2 High performance heat sink configurations for use in high density packaging applications 有权
公开(公告)号：US06535385B2
公开(公告)日：2003-03-18
申请号：US09766757
申请日：2001-01-22
申请人： Seri Lee
发明人： Seri Lee
IPC分类号： H05K720
CPC分类号： H01L23/3672 , H01L23/3677 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An enhanced heat dissipation device to extract heat from an integrated circuit device includes a thermally conductive core having upper and lower outer surface areas. The device further includes a first array of radially extending pin fin structures. The first array is thermally coupled to the upper surface area such that a cooling medium introduced around the core and the first array creates an omni-directional flow around the first array and the core to enhance heat dissipation from the integrated circuit device. The core including the first array and the lower surface area are of sufficient size to allow components on a motherboard to encroach onto the integrated circuit device when the heat dissipation device is mounted onto the integrated circuit device.

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