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21. 发明授权

US08492188B2 Method for producing a micromechanical component 有权
标题翻译：微机械部件的制造方法
公开(公告)号：US08492188B2
公开(公告)日：2013-07-23
申请号：US13296923
申请日：2011-11-15
申请人： Heiko Stahl , Christina Leinenbach , Axel Franke , Jochen Reinmuth , Ando Feyh , Christian Rettig
发明人： Heiko Stahl , Christina Leinenbach , Axel Franke , Jochen Reinmuth , Ando Feyh , Christian Rettig
IPC分类号： H01L21/00
CPC分类号： B81C1/00777
摘要： A method for producing a micromechanical component is described. The method includes providing a substrate having a layer system including an insulating material situated on the substrate, a conductive layer section and a protective layer structure connected to the conductive layer section, which borders a section of the insulating material. The method furthermore includes carrying out an isotropic etching process for removing a part of the insulating material, the conductive layer section and the protective layer structure preventing the removal of the bordered section of the insulating material; and a structural element being developed, which includes the conductive layer section, the protective layer structure and the bordered section of the insulating material.
摘要翻译：对微机械部件的制造方法进行说明。该方法包括提供具有包括位于基板上的绝缘材料的层系统的基板，与导电层部分连接的导电层部分和保护层结构，其与绝缘材料的一部分相接触。该方法还包括进行用于去除绝缘材料的一部分，导电层部分和保护层结构的各向同性蚀刻工艺，以防止去除绝缘材料的边界部分; 以及正在开发的结构元件，其包括导电层部分，保护层结构和绝缘材料的边界部分。

22. 发明申请

US20120291543A1 MICROSYSTEM 审中-公开
标题翻译：微阵列
公开(公告)号：US20120291543A1
公开(公告)日：2012-11-22
申请号：US13558772
申请日：2012-07-26
申请人： Christian RETTIG , Axel Franke , Ando Feyh
发明人： Christian RETTIG , Axel Franke , Ando Feyh
IPC分类号： B81B3/00 , G01P15/00
CPC分类号： G01C19/56 , B81B7/0041 , B81B7/02 , B81C2203/0109 , G01P15/0802 , Y10T29/49144 , Y10T29/49146 , Y10T428/13
摘要： A microsystem, e.g., a micromechanical sensor, has a first cavity which is sealed off from the surroundings and a second cavity which is sealed off from the surroundings. The first cavity is bounded by a first bond joint and the second cavity is bounded by a second bond joint. Either the first bond joint or the second bond joint is a eutectic bond joint or a diffusion-soldered joint.
摘要翻译：微系统，例如微机械传感器，具有与周围环境密封的第一空腔和与周围环境密封的第二空腔。第一腔体由第一接合接头限定，第二腔体由第二接合接头限定。第一接合接头或第二接合接头是共晶接合接头或扩散焊接接头。

23. 发明申请

US20120189143A1 Micromechanical Microphone Device and Method for Producing a Micromechanical Microphone Device 审中-公开
标题翻译：微机电麦克风装置及其制造方法
公开(公告)号：US20120189143A1
公开(公告)日：2012-07-26
申请号：US13343532
申请日：2012-01-04
申请人： Alexander Buhmann , Ando Feyh
发明人： Alexander Buhmann , Ando Feyh
IPC分类号： H04R1/00 , H01L21/306
CPC分类号： H04R31/00 , H04R19/005 , H04R19/04
摘要： A micromechanical microphone device includes a membrane that is mounted in an elastically deflectable manner above a substrate and that has at least one gate electrode. The device further includes a source region and a drain region provided in or on the substrate with a channel region therebetween. The channel region is at least partly covered by the gate electrode and is spaced apart from the gate electrode by a gap. The membrane is deflectable under the influence of sound in such a way that the gap is variable.
摘要翻译：微机械麦克风装置包括膜，其以可弹性偏转的方式安装在基板上方并且具有至少一个栅电极。该器件还包括设置在衬底中或衬底上的源极区和漏极区，其间具有沟道区。通道区域至少部分地被栅电极覆盖，并且与栅电极间隔开间隙。膜在声音的影响下是可偏转的，使得间隙是可变的。

24. 发明授权

US08212326B2 Manufacturing method for a micromechanical component having a thin-layer capping 有权
标题翻译：具有薄层封盖的微机械部件的制造方法
公开(公告)号：US08212326B2
公开(公告)日：2012-07-03
申请号：US12835328
申请日：2010-07-13
申请人： Ando Feyh
发明人： Ando Feyh
IPC分类号： H01L29/84
CPC分类号： G01P15/0802 , B81B2201/0235 , B81B2201/0242 , B81B2201/0264 , B81C1/00476 , G01L9/0042 , G01P15/125
摘要： A manufacturing method for a micromechanical component having a thin-layer capping. The method includes the following: forming a functional layer on a substrate; structuring the functional layer in first cutout regions having a first width and in regions of the functional layer to be removed having a second width, the second width being substantially greater than the first width; forming a first oxide layer on the structured functional layer; forming a first sealing layer on the thermally oxidized and structured functional layer, the first cutout regions having the first width being sealed; forming a cap layer on the first sealing layer; forming first through holes which extend through the cap layer, the first sealing layer, and the first oxide layer for at least partially exposing the regions of the functional layer to be removed; and selectively removing the regions of the functional layer to be removed, by introducing a first etching medium through the first through holes, resulting in second cutout regions in the functional layer which have the second width.
摘要翻译：具有薄层封盖的微机械部件的制造方法。该方法包括：在基板上形成功能层; 在具有第一宽度的第一切口区域中和在要移除的功能层的区域中具有第二宽度的第二宽度基本上大于第一宽度; 在所述结构化功能层上形成第一氧化物层; 在所述热氧化结构的功能层上形成第一密封层，所述第一切口区域具有第一宽度被密封; 在所述第一密封层上形成盖层; 形成延伸穿过盖层的第一通孔，第一密封层和第一氧化物层，用于至少部分地暴露要去除的功能层的区域; 并通过引入第一蚀刻介质通过第一通孔选择性去除待去除的功能层的区域，从而产生具有第二宽度的功能层中的第二切除区域。

25. 发明申请

US20110233750A1 Arrangement of Two Substrates having an SLID Bond and Method for Producing such an Arrangement 有权
标题翻译：具有SLID键的两个基板的布置以及用于制造这种布置的方法
公开(公告)号：US20110233750A1
公开(公告)日：2011-09-29
申请号：US13133521
申请日：2009-10-19
申请人： Achim Trautmann , Ando Feyh
发明人： Achim Trautmann , Ando Feyh
IPC分类号： H01L23/52 , H01L21/50
CPC分类号： H01L23/10 , B81B2207/012 , B81C1/00269 , B81C2203/0109 , B81C2203/038 , H01L2924/0002 , H01L2924/1433 , H01L2924/00
摘要： An arrangement having a first and a second substrate is disclosed, wherein the two substrates are connected to one another by means of an SLID (Solid Liquid InterDiffusion) bond. The SLID bond exhibits a first metallic material and a second metallic material, wherein the SLID bond comprises the intermetallic Al/Sn-phase.
摘要翻译：公开了一种具有第一和第二基板的装置，其中两个基板通过SLID（固体液体互扩散）粘合而彼此连接。 SLID键显示第一金属材料和第二金属材料，其中SLID键包括金属间Al / Sn相。

26. 发明申请

US20100003790A1 METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT HAVING A THIN-LAYER CAPPING 失效
标题翻译：用于制造具有薄层覆盖层的微机电组件的方法
公开(公告)号：US20100003790A1
公开(公告)日：2010-01-07
申请号：US12305150
申请日：2007-08-21
申请人： Silvia Kronmueller , Tino Fuchs , Ando Feyh , Christina Leinenbach , Marco Lammer
发明人： Silvia Kronmueller , Tino Fuchs , Ando Feyh , Christina Leinenbach , Marco Lammer
IPC分类号： H01L21/50
CPC分类号： B81C1/00333 , B81C2201/0115 , B81C2201/0132 , B81C2203/0136 , B81C2203/0145
摘要： A capping technology is provided in which, despite the fact that structures which are surrounded by a silicon-germanium filling layer are exposed using ClF3 etching through micropores in the silicon cap, an etching attack on the silicon cap is prevented, namely, either by particularly selective (approximately 10,000:1 or higher) adjustment of the etching process itself, or by using the finding that the oxide of a germanium-rich layer, in contrast to oxidized porous silicon, is not stable but instead may be easily dissolved, to protect the silicon cap.
摘要翻译：提供了一种封盖技术，尽管事实上，利用ClF3蚀刻通过硅盖中的微孔暴露由硅 - 锗填充层包围的结构，但是防止了对硅帽的蚀刻攻击，即特别地选择性（大约10,000:1或更高）调整蚀刻工艺本身，或通过使用与氧化多孔硅相反的富锗层的氧化物不稳定但可以容易地溶解的发现来保护硅帽。

27. 发明申请

US20080245764A1 Method for producing a device including an array of microneedles on a support, and device producible according to this method 审中-公开
标题翻译：用于制造包括支撑体上的微针阵列的装置的方法，以及根据该方法可制造的装置
公开(公告)号：US20080245764A1
公开(公告)日：2008-10-09
申请号：US12009498
申请日：2008-01-18
申请人： Tjalf Pirk , Michael Stumber , Joachim Rudhard , Ando Feyh , Christina Leinenbach , Christian Mauerer
发明人： Tjalf Pirk , Michael Stumber , Joachim Rudhard , Ando Feyh , Christina Leinenbach , Christian Mauerer
IPC分类号： C23F1/00 , A61M5/158
CPC分类号： B81C99/008 , A61M37/0015 , A61M2037/0046 , A61M2037/0053 , B81B2201/055
摘要： A method for producing a device which is suitable for delivering a substance into or through the skin and includes an array of microneedles developed out of an Si semiconductor substrate, the microneedles being affixed on and/or inside a flexible support made from a polymer material. A device producible by this method.
摘要翻译：一种用于生产适合于将物质输送到皮肤中或穿过皮肤的装置的方法，包括由Si半导体衬底形成的微针阵列，所述微针固定在由聚合物材料制成的柔性支撑体上和/或内部。可通过该方法生产的装置。

28. 发明申请

US20080197106A1 Method for manufacturing semiconical microneedles and semiconical microneedles manufacturable by this method 审中-公开
标题翻译：用这种方法制造半导体微针和半微型微针的方法
公开(公告)号：US20080197106A1
公开(公告)日：2008-08-21
申请号：US12011711
申请日：2008-01-28
申请人： Ando Feyh
发明人： Ando Feyh
IPC分类号： C23F17/00 , A61M5/00
CPC分类号： B81C1/00111 , B81B2201/055 , B81C2201/0115
摘要： A method for manufacturing semiconical microneedles in an Si-semiconductor substrate and a semiconical microneedles manufacturable made by this method.
摘要翻译：在半导体硅衬底制造半导体微针的方法和通过该方法制造的半导体微针。

29. 发明申请

US20170314995A1 METHOD TO MODULATE THE SENSITIVITY OF A BOLOMETER VIA NEGATIVE INTERFERENCE 有权
公开(公告)号：US20170314995A1
公开(公告)日：2017-11-02
申请号：US15516821
申请日：2015-10-09
申请人： Thomas ROCZNIK , Fabian PURKL , Gary O'BRIEN , Ando FEYH , Bongsang KIM , Ashwin SAMARAO , Gary YAMA , Robert Bosch GmbH
发明人： Thomas Rocznik , Fabian Purkl , Gary O'Brien , Ando Feyh , Bongsang Kim , Ashwin Samarao , Gary Yama
IPC分类号： G01J5/06 , G01J5/08 , G01J5/24
CPC分类号： G01J5/06 , G01J5/0809 , G01J5/0853 , G01J5/20 , G01J5/24 , G01J2005/066 , G01J2005/067
摘要： A semiconductor sensor system, in particular a bolometer, includes a substrate, an electrode supported by the substrate, an absorber spaced apart from the substrate, a voltage source, and a current source. The electrode can include a mirror, or the system may include a mirror separate from the electrode. Radiation absorption efficiency of the absorber is based on a minimum gap distance between the absorber and mirror. The current source applies a DC current across the absorber structure to produce a signal indicative of radiation absorbed by the absorber structure. The voltage source powers the electrode to produce a modulated electrostatic field acting on the absorber to modulate the minimum gap distance. The electrostatic field includes a DC component to adjust the absorption efficiency, and an AC component that cyclically drives the absorber to negatively interfere with noise in the signal.

30. 发明授权

US09111787B2 Arrangement of two substrates having an SLID bond and method for producing such an arrangement 有权
标题翻译：具有SLID键的两个基板的布置以及用于制造这种布置的方法
公开(公告)号：US09111787B2
公开(公告)日：2015-08-18
申请号：US13133521
申请日：2009-10-19
申请人： Achim Trautmann , Ando Feyh
发明人： Achim Trautmann , Ando Feyh
IPC分类号： H01L21/58 , H01L23/10 , B81C1/00 , H01L21/447
CPC分类号： H01L23/10 , B81B2207/012 , B81C1/00269 , B81C2203/0109 , B81C2203/038 , H01L2924/0002 , H01L2924/1433 , H01L2924/00
摘要： An arrangement having a first and a second substrate is disclosed, wherein the two substrates are connected to one another by means of an SLID (Solid Liquid InterDiffusion) bond. The SLID bond exhibits a first metallic material and a second metallic material, wherein the SLID bond comprises the intermetallic Al/Sn-phase.
摘要翻译：公开了一种具有第一和第二基板的装置，其中两个基板通过SLID（固体液体互扩散）粘合而彼此连接。 SLID键显示第一金属材料和第二金属材料，其中SLID键包括金属间Al / Sn相。

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