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1. 发明申请

US20100003790A1 METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT HAVING A THIN-LAYER CAPPING 失效
标题翻译：用于制造具有薄层覆盖层的微机电组件的方法
公开(公告)号：US20100003790A1
公开(公告)日：2010-01-07
申请号：US12305150
申请日：2007-08-21
申请人： Silvia Kronmueller , Tino Fuchs , Ando Feyh , Christina Leinenbach , Marco Lammer
发明人： Silvia Kronmueller , Tino Fuchs , Ando Feyh , Christina Leinenbach , Marco Lammer
IPC分类号： H01L21/50
CPC分类号： B81C1/00333 , B81C2201/0115 , B81C2201/0132 , B81C2203/0136 , B81C2203/0145
摘要： A capping technology is provided in which, despite the fact that structures which are surrounded by a silicon-germanium filling layer are exposed using ClF3 etching through micropores in the silicon cap, an etching attack on the silicon cap is prevented, namely, either by particularly selective (approximately 10,000:1 or higher) adjustment of the etching process itself, or by using the finding that the oxide of a germanium-rich layer, in contrast to oxidized porous silicon, is not stable but instead may be easily dissolved, to protect the silicon cap.
摘要翻译：提供了一种封盖技术，尽管事实上，利用ClF3蚀刻通过硅盖中的微孔暴露由硅 - 锗填充层包围的结构，但是防止了对硅帽的蚀刻攻击，即特别地选择性（大约10,000:1或更高）调整蚀刻工艺本身，或通过使用与氧化多孔硅相反的富锗层的氧化物不稳定但可以容易地溶解的发现来保护硅帽。

2. 发明授权

US07851248B2 Method for producing a micromechanical component having a thin-layer capping 失效
标题翻译：具有薄层封盖的微机械部件的制造方法
公开(公告)号：US07851248B2
公开(公告)日：2010-12-14
申请号：US12305150
申请日：2007-08-21
申请人： Silvia Kronmueller , Tino Fuchs , Ando Feyh , Christina Leinenbach , Marco Lammer
发明人： Silvia Kronmueller , Tino Fuchs , Ando Feyh , Christina Leinenbach , Marco Lammer
IPC分类号： H01L21/00
CPC分类号： B81C1/00333 , B81C2201/0115 , B81C2201/0132 , B81C2203/0136 , B81C2203/0145
摘要： A capping technology is provided in which, despite the fact that structures which are surrounded by a silicon-germanium filling layer are exposed using ClF3 etching through micropores in the silicon cap, an etching attack on the silicon cap is prevented, namely, either by particularly selective (approximately 10,000:1 or higher) adjustment of the etching process itself, or by using the finding that the oxide of a germanium-rich layer, in contrast to oxidized porous silicon, is not stable but instead may be easily dissolved, to protect the silicon cap.
摘要翻译：提供了一种封盖技术，尽管事实上，利用ClF3蚀刻通过硅盖中的微孔暴露由硅 - 锗填充层包围的结构，但是防止了对硅帽的蚀刻攻击，即特别地选择性（大约10,000:1或更高）调整蚀刻工艺本身，或通过使用与氧化多孔硅相反的富锗层的氧化物不稳定但可以容易地溶解的发现来保护硅帽。

3. 发明授权

US08165324B2 Micromechanical component and method for its production 有权
标题翻译：微机械部件及其生产方法
公开(公告)号：US08165324B2
公开(公告)日：2012-04-24
申请号：US12227385
申请日：2007-04-02
申请人： Ando Feyh , Marco Lammer
发明人： Ando Feyh , Marco Lammer
IPC分类号： H04R25/00
CPC分类号： B81C1/00246 , B81B2201/0257 , B81C2203/0735 , H04R19/005 , H04R31/00 , H04R2410/00
摘要： A cost-effective technology for implementing a micromechanical component is provided, whose layer construction includes at least one diaphragm on the upper side and at least one counter-element, a hollow space being formed between the diaphragm and the counter-element, and the counter-element having at least one through hole to a back volume. This back volume is formed by a sealed additional hollow space underneath the counter-element and is connected to the upper-side of the layer construction by at least one pressure equalization opening. This component structure permits the integration of the micromechanical sensor functions and evaluation electronics on one chip and is additionally suitable for mass production.
摘要翻译：提供了一种用于实现微机械部件的成本有效的技术，其层结构包括在上侧上的至少一个隔膜和至少一个反元件，在隔膜和反元件之间形成的中空空间，以及计数器 - 具有至少一个通孔到后部体积的元件。该后体积由相对元件下方的密封的附加中空空间形成，并且通过至少一个压力平衡开口连接到层结构的上侧。该组件结构允许将微机械传感器功能和评估电子器件集成在一个芯片上，并且另外适合于批量生产。

4. 发明申请

US20090232334A1 Micromechanical Component and Method for its Production 有权
标题翻译：微机械组件及其生产方法
公开(公告)号：US20090232334A1
公开(公告)日：2009-09-17
申请号：US12227385
申请日：2007-04-02
申请人： Ando Feyh , Marco Lammer
发明人： Ando Feyh , Marco Lammer
IPC分类号： H04R11/04 , H04R31/00
CPC分类号： B81C1/00246 , B81B2201/0257 , B81C2203/0735 , H04R19/005 , H04R31/00 , H04R2410/00
摘要： A cost-effective technology for implementing a micromechanical component is provided, whose layer construction includes at least one diaphragm on the upper side and at least one counter-element, a hollow space being formed between the diaphragm and the counter-element, and the counter-element having at least one through hole to a back volume. This back volume is formed by a sealed additional hollow space underneath the counter-element and is connected to the upper-side of the layer construction by at least one pressure equalization opening. This component structure permits the integration of the micromechanical sensor functions and evaluation electronics on one chip and is additionally suitable for mass production.
摘要翻译：提供了一种用于实现微机械部件的成本有效的技术，其层结构包括在上侧上的至少一个隔膜和至少一个反元件，在隔膜和反元件之间形成的中空空间，以及计数器 - 具有至少一个通孔到后部体积的元件。该后体积由相对元件下方的密封的附加中空空间形成，并且通过至少一个压力平衡开口连接到层结构的上侧。该组件结构允许将微机械传感器功能和评估电子器件集成在一个芯片上，并且另外适合于批量生产。

5. 发明授权

US08791620B2 Micromechanical actuator having multiple joints 有权
标题翻译：具有多个接头的微机械致动器
公开(公告)号：US08791620B2
公开(公告)日：2014-07-29
申请号：US11983176
申请日：2007-11-06
申请人： Joachim Rudhard , Tjalf Pirk , Marco Lammer , Veronique Krueger
发明人： Joachim Rudhard , Tjalf Pirk , Marco Lammer , Veronique Krueger
IPC分类号： H02N1/00 , G02B26/12
CPC分类号： B81B3/004 , B81B2201/042 , G02B26/0841
摘要： A micromechanical actuator includes a shaft and at least a first driving mechanism. The shaft and the first driving mechanism are connected by a first joint.
摘要翻译：微机械致动器包括轴和至少第一驱动机构。轴和第一驱动机构通过第一接头连接。

6. 发明申请

US20080151342A1 Micromechanical actuator 有权
标题翻译：微机械执行器
公开(公告)号：US20080151342A1
公开(公告)日：2008-06-26
申请号：US11983176
申请日：2007-11-06
申请人： Joachim Rudhard , Tjalf Pirk , Marco Lammer , Veronique Krueger
发明人： Joachim Rudhard , Tjalf Pirk , Marco Lammer , Veronique Krueger
IPC分类号： G02B26/08 , G02B7/182
CPC分类号： B81B3/004 , B81B2201/042 , G02B26/0841
摘要： A micromechanical actuator includes a shaft and at least a first driving mechanism. The shaft and the first driving mechanism are connected by a first joint.
摘要翻译：微机械致动器包括轴和至少第一驱动机构。轴和第一驱动机构通过第一接头连接。

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